Patents by Inventor John Tang

John Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7435664
    Abstract: An embodiment of the present invention is a technique to fabricate a package. A metal sheet having trenches is formed. A thinned wafer supported by a wafer support substrate (WSS) is formed. The metal sheet is bonded to the WSS-supported thinned wafer to form a metal bonded thinned wafer. The thinned wafer is diced to the trenches into die assemblies.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: October 14, 2008
    Assignee: Intel Corporation
    Inventors: Daoqiang Lu, John Tang
  • Publication number: 20080227393
    Abstract: Techniques that facilitate pairing of wireless devices with other wireless devices are disclosed. Once paired, the wireless devices can exchange data in a wireless manner. According to one embodiment, a pairing process can be secured through use of physical proximity, or even physical connection, of wireless devices to be paired. According to another embodiment, user actions to provoke or perform pairing can be reduced or eliminated. According to still another embodiment, a wireless device being paired can be configured using configuration information provided from another wireless device being paired.
    Type: Application
    Filed: March 14, 2007
    Publication date: September 18, 2008
    Inventors: John Tang, Evans Hankey, Emery A. Sanford
  • Patent number: 7405364
    Abstract: A device comprises a substrate core having power paths through it and an input/output signal routing layer upon the core substrate. An integrated circuit may be arranged on the routing layer such that the integrated circuit is electrically coupled to the substrate core through the routing layer.
    Type: Grant
    Filed: December 30, 2002
    Date of Patent: July 29, 2008
    Assignee: Intel Corporation
    Inventors: Rajendran Nair, John Tang
  • Publication number: 20080166968
    Abstract: The present invention is directed to apparatuses, systems, methods, and computer readable media that can facilitate the transfer of power between at least two electrical devices. At least one of the electrical devices is preferably a battery operated device. The present invention may also be used to facilitate the transfer of information among electrical devices. For example, the present invention may be used to automatically pair two Bluetooth devices together.
    Type: Application
    Filed: June 28, 2007
    Publication date: July 10, 2008
    Applicant: Apple Inc.
    Inventors: John Tang, Greg Christie, Jesse L. Dorogusker, Donald Novotney, Jeffrey Terlizzi, Terry Tikalsky, Christopher D. McKillop, Stanley Rabu
  • Publication number: 20080167087
    Abstract: A wireless communication headset having both wired and wireless modes is provided. The wireless headset can include a headset connector assembly that can be coupled to a cable connector of a cable, which can in turn be connected to a telephone. When the wireless headset is coupled to the telephone, it can advantageously be operable to exchange audio information with the telephone through the cable, receive electrical power from the telephone through the cable, or both. In addition, the cable connector can advantageously be coupled to the wireless headset without obstructing airflow to a microphone that is located in the headset connector assembly, through use of apparatus of the invention located on the cable connector, such as an acoustic tunnel, a microphone-speaker pair, or a microphone that is coupled to control circuitry operable to disable the microphone of the headset.
    Type: Application
    Filed: January 6, 2007
    Publication date: July 10, 2008
    Applicant: Apple Computer, Inc.
    Inventors: John Tang, Brett Alten
  • Publication number: 20080166005
    Abstract: A wireless headset device that includes an earbud assembly and a primary housing assembly, fixed to the earbud assembly, is provided. The earbud assembly can include an earbud flexible circuit board having mounted thereon a receiver and processing circuitry. The primary housing assembly can include a microphone and a primary housing flexible circuit board electrically coupled to the earbud circuit board and the microphone. In some embodiments, the headset device can include at least one flexible circuit board and the primary housing can include a connector assembly. The at least one flexible circuit board can be electrically coupled to the connector assembly and can include Universal Serial Bus (USB) circuitry operative to process USB protocol communications and serial circuitry operative to process serial protocol communications.
    Type: Application
    Filed: June 28, 2007
    Publication date: July 10, 2008
    Applicant: Apple Inc
    Inventors: Jeffrey J. Terlizzi, Emery A. Sanford, M. Evans Hankey, Terry Tikalsky, John Tang, Daniele De Iuliis, Peter Russell-Clark
  • Publication number: 20080102565
    Abstract: In one embodiment, the present invention includes a semiconductor package with lossy material inserts. The lossy material inserts may reduce electronic noise such as package resonance. Other embodiments are described and claimed.
    Type: Application
    Filed: September 28, 2006
    Publication date: May 1, 2008
    Inventors: Xiang Yin Zeng, Daoqiang (Daniel) Lu, Jiangqi He, Jiamiao (John) Tang
  • Publication number: 20080088937
    Abstract: A head mounted display system is disclosed. The head mounted display system includes a remote laser light engine that generates laser light associated with a display signal. The head mounted display system additionally includes a head mounted display apparatus that is separated from the laser light engine and comprising a display unit that displays laser images. The head mounted display system further includes an imaging device coupled between the remote laser light engine and the head mounted display apparatus. The imaging device creates laser images from the laser light transmitted through an optical cable in accordance with the display signal. The laser images are delivered to the display unit in order to create display images that can be viewed by a user of the head mounted display apparatus.
    Type: Application
    Filed: November 9, 2006
    Publication date: April 17, 2008
    Applicant: Apple Computer, Inc.
    Inventor: John Tang
  • Publication number: 20080085545
    Abstract: A composition is disclosed comprising virus in a formulation comprising a polyhydroxy hydrocarbon buffered to maintain a pH in a range from about 7 to about 8.5 at a temperature in the range from about 2° C. to 27° C. Methods for concentrating and purifying virus preparations are also disclosed.
    Type: Application
    Filed: October 24, 2007
    Publication date: April 10, 2008
    Applicant: Schering Corporation
    Inventors: Andreas Frei, Henry Kwan, Varda Sandweiss, Gary Vellekamp, Pui-Ho Yuen, Laureano Bondoc, Fredrick Porter, John Tang, Peter Ihnat
  • Publication number: 20080004961
    Abstract: A computer based method for connecting at least two cities in a cooperative marketing system includes establishing suppliers in at least one supplying city; establishing marketers in at least one marketing city; shipping goods from the suppliers to the marketers; marketing the goods by the marketers in the marketing city; and managing a flow of goods, an inventory of goods and a flow of payments by a city coop manager process operating on a computer system.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Inventor: Chihkai John Tang
  • Publication number: 20080003720
    Abstract: An embodiment of the present invention is a technique to fabricate a package. A metal sheet having trenches is formed. A thinned wafer supported by a wafer support substrate (WSS) is formed. The metal sheet is bonded to the WSS-supported thinned wafer to form a metal bonded thinned wafer. The thinned wafer is diced to the trenches into die assemblies.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Inventors: Daoqiang Lu, John Tang
  • Publication number: 20070158818
    Abstract: An article includes a top electrode that is embedded in a solder mask. An article includes a top electrode that is on a core structure. A process of forming the top electrode includes reducing the solder mask thickness and forming the top electrode on the reduced-thickness solder mask. A process of forming the top electrode includes forming the top electrode over a high-K dielectric that is in a patterned portion of the core structure.
    Type: Application
    Filed: December 30, 2005
    Publication date: July 12, 2007
    Inventors: John Tang, Xiang Zeng, Jiangqi He, Ding Hai
  • Publication number: 20070152312
    Abstract: Embodiments of the invention relate to the construction of a dual die package with a high-speed interconnect. A package is created having a first die on a first side of a base substrate and a second die on a second side of the base substrate in opposed relation to the first die. A first copper plated interconnect is plated to the base substrate. Second copper interconnects are formed to connect the first copper plated interconnect to the first and second dice, respectively, such that the first and second dice are interconnected.
    Type: Application
    Filed: December 29, 2005
    Publication date: July 5, 2007
    Inventors: John Tang, Xiang Zeng, Jiangqi He
  • Publication number: 20070132082
    Abstract: An embodiment of the present invention is a technique to construct a multi-die package. A stack of dice is formed from a base substrate in a package. The dice are positioned one on top of another and have copper plated segments for die interconnection. The dice are interconnected using copper plating to connect the copper plated segments.
    Type: Application
    Filed: December 12, 2005
    Publication date: June 14, 2007
    Inventors: John Tang, Henry Xu, Jianmin Li, Xiang Zeng
  • Patent number: 7183658
    Abstract: A low cost microelectronic circuit package includes a single build up metallization layer above a microelectronic die. At least one die is fixed within a package core using, for example, an encapsulation material. A single metallization layer is then built up over the die/core assembly. The metallization layer includes a number of landing pads having a pitch that allows the microelectronic device to be directly mounted to an external circuit board. In one embodiment, the metallization layer includes a number of signal landing pads within a peripheral region of the layer and at least one power landing pad and one ground landing pad toward a central region of the layer.
    Type: Grant
    Filed: September 5, 2001
    Date of Patent: February 27, 2007
    Assignee: Intel Corporation
    Inventors: Steven Towle, John Tang, John S. Cuendet, Henning Braunisch, Thomas S. Dory
  • Publication number: 20060284742
    Abstract: A system and method for detecting key actuation in a keyboard assembly, which, in one embodiment, is used as a conductor to electrically communicate with an information appliance. The rows in the keyboard assembly are electrically isolated from one another, and each row contains keys bridging a two-wire bus. Each key has a switch that is closed during key actuation, a diode to polarize the key, and a resistor to provide a resistive load when the switch is closed and the diode is biased with the current flow. Alternatively, each key has a switch that is closed during key actuation, a timer with an output that goes high after a predetermined time period, and a resistor that provides an identifying load when the switch is closed and the output of the timer is high. Other features of the invention include a linear matrix coupled to a row of keys to allow the row to be scanned by sections and individual keys, and a flexible circuit that provides the electrical pathways for the linear matrix.
    Type: Application
    Filed: July 31, 2006
    Publication date: December 21, 2006
    Inventors: Robert Olodort, John Tang, Randy Turchik
  • Patent number: 7084787
    Abstract: A system and method for detecting key actuation in a keyboard assembly, which, in one embodiment, is used as a conductor to electrically communicate with an information appliance. The rows in the keyboard assembly are electrically isolated from one another, and each row contains keys bridging a two-wire bus. Each key has a switch that is closed during key actuation, a diode to polarize the key, and a resistor to provide a resistive load when the switch is closed and the diode is biased with the current flow. Alternatively, each key has a switch that is closed during key actuation, a timer with an output that goes high after a predetermined time period, and a resistor that provides an identifying load when the switch is closed and the output of the timer is high. Other features of the invention include a linear matrix coupled to a row of keys to allow the row to be scanned by sections and individual keys, and a flexible circuit that provides the electrical pathways for the linear matrix.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: August 1, 2006
    Assignee: Think Outside, Inc.
    Inventors: Robert Olodort, John Tang, Randy Turchik
  • Publication number: 20060168550
    Abstract: A method, system and apparatus for creating and managing an activity in a collaborative environment. In a preferred aspect of the present invention, a unified activity manager for use in a collaborative environment can include an activity list including a hierarchical listing of activities. Each of the activities can include at least one task. The unified activity manager further can include an activity view including a rendering of properties associated with a selected activity in the activity view. Finally, the unified activity manager yet further can include a persons and roles view including at least a listing of collaborators available for association with the selected activity in the activity view.
    Type: Application
    Filed: January 21, 2005
    Publication date: July 27, 2006
    Applicant: International Business Machines Corporation
    Inventors: Michael Muller, Thomas Moran, Joann Ruvolo, Catalina Danis, Daniel Gruen, John Tang, Alex Cozzi, Andreas Dieberger, Stephen Farrell, Beverly Harrison, Wendy Kellogg, Suzanne Minassian, Paul Moody, Robert Stachel, Hui Su, Tianshu Wang, Qiang Zhang, Chen Zhao, Charles Hill, Sandra Kogan, Andrew Schirmer
  • Publication number: 20060167938
    Abstract: A method, system and apparatus for placeholder management in a unified activity manager in a collaborative computing environment. A method for managing placeholders in a unified activity manager in a collaborative environment can include the step of inserting a placeholder in an activity in lieu of a specified collaborator, resource, or event. The inserting step can include describing a type of resource without specifying an identity of an actual resource; and, inserting the described type in the placeholder. The inserting step also can include describing a type of event without specifying an identity of an actual event; and, inserting the described type in the placeholder. The inserting step also can include describing a type of collaborator without specifying an identity of an actual collaborator; and, inserting the described type in the placeholder.
    Type: Application
    Filed: January 21, 2005
    Publication date: July 27, 2006
    Applicant: International Business Machines Corporation
    Inventors: Michael Muller, Daniel Gruen, Thomas Moran, John Tang
  • Patent number: 7080169
    Abstract: A FIFO memory receives data transfer requests before data is stored in the FIFO memory. Multiple concurrent data transfers, delivered to the FIFO memory as interleaved multiple concurrent transactions, can be accommodated by the FIFO memory (i.e., multiplexing between different sources that transmit in distributed bursts). The transfer length requirements associated with the ongoing data transfers are tracked, along with the total available space in the FIFO memory. A programmable buffer zone also can be included in the FIFO memory for additional overflow protection and/or to enable dynamic sizing of FIFO depth.
    Type: Grant
    Filed: April 10, 2002
    Date of Patent: July 18, 2006
    Assignee: Emulex Design & Manufacturing Corporation
    Inventors: John Tang, Jean Xue, Karl M. Henson