Abstract: A composition is disclosed comprising virus in a formulation comprising a polyhydroxy hydrocarbon buffered to maintain a pH in a range from about 7 to about 8.5 at a temperature in the range from about 2° C. to 27° C. Methods for concentrating and purifying virus preparations are also disclosed.

Abstract: Animated indicators monitor the state of a software container and reflect the state of the container, potentially including information such as amount, type, and activity of the container. As the state of the container changes, an animation routine accordingly changes. Users are presented with up-to-date and detailed information about a container represented by a small graphic pictorial. Thus, the user receives a continuous supply of useful information about the container without having to specifically select and view the container as a full screen representation.

Abstract: A foldable keyboard having a plurality of folding keyboard sections. Each keyboard section includes a frame carrying a key set having a plurality of keys. The key set may be movable laterally relative to the frame. The frame with the key set is foldable with respect to an adjacent frame. The frame provides a self-contained enclosure for the keyboard assembly when fully closed. When opened, the keyboard assembly can be a full-size standard QWERTY keyboard.

Abstract: A composition is disclosed comprising virus in a formulation comprising a polyhydroxy hydrocarbon buffered to maintain a pH in a range from about 7 to about 8.5 at a temperature in the range from about 2° C. to 27° C. Methods for concentrating and purifying virus preparations are also disclosed.

Abstract: A foldable keyboard having a plurality of folding keyboard sections. Each keyboard section includes a frame carrying a key set having a plurality of keys. The key set may be movable laterally relative to the frame. The frame with the key set is foldable with respect to an adjacent frame. The frame provides a self-contained enclosure for the keyboard assembly when fully closed. When opened, the keyboard assembly can be a full-size standard QWERTY keyboard.

Abstract: A low cost technique for packaging microelectronic circuit chips fixes a die within an opening in a package core. At least one metallic build up layer is then formed on the die/core assembly and a grid array interposer unit is laminated to the build up layer. The grid array interposer unit can then be mounted within an external circuit using any of a plurality of mounting technologies (e.g., ball grid array (BGA), land grid array (LGA), pin grid array (PGA), surface mount technology (SMT), and/or others). In one embodiment, a single build up layer is formed on the die/core assembly before lamination of the interposer.

Abstract: A method and system for allowing a host device (e.g., server) to perform programmed direct accesses to peripheral memory (e.g., flash) located on a peripheral device (e.g., HBA), without the assistance of a microprocessor located on the peripheral device. In a preferred embodiment, new host registers are implemented within controller circuitry of the peripheral device, the host registers being configured to be recognized by host software executed by host. The host device reads and writes to the host registers, which causes appropriate controller hardware to access the peripheral nonvolatile memory accordingly. By creating and implementing the new host registers, an enhanced controller is created that allows a host device to directly access peripheral memory, without peripheral processor assistance.

Abstract: A digital processing device including a keyboard assembly and a display assembly coupled to the keyboard assembly. In one embodiment of the present invention, the keyboard assembly has a collapsed form and an opened form and the display assembly has a display width of at least 800 pixels. The keyboard assembly unfolds to form a full-size keyboard (e.g., in conformance with an ISO 9241-4:1998(E) standard) that allows a user to comfortably, quickly, and accurately “touch-type” in a manner that the user may be accustomed to.

Abstract: A foldable keyboard having a plurality of folding keyboard sections. Each keyboard section includes a frame carrying a key set having a plurality of keys. The key set may be movable laterally relative to the frame. The frame with the key set is foldable with respect to an adjacent frame. The frame provides a self-contained enclosure for the keyboard assembly when fully closed. When opened, the keyboard assembly can be a full-size standard QWERTY keyboard.

Abstract: According to one aspect of the invention, a electronic assembly is provided. The electronic assembly includes a motherboard, a first microelectronic die on a package substrate, a second microelectronic die, and a strip of flex tape interconnecting the microelectronic dies. The package substrate has a metal core with via openings, power conductors connecting a top and bottom surface of the substrate and passing through the via openings, and ground conductors interconnecting the metal core with the top and bottom surface of the package substrate. The flex tape has signal conductors which interconnect the microelectronic dies. Power is provided to the first microelectronic die via the power conductors. IO signals are sent between the microelectronic dies over the signal conductors in the flex tape.

Abstract: A digital processing device including a base, a display assembly, a hinge assembly, and a foldable keyboard is described. The hinge assembly enables the back of the display assembly to be rotated between a first configuration and a second configuration. In the first configuration, the user may interact with the device in a similar manner as a PDA. In the second configuration, the hinge assembly enables the unfolding of the keyboard assembly so that it is accessible to the user to enter information by typing and the display assembly is positioned for viewing of information. The keyboard assembly unfolds to form a full-size keyboard (e.g., conformance with an ISO 9241-4:1998(E) standard) that allows a user to comfortably, quickly, and accurately “touch-type” in a manner that the user may be accustomed to. The base may be rigid to enable use of the keyboard assembly on soft or uneven surfaces.

Abstract: A foldable keyboard having a plurality of folding keyboard sections. Each keyboard section includes a frame carrying a key set having a plurality of keys. The key set may be movable laterally relative to the frame. The frame with the key set is foldable with respect to an adjacent frame. The frame provides a self-contained enclosure for the keyboard assembly when fully closed. When opened, the keyboard assembly can be a full-size standard QWERTY keyboard.

Abstract: A foldable keyboard having a plurality of folding keyboard sections. Each keyboard section includes a frame carrying a key set having a plurality of keys. The key set may be movable laterally relative to the frame. The frame with the key set is foldable with respect to an adjacent frame. The frame provides a self-contained enclosure for the keyboard assembly when fully closed. When opened, the keyboard assembly can be a full-size standard QWERTY keyboard.

Abstract: A keyswitch is described that may include two legs interleaved together without a pivot point approximately central to the legs. The keyswitch may also include a spring to engage at least one of the bottom surfaces of the legs. In one configuration, the legs of the keyswitch may each have two lower protrusions on one of their ends and upper protrusions on their other ends with the lower protrusions of one leg disposed between the lower protrusions of the other leg. The keyswitch may also include a base having retaining clips with each of the lower protrusions of the legs pivotally engaged with a corresponding retaining clip. The keyswitch may also include a cap having tabs that may be pivotally coupled with corresponding slots in the upper protrusions of the legs.

Abstract: A device is disclosed. The device comprises a substrate core having power paths through it and an input/output signal routing layer upon the core substrate. An integrated circuit may be arranged on the routing layer such that the integrated circuit is electrically coupled to the substrate core through the routing layer.

Abstract: A foldable keyboard having a plurality of folding keyboard sections. Each keyboard section includes a frame carrying a key set having a plurality of keys. The key set may be movable laterally relative to the frame. The frame with the key set is foldable with respect to an adjacent frame. The frame provides a self-contained enclosure for the keyboard assembly when fully closed. When opened, the keyboard assembly can be a full-size standard QWERTY keyboard.

Abstract: A foldable keyboard assembly having a first keyboard section, a second keyboard section, a linkage assembly and a support plate. The linkage assembly, in one embodiment, enables the keyboard assembly to alternate between a folded and unfolded keyboard configuration. In an unfolded configuration, the keyboard assembly has first keyboard section and second keyboard section co-planar to form a full-size keyboard. The support plate aligns under the keyboard sections. In a folded configuration, first keyboard section, second keyboard section and support plate align on top of each other.

Abstract: A semiconductor device is provided that includes one or more ceramic material layers and one or more low dielectric constant (low-K) epoxy layers on top to be electrically coupled to an integrated circuit device, such as a chip die. The resulting ceramic/organic hybrid substrate takes advantage of the thin low-cost, low-K epoxy layer, by routing the dense circuitry from the chip die to the ceramic material layer. In addition, the use of low-K epoxy layer may reduce the number of ceramic material layers required to about three layers, thus significantly reducing the cost of the substrate. Low-K epoxy material layer may be laminated onto the ceramic material layer to reduce throughput time and cost. The ceramic/organic hybrid substrate may also take advantage of the properties of ceramic materials, which have a much more rigid structure than organic materials and a low CTE (coefficient of thermal expansion) that works well with ultra low-K chip dies.

Abstract: A spring coupled to a multi-layered flex membrane is described. In one embodiment, the spring may be a layer coupled to the top layer of a key switch membrane. In another embodiment, the spring may be coupled to the key switch between a top layer and a spacer layer. The spring or spring layer may increase the resiliency of the key switch membrane to prevent the flex membrane from deforming.