Abstract: A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap.

Abstract: A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap.

Abstract: Systems and methods for forming an electrostatic MEMS switch include forming a cantilevered beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate.

Abstract: A method for activating a getter at low temperature for encapsulation in a device cavity containing a microdevice comprises etching a passivation layer off the getter material while the device wafer and lid wafer are enclosed in a bonding chamber. A plasma etching process may be used, wherein by applying a large negative voltage to the lid wafer, a plasma is formed in the low pressure environment within the bonding chamber. The plasma then etches the passivation layer from the getter material, which is directly thereafter sealed within the device cavity of the microdevice, all within the etching/bonding chamber.

Abstract: Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate.

Abstract: Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have a flexible shunt bar which has one end coupled to the deformable plate, and the other end coupled to a contact on the second substrate. Upon activating the switch, the deformable plate urges the shunt bar against a second contact formed in the second substrate, thereby closing the switch. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate.

Abstract: A MEMS switch device is made using a gold alloy as the switch contact material. The increased mechanical hardness of the alloy compared to the pure gold prevents the contacts of the switch from welding together. A scrubbing action which occurs when the switch closes may allow the contact surfaces to come to rest where their surfaces are complementary, thus resulting in higher contact area and low contact resistance, despite the higher sheet resistance of the gold alloy material relative to the pure gold material.

Abstract: A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap.

Abstract: A MEMS device is encapsulated in a carbon dioxide environment, which effectively insulates the MEMS device against arcing in high voltage applications. The carbon dioxide environment may have a pressure of between about 0.2 atm and about 4 atm. Carbon dioxide is shown to be more effective than other insulating gases such as sulfur hexafluoride in preventing arcing for applications having dimensions on the order of microns.

Abstract: A device and a method are described which hermetically seals at least one microstructure within a cavity. Electrical access to the at least one microstructure is provided by through wafer vias formed through a via substrate which supports the at least one microstructure on its front side. The via substrate and a lid wafer may form a hermetic cavity which encloses the at least one microstructure. The through wafer vias are connected to bond pads located outside the cavity by an interconnect structure formed on the back side of the via substrate. Because they are outside the cavity, the bond pads may be placed inside the perimeter of the bond line forming the cavity, thereby greatly reducing the area occupied by the device. The through wafer vias also shorten the circuit length between the microstructure and the interconnect, thus improving heat transfer and signal loss in the device.

Abstract: A micromechanical particle sorting chip uses an actuator divided into two parts to direct a component of interest into one of a plurality of possible exit paths, based on detection of a fluorescent signal emanating from the component of interest. The two-part actuator may include a force-generating portion and a microactuator portion. The microactuator portion may be disposable, whereas the force-generating portion may be reuseable. By bringing the force-generating portion into proximity to the microactuator portion, the microactuator is induced to move, thereby separating the component of interest from the rest of the fluid stream. The force-generating portion and the microactuator portion may be optimized and fabricated separately, thereby leading to faster, more reliable and less expensive particle sorting.

Abstract: A micromechanical particle sorting chip uses laser light directed through at least one of a reflective and refractive surface to come to a focus in an optically transparent layer. The laser light impinges on a particle of interest, causing it to fluoresce. Upon detecting the fluorescence, a micromemchanical actuator is activated, which directs the particle of interest into one of a plurality of possible exit paths.

Abstract: A teeter-totter apparatus uses a curved beam to generate a differential output which may be indicative of an acceleration applied to the apparatus. The curved-beam teeter-totter apparatus can be combined with an x-axis and y-axis accelerometer, to produce a tri-axis accelerometer which is sensitive to an acceleration applied in any direction. Damping plates may be added to the accelerometers to reduce unwanted motion.

Abstract: The invention describes a method and apparatus for deploying micromachined actuators in a plane which is orthogonal to the original fabrication plane of the devices. Using batch-processing, photolithographic procedures known in the micromachined electro-mechanical system (MEMS) art, a plurality of devices is constructed on a suitable substrate. The devices are then separated one from another by sawing and dicing the original fabrication wafer. The devices are rotated into an orthogonal orientation and affixed to a second wafer. The second wafer also contains circuitry for addressing and manipulating each of the devices independently of the others. With this method and apparatus, arrays of actuators are constructed whose plane of actuation is perpendicular to the plane of the array. This invention is useful for constructing N×M fiber optic switches, which direct light from N input fibers into M output fibers.

Abstract: An optical switch is fabricated using micro-electro-mechanical system (“MEMS”) techniques. A thin mirror is fabricated in the major plane of the substrate and rotates about an axis perpendicular to the major plane to move into and out of an optical beam path. The mirror surface is open for chemical polishing and deposition, resulting in a high-quality mirror. In one embodiment, the backside of the mirror is patterned with reinforcing ribs. In another embodiment, a two-sided mirror is fabricated.

Abstract: An optical cross-connect is fabricated on a substrate using individual MEMs dice with mirrors that rotate into and out of an optical beam path. Each die can be aligned to a single (input-output) pair of collimators in a fiber-optic switching system. An individually accessible magnetic drive on each die provides low power consumption when re-configuring the array in addition to fast switching speeds. The state of each die can be electronically sensed to verify proper array configuration and operation of each die.

Abstract: An optical cross-connect is fabricated on a substrate using individual MEMs dice with mirrors that rotate into and out of an optical beam path. Each die can be aligned to a single (input-output) pair of collimators in a fiber-optic switching system. An individually accessible magnetic drive on each die provides low power consumption when re-configuring the array in addition to fast switching speeds. The state of each die can be electronically sensed to verify proper array configuration and operation of each die.

Abstract: An optical switch is fabricated using micro-electro-mechanical system (“MEMS”) techniques. A thin mirror is fabricated in the major plane of the substrate and rotates about an axis perpendicular to the major plane to move into and out of an optical beam path. The mirror surface is open for chemical polishing and deposition, resulting in a high-quality mirror. In one embodiment, the backside of the mirror is patterned with reinforcing ribs. In another embodiment, a two-sided mirror is fabricated.

Abstract: The present invention is a method for bonding a lubricant onto the surface of rotating storage media. In particular, the method bonds reactive and non-reactive lubricants onto the carbon based protective coating of a magnetic storage disk. The lubricant is first applied onto the disk surface through conventional coating techniques, such as dipping, spinning, spraying, or vapor deposition. The thickness of the applied coating is thicker than the final bonded thickness of the lubricant. Typically, the applied thickness of the film is approximately 30 Angstroms. The lubricant coated disk surface is then exposed to low energy electron irradiation. The energy level of the accelerated electrons is below 100 eV. The lubricated film is exposed to a dosage level of approximately 1000 microcoulombs per square centimeter. This dosage level bonds approximately 15 Angstroms of lubricant to the disk surface. The non-bonded or excess lubricant is then rinsed off in a liquid freon or other suitable rinse.

Abstract: A dual mode warhead is provided for use against both soft and hard targets nd capable of sensing which type of target has been struck comprising a casing made of a ductile material containing an explosive charge and a fuze assembly. The ductile warhead casing will mushroom and later split upon striking a hard target while still confining the explosive. Proper ductility and confinement are necessary for fuze sensing. The fuze assembly contains a pair of parallel firing trains, one initiated only by high and one by low impact deceleration. The firing train actuated by low impact deceleration contains a pyrotechnic delay to allow penetration of soft targets.