Abstract: An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the assembly. The assembly also includes a metallized particle interconnect (MPI) between the first electrical component and the second electrical component and solder components outside a boundary of the MPI and extending from the first electrical component to the second electrical component. The solder components are melted by applying heat to the assembly. The solder components are solidified by cooling the assembly and the compression tool is removed.

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming, at least in part, at least one tamper-detect network, such as one or more resistive networks. The circuit lines are disposed on at least one of the first side or the second side of the at least one flexible layer. At least one region of the tamper-respondent sensor is fabricated with increased susceptibility to damage from mechanical stress associated with a tamper event. The at least one region of increased susceptibility to damage facilitates detection of the tamper event by the tamper-respondent sensor.

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an enclosure, an in-situ-formed tamper-detect sensor, and one or more flexible tamper-detect sensors. The enclosure encloses, at least in part, one or more electronic components to be protected, and the in-situ-formed tamper-detect sensor is formed in place over an inner surface of the enclosure. The flexible tamper-detect sensor(s) is disposed over the in-situ-formed tamper-detect sensor, such that the in-situ-formed tamper-detect sensor is between the inner surface of the enclosure and the flexible tamper-detect sensor(s). Together the in-situ-formed tamper-detect sensor and flexible tamper-detect sensor(s) facilitate defining, at least in part, a secure volume about the one or more electronic components.

Abstract: A method and system are provided for implementing user configurable probing with magnetic connections and printed circuit board (PCB) features. A first magnet is located at a desired probe point on the PCB, a probe having a second magnet of suitable polarity and an electrical contact is moved to the probe point. The first and second magnets attract each other, and the probe point makes electrical contact with an electrical conductor at the probe point.

Abstract: Apparatus and methods to determine a change in atmospheric pressure between a forward portion of a flying object and a rear portion of the flying object based on at least one radio frequency (RF) return signal, and to determine a password using the determined change in atmospheric pressure.

Abstract: A computing system for tampering detection for digital images is disclosed. The computing system uses a LTI filter to filter time series data representing images in one or both of two videos and/or a still image of a live photo captured by a camera. A causal relationship in time existed between the images in the two videos and the still image when they were captured by the camera. The computing system determines whether the filtered output data representing an image by using the LTI filter is causal. If the computing system determines that the filtered output data representing the image is non-causal, it asserts a signal indicating that the image has been modified after it was captured.

Abstract: A circuit apparatus includes at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.

Abstract: A method and system are provided for implementing user configurable probing with magnetic connections and printed circuit board (PCB) features. A first magnet is located at a desired probe point on the PCB, a probe having a second magnet of suitable polarity and an electrical contact is moved to the probe point. The first and second magnets attract each other, and the probe point makes electrical contact with an electrical conductor at the probe point.

Abstract: A circuit apparatuses include at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.

Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.

Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.

Abstract: Embodiments herein describe RFID systems that include multiple RFID tag readers that each use a different frequency to communicate with an RFID tag. For example, each of the tag readers may transmit a tag query command using different modulated frequencies. In one embodiment, the RFID tag includes multiple receivers each tuned to one of the different frequencies generated by the tag readers. For example, one receiver in the tag is tuned to receive 200 MHz signals while another receiver is tuned to receive 900 MHz signals. To provide location information, the RFID tag compares power values associated with the received signals to determine which of the RFID tag readers is closest to the tag. The RFID tag conveys this location information to the tag readers by selecting one of the frequencies of the tag readers to use when generating a reply message.

Abstract: Embodiments of the present disclosure provide methods and apparatus for providing feed forward equalization to a communication line by providing a resistance and a capacitance to the communication line. The method includes determining the resistance based on a desired value of feed forward equalization to provide to a communication line, determining the capacitance based on the desired value of feed forward equalization to provide to the communication line, providing a layer of resistive material between a first conductor and a second conductor of the communication line, wherein a dimension of the layer of resistive material is determined based on the determined resistance and providing a layer of dielectric material between the first conductor and the second conductor, wherein a dimension of the layer of dielectric material is determined based on the determined capacitance.

Abstract: Embodiments herein describe RFID systems that include multiple RFID tag readers that each use a different frequency to communicate with an RFID tag. For example, each of the tag readers may transmit a tag query command using different modulated frequencies. In one embodiment, the RFID tag includes multiple receivers each tuned to one of the different frequencies generated by the tag readers. For example, one receiver in the tag is tuned to receive 200 MHz signals while another receiver is tuned to receive 900 MHz signals. To provide location information, the RFID tag compares power values associated with the received signals to determine which of the RFID tag readers is closest to the tag. The RFID tag conveys this location information to the tag readers by selecting one of the frequencies of the tag readers to use when generating a reply message.

Abstract: Embodiments herein describe RFID systems that include multiple RFID tag readers that each use a different frequency to communicate with an RFID tag. For example, each of the tag readers may transmit a tag query command using different modulated frequencies. In one embodiment, the RFID tag includes multiple receivers each tuned to one of the different frequencies generated by the tag readers. For example, one receiver in the tag is tuned to receive 200 MHz signals while another receiver is tuned to receive 900 MHz signals. To provide location information, the RFID tag compares power values associated with the received signals to determine which of the RFID tag readers is closest to the tag. The RFID tag conveys this location information to the tag readers by selecting one of the frequencies of the tag readers to use when generating a reply message.

Abstract: An optical electromagnetic radiation (EM) emitter and receiver are located upon a printed circuit board (PCB) layer and are connected to an optical security pathway. A predetermined reference flux is determined, the reference flux being the expected EM transmitted by the optical security pathway and received by the receiver. When the PCB is subject to an unauthorized access thereof (e.g., drilled, sawed, cut, etc.), the optical EM transferred by optical security pathway is altered. An optical monitoring device that monitors the flux of the optical EM received by the receiver detects a change in flux, in relation to the reference flux, and passes a tamper signal to one or more computer system devices to respond to the unauthorized access. For example, one or more cryptographic adapter card or computer system functions or secured crypto components may be disabled.

Abstract: The embodiments described herein relate to dynamically detecting landing gear deployment of an aerial vehicle. A set of flight measurements is dynamically generated and stored. The set of measurements may include altitude, distance to a destination, and airspeed. Each of these measurements is compared to a respective threshold value to produce a landing scenario indication. The comparison includes ascertaining that the vehicle is within a defined above ground level based on the altitude measurement, ascertaining that the vehicle is within a defined distance to a destination based on the distance to a destination measurement, and ascertaining that the airspeed measurement is below a maximum gear extension speed. The produced indication is converted into a landing gear protocol.

Abstract: Embodiments of the present disclosure provide methods and apparatus for providing feed forward equalization to a communication line by providing a resistance and a capacitance to the communication line. The method includes determining the resistance based on a desired value of feed forward equalization to provide to a communication line, determining the capacitance based on the desired value of feed forward equalization to provide to the communication line, providing a layer of resistive material between a first conductor and a second conductor of the communication line, wherein a dimension of the layer of resistive material is determined based on the determined resistance and providing a layer of dielectric material between the first conductor and the second conductor, wherein a dimension of the layer of dielectric material is determined based on the determined capacitance.

Abstract: Embodiments of the present disclosure provide methods and apparatus for providing feed forward equalization to a communication line by providing a resistance and a capacitance to the communication line. The method includes determining the resistance based on a desired value of feed forward equalization to provide to a communication line, determining the capacitance based on the desired value of feed forward equalization to provide to the communication line, providing a layer of resistive material between a first conductor and a second conductor of the communication line, wherein a dimension of the layer of resistive material is determined based on the determined resistance and providing a layer of dielectric material between the first conductor and the second conductor, wherein a dimension of the layer of dielectric material is determined based on the determined capacitance.

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure and a tamper-respondent electronic circuit structure. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner main surface, and an inner sidewall surface which has at least one inner-sidewall corner. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner sidewall surface of the electronic enclosure. The tamper-respondent sensor includes a flexible layer(s) with tamper-detect circuit lines and multiple slots provided therein. The multiple slots facilitate disposing the tamper-respondent sensor to cover the at least one inner-sidewall corner of the inner sidewall surface by allowing for one or more regions of overlap of the flexible layer(s) of the tamper-respondent sensor at the at least one inner-sidewall corner of the electronic enclosure.