Abstract: A method for making a film stack containing one or more silicon-containing layers and one or more metal-containing layers and a substrate processing system for forming the film stack on a substrate are provided. The substrate processing system includes one or more transfer chambers coupled to one or more load lock chambers and two or more different types of process chambers. The two or more types of process chambers are used to deposit the one or more silicon-containing layers and the one or more metal-containing layers in the same substrate processing system without breaking the vacuum, taking the substrate out of the substrate processing system to prevent surface contamination, oxidation, etc., such that additional cleaning or surface treatment steps can be eliminated. The substrate processing system is configured to provide high throughput and compact footprint for in-situ substrate processing and carry out different types of processes.

Abstract: A chemical mechanical polishing apparatus has a movable platen, a drive mechanism and a chucking mechanism. The drive mechanism is attached to the platen, is configured to support a generally linear polishing sheet with a portion of the polishing sheet extending over the platen, and is configured to incrementally advance the polishing sheet in a linear direction relative to the platen. The chucking mechanism is configured to intermittently secure the portion of the polishing sheet to the platen.

Abstract: A method for making a film stack containing one or more silicon-containing layers and one or more metal-containing layers and a substrate processing system for forming the film stack on a substrate are provided. The substrate processing system includes one or more transfer chambers coupled to one or more load lock chambers and two or more different types of process chambers. The two or more types of process chambers are used to deposit the one or more silicon-containing layers and the one or more metal-containing layers in the same substrate processing system without breaking the vacuum, taking the substrate out of the substrate processing system to prevent surface contamination, oxidation, etc., such that additional cleaning or surface treatment steps can be eliminated. The substrate processing system is configured to provide high throughput and compact footprint for in-situ substrate processing and carry out different types of processes.

Abstract: An activity center is provided that includes a case having an upper and lower shell hingedly joined together. The upper shell has a recessed portion disposed on a top surface that receives a writing surface that is hingedly joined to the top surface of the upper shell. The recessed portion is adapted to receive a paper or template including indicia between the top surface and the writing surface and the indicia on the paper or template is at least partially visible through the writing surface.

Abstract: Blue inks for displays are provided. In one aspect, the blue inks include one or more blue organic pigments, one or more monomers, one or more polymeric dispersants, and one or more organic solvents. In another aspect, the blue inks include one or more blue organic pigments, one or more violet pigments, one or more monomers, one or more polymeric dispersants, and one or more organic solvents. Methods of forming displays that include dispensing the blue inks by inkjetting onto a substrate and displays that include the blue inks are also provided.

Abstract: Green inks for displays are provided. In one aspect, the green inks include one or more green organic pigments, one or more monomers, one or more polymeric dispersants, and one or more organic solvents. In another aspect, the green inks include one or more green organic pigments, one or more yellow pigments, one or more monomers, one or more oligomers, one or more polymeric dispersants, and one or more organic solvents. Methods of forming displays that include dispensing the green inks by inkjetting onto a substrate and displays that include the green inks are also provided.

Abstract: Red inks for displays are provided. In one aspect, the red inks include one or more red organic pigments, one or more monomers, one or more polymeric dispersants, and one or more organic solvents. In another aspect, the red inks include one or more red organic pigments, one or more yellow pigments, one or more monomers, one or more oligomers, one or more polymeric dispersants, and one or more organic solvents. Methods of forming displays that include dispensing the red inks by inkjetting onto a substrate and displays that include the red inks are also provided.

Abstract: The present invention generally provides an apparatus and method for processing a surface of a substrate in physical vapor deposition (PVD) chamber that has an increased anode surface area to improve the deposition uniformity on large area substrates. In general, aspects of the present invention can be used for flat panel display processing, semiconductor processing, solar cell processing, or any other substrate processing. In one aspect, the processing chamber contains one or more anode assemblies that are used to increase and more evenly distribute the anode surface area throughout the processing region of the processing chamber. In one aspect, the anode assembly contains a conductive member and conductive member support. In one aspect, the processing chamber is adapted to allow the conductive member to be removed from the processing chamber without removing any major components from the processing chamber.

Abstract: The present invention generally provides an apparatus and method for processing a surface of a substrate in physical vapor deposition (PVD) chamber that has an increased anode surface area to improve the deposition uniformity on large area substrates. In general, aspects of the present invention can be used for flat panel display processing, semiconductor processing, solar cell processing, or any other substrate processing. In one aspect, the processing chamber contains one or more adjustable anode assemblies that are used to increase and more evenly distribute the anode surface area throughout the processing region of the processing chamber. In one aspect, the one or more adjustable anode assemblies are adapted to exchange deposited on anode surfaces with new, un-deposited on, anode surfaces without breaking vacuum.

Abstract: The present invention generally provides an apparatus and method for processing a surface of a substrate in physical vapor deposition (PVD) chamber that has an increased anode surface area to improve the deposition uniformity on large area substrates. In general, aspects of the present invention can be used for flat panel display processing, semiconductor processing, solar cell processing, or any other substrate processing. In one aspect, the processing chamber contains one or more anode assemblies that are used to increase and more evenly distribute the anode surface area throughout the processing region of the processing chamber. In one aspect, the anode assembly contains a conductive member and conductive member support. In one aspect, the processing chamber is adapted to allow the conductive member to be removed from the processing chamber without removing any major components from the processing chamber.

Abstract: All optical clock recovery includes a transmitter for generating an optical timing signal. The transmitter includes a semiconductor laser for the production of a dynamically synchronizable timing signal, the laser having an external resonator for feedback of the timing signal to the laser, the feedback having a delay time greater than a relaxation oscillation time for the laser, and the laser outputting an optical timing signal having a characteristic dynamic. The transmitter supplies the optical timing signal to a receiver configured to receive the timing signal and to synchronize to the laser on receipt of the timing signal, such that the receiver outputs a recovered timing signal having the characteristic dynamic.

Abstract: A system for inkjet printing, which includes an inkjet printing module support having one or more inkjet heads disposed thereon. The one or more inkjet heads are configured to move along a first axis. The system further includes a substrate stage configured to move along a second axis that is perpendicular to the first axis. The substrate stage is configured to support a substrate having one or more ink landing positions disposed thereon in a pattern that is not aligned with either the first axis or the second axis. The system further includes a system controller configured to simultaneously move the one or more inkjet heads along the first axis and move the substrate stage along the second axis during a printing operation such that the one or more inkjet heads dispense ink into the ink landing positions.

Abstract: Embodiments of the present invention are directed to a process for forming small diameter vias at low temperatures. In preferred embodiments, through-substrate vias are fabricated by forming a through-substrate via; and depositing conductive material into the via by means of a flowing solution plating technique, wherein the conductive material releases a gas that pushes the conductive material through the via to facilitate plating the via with the conductive material. In preferred embodiments, the fabrication of the substrate is conducted at low temperatures.

Abstract: In a sputtering target assembly comprising a plurality of tiles bonded to a target backing plate with gaps formed between the tiles, centering mechanisms for aligning and centering each of the tiles to the backing plate. The centering mechanism for each tiles can comprise a two or three grooves formed in the backing plate along axes intersecting near the tile center and slidably accommodating corresponding pins extending from the tile. Alternately, a pin and groove can be combined with another tile pin and a circular hole in the backing plate near the tile center.

Abstract: Embodiments of a substrate handling system are provided herein. In one embodiment apparatus for handling a substrate includes a conveyor having a plurality of rollers arranged to convey a substrate thereon and a substrate handler. The substrate handler includes a first bracket and a first plurality of fingers extending horizontally from the first bracket. The first plurality of fingers has a substrate support surface and is disposed between adjacent ones of the plurality of rollers. The substrate handler is movable between an idle position having the first plurality of fingers disposed beneath a support elevation of the plurality of rollers, and a transfer position having the first plurality of fingers disposed above the plurality of rollers.

Abstract: Embodiments of a vacuum conveyor system are provided herein. In one embodiment a vacuum conveyor system includes a first vacuum sleeve having a plurality of rollers that support and move substrates through the first vacuum sleeve. A port is provided for sealably coupling the first vacuum sleeve to a process chamber. A first substrate handler is disposed proximate the port. Multiple ports may be provided for sealably coupling the first vacuum sleeve to a plurality of process chambers. A dedicated substrate handler is provided for each process chamber. A second vacuum sleeve may be sealably coupled to an opposing side of the process chambers. The vacuum conveyor system may be modular with independent modules linked via load lock chambers. The plurality of rollers may compensate for any sag of the leading edge of a substrate being transported thereupon.

Abstract: Embodiments of a vacuum conveyor system are provided herein. In one embodiment, apparatus for conveying a substrate includes a vacuum sleeve and a plurality of rollers disposed within the vacuum sleeve for supporting and transporting the substrate thereupon. The plurality of rollers is adapted to simultaneously support the substrate thereupon at a plurality of elevations. A leading edge of the substrate is supported at an elevation above an adjacent one of the plurality of rollers in the direction of travel.

Abstract: This invention relates to devices and instruments for implant insertion through a posterior lateral opening to the disc space. The instruments include an implant inserter, and the devices include a spinal fusion implant engageable by the implant inserter. The implant provides bilateral support of the adjacent vertebrae when inserted into the disc space from a postero-lateral approach.

Abstract: A method and apparatus for sealing a puncture or incision formed percutaneously in tissue separating two internal portions of the body of a living being with an anchor, a sealing plug and a filament connecting the anchor and sealing plug. The method and apparatus provide for disengagable automatic tamping and/or cinching of the sealing plug when the apparatus is withdrawn from the puncture site. The disengagable automatic tamping and/or cinching is facilitated by transducing a motive force generated by the withdrawal of the apparatus into a tamping and/or cinching force.