Abstract: Disclosed are a multilayer ceramic condenser and a method of manufacturing the same. The method includes printing a plurality of stripe-type inner electrode patterns in parallel on ceramic green sheets; forming a laminate by staking the ceramic green sheets having the plurality of stripe-type inner electrode patterns printed thereon; cutting the laminate in order to have a structure in which first and second inner electrode patterns are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the sides of the laminate to which the first and second inner electrode patterns are exposed.

Abstract: A flexible device includes a first conductive pattern, a second conductive pattern, and a dielectric layer. The first conductive pattern includes a first sliding contact portion and a first extension portion. The second conductive pattern includes a second sliding contact portion overlapping with the first sliding contact portion and the second conductive pattern includes a second extension portion. The second sliding contact portion is in contact with the first sliding contact portion and is movable on the first sliding contact portion for a sliding motion. The first and second conductive patterns are embedded in the dielectric layer.

Abstract: A multi chip package includes a protective layer having an upper surface that surrounds a first chip and a second chip, which are mounted over a first substrate, to expose an upper surface of the first chip and an upper surface of the second chip, a heat spreader disposed over the upper surfaces, and a thermal interface material disposed at an interface between the heat spreader and the upper surfaces.

Abstract: The present invention relates to a composition that acts prior to the action of a tooth whitening composition or tooth whitening patch, the composition containing an oral cavity stimulation alleviating component able to reduce stimulation by the tooth whitening composition or patch. The present invention also relates to a tooth whitening kit whereby oral cavity stimulation is alleviated. The composition that acts prior to the action of a tooth whitening composition or patch of the present invention provides an outstanding tooth whitening effect while alleviating pain by mitigating intra-oral stimulation brought about by the rapid action of a tooth whitening component due to a tooth whitening component active agent.

Abstract: An electronic device is provided, which includes a touch sensor configured to sense a touch input to a screen, a storage configured to store different firmware corresponding to a plurality of input modes supported by the touch sensor, and a controller configured to sense the touch input according to a selected input mode among the plurality of input modes, through execution of one of the different firmware corresponding to the selected input mode.

Abstract: A semiconductor chip includes a semiconductor substrate having a front surface, a circuit unit formed within the semiconductor substrate and extending from the front surface into the semiconductor substrate, and a rear surface opposite the front surface, and a girder beam disposed outside of the circuit unit and within the semiconductor substrate.

Abstract: Systems and methods to detect, quantify, and control process-induced asymmetric signatures using patterned wafer geometry measurements are disclosed. The system may include a geometry measurement tool configured to obtain a first set of wafer geometry measurements of the wafer prior to the wafer undergoing a fabrication process and to obtain a second set of wafer geometry measurements of the wafer after the fabrication process. The system may also include a processor in communication with the geometry measurement tool. The processor may be configured to: calculate a geometry-change map based on the first set of wafer geometry measurements and the second set of wafer geometry measurements; analyze the geometry-change map to detect an asymmetric component induced to wafer geometry by the fabrication process; and estimate an asymmetric overlay error induced by the fabrication process based on the asymmetric component detected in wafer geometry.

Abstract: Provided is a forced evaporative humidifier using nano-vapor, which includes: a housing having an exhaust port formed in an upper surface thereof and a suction port formed at one side of a front surface thereof; a water tank located below the suction port to store water; an injection unit having an injection nozzle located above the suction port, a pump for pulling up the water in the water tank to the injection nozzle, and a transfer tube for transferring the water pulled by the pump; a blowing fan located above the injection nozzle to carry air toward the exhaust port of the housing; a humidifying unit located below the injection nozzle so that films, each having a body surface formed to allow the water injected from the injection nozzle to flow and a plurality of tube-type spacers protruding on the body surface, are stacked in a lateral direction therein; and an eliminator located between the blowing fan and the injection nozzle to prevent water drops included in a humid air humidified by the humidifying u

Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip disposed to overlap with a portion of the first semiconductor chip and connected to the first semiconductor chip through first coupling structures. The semiconductor package may include an interposer disposed to overlap with another portion of the first semiconductor chip and may be connected to the first semiconductor chip through second coupling structures. A first surface of the interposer may face the first semiconductor chip, and the interposer may include second internal interconnectors extending from the second coupling structures on the first surface to a second surface of the interposer opposite to the first face. External interconnectors may be disposed on the second surface of the interposer and are connected to the second internal interconnectors.

Abstract: A semiconductor package includes an interposer, first and second semiconductor chips horizontally arranged over a first surface of the interposer, the second semiconductor chip being adjacent to the first semiconductor chip, and a thermal expansion reinforcing pattern disposed over a second surface of the interposer.

Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip disposed to overlap with a portion of the first semiconductor chip and connected to the first semiconductor chip through first coupling structures. The semiconductor package may include an interposer disposed to overlap with another portion of the first semiconductor chip and may be connected to the first semiconductor chip through second coupling structures. A first surface of the interposer may face the first semiconductor chip, and the interposer may include second internal interconnectors extending from the second coupling structures on the first surface to a second surface of the interposer opposite to the first face. External interconnectors may be disposed on the second surface of the interposer and are connected to the second internal interconnectors.

Abstract: The present invention relates to a composition that acts prior to the action of a tooth whitening composition or tooth whitening patch, the composition containing an oral cavity stimulation alleviating component able to reduce stimulation by the tooth whitening composition or patch. The present invention also relates to a tooth whitening kit whereby oral cavity stimulation is alleviated. The composition that acts prior to the action of a tooth whitening composition or patch of the present invention provides an outstanding tooth whitening effect while alleviating pain by mitigating intra-oral stimulation brought about by the rapid action of a tooth whitening component due to a tooth whitening component active agent.

Abstract: A flexible stack package includes a first package and a second package. Each of the first and second packages includes a flexible layer, a chip embedded in the flexible layer, and a contact portion disposed on the chip to penetrate the flexible layer and exposed at a surface of the flexible layer. Each of the first and second packages includes a fixing portion and a wing portion. A first adhesion part is disposed between the fixing portion of the first package and the fixing portion of the second package to combine the first package with the second package. A first stretchable interconnector electrically connects or couples the contact portion of the first package to the contact portion of the second package.

Abstract: A multilayer ceramic electronic component includes a ceramic body having a plurality of dielectric layers and internal electrodes having lead portions narrower than capacitance portions, the first and second external electrodes and dummy electrodes, wherein the first and second external electrodes disposed on both end surfaces of the ceramic body in the length direction, to be connected to the first and second lead portions, respectively, and dummy electrodes disposed on positions of margin portions of the dielectric layers corresponding to the first and second lead portions, to be spaced apart from the first and second internal electrodes, in a width direction of the ceramic body.

Abstract: A semiconductor package may include a first semiconductor chip, second semiconductor chips disposed to respectively overlap with portions of the first semiconductor chip, a interposer disposed to overlap with a portion of the first semiconductor chip, and a package substrate disposed on backside surfaces of the second semiconductor chips opposite to the first semiconductor chip. The interposer may be disposed between the first semiconductor chip and the package substrate. First conductive coupling members connect the first semiconductor chip to the second semiconductor chips. Second conductive coupling members connect the first semiconductor chip to the interposer. Third conductive coupling members connect the interposer to the package substrate.

Abstract: The disclosure relates to a semiconductor chip and a stacked type semiconductor package having the same. The semiconductor chip includes: a semiconductor chip body having a first surface formed with a plurality of bonding pads and a second surface which is opposite to the first surface, a plurality of first and second through electrodes that pass through the semiconductor chip body and one ends thereof are electrically connected to the bonding pads, an insulating layer formed over the second surface of the semiconductor chip body such that the other ends of the first and second through electrodes are not covered by the insulating layer, and a first heat spreading layer formed over the insulating layer.

Abstract: Disclosed is a method for manufacturing a semiconductor device, including: forming a first material layer including holes exposing a part of an ion injection target layer on the ion injection target layer; forming gap filling layers having a smaller height than that of the holes inside the holes; forming a second material layer on the gap filling layers and the first material layer; forming ion injection mask patterns exposing the gap filling layer by removing the second material layer formed on the gap filling layer in the second material layer; exposing a part of the ion injection target layer through inner portions of the holes by removing the exposed gap filling layer; and performing an ion injection process on the exposed ion injection target layer.

Abstract: Stack packages are provided. The stack package includes a first chip configured to include a first chip body having a top surface and a bottom surface, first through electrodes penetrating the first chip body, and an insulation layer disposed on the bottom surface of the first chip body, and first bumps disposed on the top surface of the first chip body, and a second chip configured to include a second chip body having a top surface and a bottom surface, and second bumps disposed on the top surface of the second chip body. The first and second chips are vertically stacked such that the top surface of the second chip body is directly attached to the first insulation layer and the second bumps of the second chip penetrate the first insulation layer of the first chip to pierce the first through electrodes of the first chip.

Abstract: The present invention relates to a polyene polarizer having an order parameter (S) of about 0.9-1 inclusive and a transmittance of about 43-100% inclusive, a method for manufacturing a polyene polarizer, which can stably produce a thin polyene polarizer having a high transmittance, a high degree of polarization and a high order parameter (S) value, and a polarizing plate and an optical display device each comprising the polyene polarizer.

Abstract: A semiconductor package includes a first transceiver disposed on a top surface of a substrate; and a second transceiver disposed on a bottom surface of the substrate. The first and second transceivers optically communicate with each other through optical signals that permeate the substrate.