Patents by Inventor John U. Knickerbocker
John U. Knickerbocker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11766729Abstract: An improved molten solder injection head having a vacuum filter and differential gauge system is provided. In one aspect, an injection head is provided. The injection head includes: a reservoir; an injection port on a bottom of the injection head connected to the reservoir; a vacuum port adjacent to the injection port on the bottom of the injection head connected to a vacuum source; and a filter disposed between the bottom of the injection head and the vacuum source. A method for molten solder injection using the present injection head is provided.Type: GrantFiled: September 28, 2017Date of Patent: September 26, 2023Assignee: International Business Machines CorporationInventors: Jae-Woong Nah, John U. Knickerbocker, Eric P. Lewandowski
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Patent number: 11574835Abstract: A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.Type: GrantFiled: October 31, 2019Date of Patent: February 7, 2023Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker
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Patent number: 11539081Abstract: A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.Type: GrantFiled: February 25, 2020Date of Patent: December 27, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Qianwen Chen, Bing Dang, John U. Knickerbocker
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Patent number: 11539080Abstract: A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.Type: GrantFiled: February 11, 2020Date of Patent: December 27, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Qianwen Chen, Bing Dang, John U. Knickerbocker
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Patent number: 11424152Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.Type: GrantFiled: February 3, 2020Date of Patent: August 23, 2022Assignee: International Business Machines CorporationInventors: Paul S. Andry, Bing Dang, Jeffrey Donald Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Kang-I Tsang
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Patent number: 11411272Abstract: A micro-battery is provided in which a metallic sealing layer is used to provide a hermetic seal between an anode side of the micro-battery and the cathode side of the micro-battery. In accordance with the present application, the metallic sealing layer is formed around a perimeter of each metallic anode structure located on the anode side and then the metallic sealing layer is bonded to a solderable metal layer of a wall structure present on the cathode side. The wall structure contains a cavity that exposes a metallic current collector structure, the cavity is filled with battery materials.Type: GrantFiled: November 13, 2017Date of Patent: August 9, 2022Assignee: International Business Machines CorporationInventors: Paul S. Andry, Bing Dang, John U. Knickerbocker, Yang Liu, Jae-Woong Nah, Adinath Narasgond, Bucknell C. Webb
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Patent number: 11362382Abstract: A micro-battery is provided in which a metallic sealing layer is used to provide a hermetic seal between an anode side of the micro-battery and the cathode side of the micro-battery. In accordance with the present application, the metallic sealing layer is formed around a perimeter of each metallic anode structure located on the anode side and then the metallic sealing layer is bonded to a solderable metal layer of a wall structure present on the cathode side. The wall structure contains a cavity that exposes a metallic current collector structure, the cavity is filled with battery materials.Type: GrantFiled: January 26, 2017Date of Patent: June 14, 2022Assignee: International Business Machines CorporationInventors: Paul S. Andry, Bing Dang, John U. Knickerbocker, Yang Liu, Jae-Woong Nah, Adinath Narasgond, Bucknell C. Webb
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Patent number: 11348833Abstract: A support structure for use in fan-out wafer level packaging is provided that includes, a silicon handler wafer having a first surface and a second surface opposite the first surface, a release layer is located above the first surface of the silicon handler wafer, and a layer selected from the group consisting of an adhesive layer and a redistribution layer is located on a surface of the release layer. After building-up a fan-out wafer level package on the support structure, infrared radiation is employed to remove (via laser ablation) the release layer, and thus remove the silicon handler wafer from the fan-out wafer level package.Type: GrantFiled: November 25, 2019Date of Patent: May 31, 2022Assignee: International Business Machines CorporationInventors: Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker
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Patent number: 11268867Abstract: According to an embodiment of the present invention, a structure for a strain gauge device is provided. The structure comprises a layer of strain gauge material and one or more contact pads positioned directly on the layer of strain gauge material. The structure further comprises a multiplexer, measuring device, amplifier, analog to digital converter, microcontroller, and wireless adapter. According to the structure, the multiplexer selects a given contact pad pair of the one or more contact pad pairs, the measuring device measures signal generated by the layer of strain gauge material between the given contact pad pair, the amplifier amplifies the measured signal, the analog to digital converter converts the amplified analog signal to a digital signal, the microcontroller processes the digital signal, and the wireless adapter transmits the processed digital signal. In addition, the structure may further comprise a battery to provide energy to the structure.Type: GrantFiled: December 18, 2017Date of Patent: March 8, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John U. Knickerbocker, Minhua Lu, Katsuyuki Sakuma
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Patent number: 11201138Abstract: A method of manufacturing a multi-layer wafer is provided. Under bump metallization (UMB) pads are created on each of two heterogeneous wafers. A conductive means is applied above the UMB pads on at least one of the two heterogeneous wafers. The two heterogeneous wafers are low temperature bonded to adhere the UMB pads together via the conductive means. At least one stress compensating polymer layer may be applied to at least one of two heterogeneous wafers. The stress compensating polymer layer has a polymer composition of a molecular weight polymethylmethacrylate polymer at a level of 10-50% with added liquid multifunctional acrylates forming the remaining 50-90% of the polymer composition.Type: GrantFiled: December 17, 2019Date of Patent: December 14, 2021Assignee: International Business Machines CorporationInventors: Bing Dang, Li-Wen Hung, John U. Knickerbocker, Jae-Woong Nah
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Patent number: 11169399Abstract: Lenses and methods for adjusting the focus of a lens include dividing multiple light sensors in a lens into four quadrants. A position of the lens relative to occlusion along a top and bottom edge of the lens is determined based on numbers of bits in respective bit sequences from light sensors in respective regions of the lens. An optimal focal length for the lens is determined based on the position of the lens. The focal length of the lens is adjusted to match the optimal focal length.Type: GrantFiled: December 7, 2018Date of Patent: November 9, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Emily R. Kinser, John U. Knickerbocker, Roy R. Yu
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Patent number: 11121005Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.Type: GrantFiled: January 31, 2020Date of Patent: September 14, 2021Assignee: International Business Machines CorporationInventors: Paul S. Andry, Bing Dang, Jeffrey Donald Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang
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Patent number: 11055459Abstract: A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.Type: GrantFiled: June 6, 2019Date of Patent: July 6, 2021Assignee: International Business Machines CorporationInventors: Qianwen Chen, Li-Wen Hung, Wanki Kim, John U. Knickerbocker, Kenneth P. Rodbell, Robert L. Wisnieff
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Patent number: 11039765Abstract: A submersible sensor device configured as a small pellet for testing biological and other liquid samples is provided. In one aspect, a sensing device includes: a housing; and one or more sensors contained within the housing, wherein the housing hermetically seals the sensors such that the sensing device is fully submersible in a liquid analyte. A method and system for analysis of a liquid sample using the present sensing device are also provided.Type: GrantFiled: September 26, 2017Date of Patent: June 22, 2021Assignee: International Business Machines CorporationInventors: Vince Siu, Minhua Lu, Evan Colgan, Russell Budd, John U. Knickerbocker
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Patent number: 11000474Abstract: Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.Type: GrantFiled: December 22, 2017Date of Patent: May 11, 2021Assignee: International Business Machines CorporationInventors: S. Jay Chey, Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria, Lavanya Turlapati, Bucknell C. Webb, Steven L. Wright
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Patent number: 10998217Abstract: A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.Type: GrantFiled: February 20, 2018Date of Patent: May 4, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker
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Patent number: 10940265Abstract: A digital biomedical device includes a substrate forming a reservoir, a membrane comprising a first layer and a second layer having a strain therebetween, the membrane sealing the reservoir, and a controller configured to activate the membrane and release at least a portion of the strain causing the membrane curl and open the reservoir.Type: GrantFiled: June 9, 2019Date of Patent: March 9, 2021Assignee: International Business Machines CorporationInventors: Bing Dang, John U. Knickerbocker, Joana S. B. T. Maria, Bucknell C. Webb, Steven L. Wright
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Patent number: 10811305Abstract: A multi-layer wafer and method of manufacturing such wafer are provided. The method comprises applying a stress compensating oxide layer to each of two heterogeneous wafers, applying at least one bonding oxide layer to at least one of the two heterogeneous wafers, chemical-mechanical polishing the at least one bonding oxide layer, and low temperature bonding the two heterogeneous wafers to form a multi-layer wafer pair. The multi-layer wafer comprises two heterogeneous wafers, each of the heterogeneous wafers having a stress compensating oxide layer and at least one bonding oxide layer applied to at least one of the two heterogeneous wafers. The two heterogeneous wafers are low temperature bonded together to form the multi-layer wafer.Type: GrantFiled: September 22, 2016Date of Patent: October 20, 2020Assignee: International Business Machines CorporationInventors: Li-Wen Hung, John U. Knickerbocker, Leathen Shi, Cornelia Tsang Yang, Bucknell C. Webb
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Patent number: 10748877Abstract: Examples of techniques for an integrated wafer-level processing system are disclosed. In one example implementation according to aspects of the present disclosure, an integrated wafer-level processing system includes a memory wafer and a processing element connected to the memory wafer via a data connection.Type: GrantFiled: March 29, 2019Date of Patent: August 18, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Philip G. Emma, Hillery C. Hunter, John U. Knickerbocker
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Patent number: 10694950Abstract: Surface enhanced Raman spectroscopy is employed to obtain chemical data with respect to body tissue and cells. The chemical environments of stimulation implants and drug-delivery catheters are spectroscopically monitored in real time using an implantable probe. The probe includes a surface enhancer that facilitates surface enhanced Raman spectroscopy in opposing relation to an array of optical fibers. Light emitted by the optical fibers can be employed for chemical detection and/or tissue stimulation. Wavelength and optical power are selected based on whether the probe is employed for such detection or stimulation.Type: GrantFiled: October 13, 2016Date of Patent: June 30, 2020Assignee: International Business Machines CorporationInventors: Emily R. Kinser, John U. Knickerbocker, Roy R. Yu