Patents by Inventor Jong Hoon Kim

Jong Hoon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DISPLAY PANEL
    Publication number: 20200301197
    Abstract: A display panel includes a first substrate which includes a display device and a second substrate which is disposed on the first substrate. The second substrate covers a base layer, a color filter layer, a first sealing layer, a color control layer, a step compensating layer, and a second sealing layer. The base layer includes a display area and a non-display area adjacent to the display area. The color filter layer overlaps the display area in a plan view, and is disposed under the base layer. The first sealing layer covers the color filter layer. The color control layer overlaps the display area in the plan view, and is disposed under the first sealing layer. The step compensating layer overlaps the non-display area in the plan view, and is disposed under the base layer. The second sealing layer covers the color control layer and the step compensating layer.
    Type: Application
    Filed: February 12, 2020
    Publication date: September 24, 2020
    Inventors: Jeongki KIM, Jang-Il KIM, Jong-Hoon KIM, YeoGeon YOON, Seok-Joon HONG
  • COMPOSITION FOR PREVENTING OR TREATING LIVER FIBROSIS, CONTAINING EXOSOME OR EXOSOME-DERIVED RIBONUCLEIC ACID
    Publication number: 20200283763
    Abstract: The present invention relates to a composition or cell therapeutic agent for preventing or treating liver fibrosis, containing an exosome or exosome-derived ribonucleic acid. The exosome or ribonucleic acid derived therefrom, of the present invention, has effects of inhibiting activities of hepatic stellate cells and Kupffer cells and reducing the expression of ?-SMA and inhibits the progression of liver fibrosis by inhibiting the deposition of collagen, thereby being effectively usable as a cell therapeutic agent for the prevention or treatment of liver fibrosis.
    Type: Application
    Filed: September 8, 2017
    Publication date: September 10, 2020
    Applicant: Korea University Research and Business Foundation
    Inventors: Jae Sang HONG, Do Hoon LEE, Yu Jin JANG, Jong Hoon KIM, Young Sik LEE
  • Liquid-crystal display device and method of manufacturing the same
    Patent number: 10768471
    Abstract: A liquid-crystal display device and a method of manufacturing a liquid-crystal display device. The liquid-crystal display device has a display area and a non-display area surrounding the display area defined therein, and the device includes: a first substrate; a second substrate disposed above the first substrate; and a liquid-crystal layer interposed between the first substrate and the second substrate. The first substrate includes a first base substrate, a first wavelength band filter disposed on the first base substrate in the non-display area, and a second wavelength band filter disposed on the first base substrate in the display area.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: September 8, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jeong Ki Kim, Jea Heon Ahn, Jang Il Kim, Jong Hoon Kim, Cheon Jae Maeng
  • Oral composition for tooth whitening product, and kit comprising same
    Patent number: 10758469
    Abstract: The present invention relates to a composition that acts prior to the action of a tooth whitening composition or tooth whitening patch, the composition containing an oral cavity stimulation alleviating component able to reduce stimulation by the tooth whitening composition or patch. The present invention also relates to a tooth whitening kit whereby oral cavity stimulation is alleviated. The composition that acts prior to the action of a tooth whitening composition or patch of the present invention provides an outstanding tooth whitening effect while alleviating pain by mitigating intra-oral stimulation brought about by the rapid action of a tooth whitening component due to a tooth whitening component active agent.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: September 1, 2020
    Assignee: LG HOUSEHOLD & HEALTH CARE LTD.
    Inventors: Jong-Hoon Kim, Jae-Hyun Ahn, Ji-Hye Kim, In-Ho Lee, Seong-Eun Bang
  • SEMICONDUCTOR PACKAGE INCLUDING A BRIDGE DIE
    Publication number: 20200273801
    Abstract: A semiconductor package includes an outer redistributed line (RDL) structure, a first semiconductor chip disposed on the outer RDL structure, a stack module stacked on the first semiconductor chip, and a bridge die stacked on the outer RDL structure. A portion of the stack module laterally protrudes from a side surface of the first semiconductor chip. The bridge die supports the protruding portion of the stack module. The stack module includes an inner RDL structure, a second semiconductor chip disposed on the inner RDL structure, a capacitor die disposed on the inner RDL structure, and an inner encapsulant. The capacitor die acts as a decoupling capacitor of the second semiconductor chip.
    Type: Application
    Filed: February 11, 2020
    Publication date: August 27, 2020
    Applicant: SK hynix Inc.
    Inventors: Jong Hoon KIM, Ki Jun SUNG, Ki Bum KIM
  • DISPLAY PANEL
    Publication number: 20200273929
    Abstract: A display panel includes an upper display substrate, a lower display substrate, and a partition wall. The upper display substrate includes a display area and a non-display area adjacent to the display area. The display area includes pixel areas and a light blocking area adjacent to the pixel areas. The lower display substrate includes display elements configured to emit light having a first color and respectively overlapping the pixel areas. The partition wall includes a partition wall part overlapping the light blocking area and a reflection part disposed on the partition wall part. The upper display substrate includes a base substrate, a color filter layer disposed on the base substrate, and a light control layer disposed on the color filter layer. The light control layer is configured to control the light having the first color. The partition wall is disposed on the light control layer.
    Type: Application
    Filed: January 14, 2020
    Publication date: August 27, 2020
    Inventors: Jeongki KIM, Jang-II KIM, Jong-Hoon KIM, YeoGeon YOON, Myoungjong LEE
  • SYSTEM-IN-PACKAGES INCLUDING A BRIDGE DIE
    Publication number: 20200273799
    Abstract: A system-in-package includes a redistributed line (RDL) structure, a first semiconductor chip, a second semiconductor chip, a second sub-package, a first bridge die, and a second bridge die. The RDL structure includes a first RDL pattern to which a first chip pad of the first semiconductor chip is electrically connected. The second semiconductor is stacked on the first semiconductor chip such that the second semiconductor chip protrudes past a side surface of the first semiconductor chip, wherein a second chip pad disposed on the protrusion of the second semiconductor chip is electrically connected to the first RDL pattern through the first bridge die. The second bridge die is disposed to electrically connect the second sub-package to the first semiconductor chip.
    Type: Application
    Filed: October 28, 2019
    Publication date: August 27, 2020
    Applicant: SK hynix Inc.
    Inventors: Ki Jun SUNG, Jong Hoon KIM, Jae Min KIM
  • SYSTEM-IN-PACKAGES INCLUDING A BRIDGE DIE
    Publication number: 20200273800
    Abstract: A system-in-package includes a redistributed line (RDL) structure, a first semiconductor chip, a second semiconductor chip, and a bridge die. The RDL structure includes a first RDL pattern to which a first chip pad of the first semiconductor chip is electrically connected. The second semiconductor chip is stacked on the first semiconductor chip such that the second semiconductor chip protrudes past a side surface of the first semiconductor chip, wherein a second chip pad disposed on the protrusion is electrically connected to the first RDL pattern through the bridge die.
    Type: Application
    Filed: October 28, 2019
    Publication date: August 27, 2020
    Applicant: SK hynix Inc.
    Inventors: Jong Hoon KIM, Ki Jun SUNG, Ki Bum KIM
  • LIGHT CONVERSION SUBSTRATE, DISPLAY DEVICE, AND METHOD OF MANUFACTURING DISPLAY DEVICE
    Publication number: 20200266243
    Abstract: A light conversion substrate includes a first substrate having a first region, a second region, and a third region. A first light conversion pattern is disposed on the first region and includes first wavelength conversion particles. A second light conversion pattern is disposed on the second region and is spaced apart from the first light conversion pattern and includes second wavelength conversion particles. A first scattering pattern is disposed on the third region to fill a space between the first light conversion pattern and the second light conversion pattern and includes first scattering particles. The first scattering pattern overlaps a portion of the first light conversion pattern and a portion of the second light conversion pattern in a direction of the thickness of the first substrate.
    Type: Application
    Filed: November 8, 2019
    Publication date: August 20, 2020
    Inventors: JANG IL KIM, Jeong Ki Kim, Jong Hoon Kim, Jea Heon Ahn, Myoung Jong Lee, Seok Joon Hong
  • DISPLAY DEVICE
    Publication number: 20200266253
    Abstract: A display device that includes a plurality of pixels arranged in a row direction and a column direction crossing the row direction. The display device includes a first substrate including light-emitting elements each disposed in the respective pixels. A second substrate faces the first substrate. A plurality of optical patterns are disposed on the second substrate in pixel columns, respectively, and extend along the column direction. Light-blocking patterns are disposed on the second substrate. The light-blocking patterns include a main light-blocking pattern extending along pixel column boundaries and fill spaces between adjacent optical patterns, and a subsidiary light-blocking pattern disposed on the optical patterns at pixel row boundaries and having a thickness smaller than a thickness of the main light-blocking pattern.
    Type: Application
    Filed: November 27, 2019
    Publication date: August 20, 2020
    Inventors: JANG IL KIM, Jeong Ki Kim, Jong Hoon Kim, Jea Heon Ahn, Myoung Jong Lee, Seok Joon Hong
  • SEMICONDUCTOR PACKAGES INCLUDING BRIDGE DIE
    Publication number: 20200243422
    Abstract: A semiconductor package includes a first semiconductor die and a stack of second semiconductor dies disposed on a package substrate. The semiconductor package further includes a first bridge die having first through vias that electrically connect the first semiconductor die to the package substrate, a second bridge die having second through vias that electrically connect the stack of the second semiconductor dies to the package substrate, and a third semiconductor die disposed to overlap with the first semiconductor die and the stack of the second semiconductor dies. Moreover, the semiconductor package further includes redistribution lines electrically connecting the third semiconductor die to the second bridge die.
    Type: Application
    Filed: August 20, 2019
    Publication date: July 30, 2020
    Applicant: SK hynix Inc.
    Inventors: Jong Hoon KIM, Ki Bum KIM, Bok Kyu CHOI
  • Patch for tooth attachment able to be removed by tooth brushing
    Patent number: 10722433
    Abstract: The present invention provides a patch for attaching to teeth or a surrounding part of teeth, and the patch can be easily removed by tooth brushing alone.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: July 28, 2020
    Assignee: LG Household & Health Care Ltd.
    Inventors: Jong-Hoon Kim, Jae-Hyun Ahn, Kwang-Ho Oh, In-Ho Lee, Woo-Sun Shim
  • CAPACITOR COMPONENT AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200161052
    Abstract: A method of manufacturing a capacitor component includes preparing a laminate structure in which a plurality of ceramic sheets, each having an internal electrode pattern formed thereon, are layered, attaching an auxiliary member to an upper surface and a lower surface of the laminate structure, and disposing the laminate structure having the auxiliary member attached thereto on a lower mold on which jigs for blocking a length direction portion and a width direction portion of the laminate structure are disposed and compressing the laminate structure. The ceramic sheet has a thickness of 0.6 ?m or less, and the auxiliary member has higher elasticity than elasticity of the lower mold.
    Type: Application
    Filed: March 11, 2019
    Publication date: May 21, 2020
    Inventors: Kyoung Jin Cha, Ji Hong Jo, Hyung Soon Kwon, Jong Hoon Kim, Jin Woo Lee
  • DISPLAY PANEL AND COLOR CONVERSION PANEL
    Publication number: 20200159065
    Abstract: Provided is a display panel in which a first pixel region, a second pixel region, a third pixel region, and a light-blocking region may be defined. The first substrate may include a base layer; a first color filter layer overlapping the light-blocking region and the first pixel region; a light blocking layer overlapping the light-blocking region; a second color filter layer overlapping the second pixel region; a third color filter layer overlapping the third pixel region; and a step compensation layer disposed on one surface of the light-blocking layer and configured to cover at least a portion of the light-blocking region adjacent to the first pixel region when viewed in a plane.
    Type: Application
    Filed: September 3, 2019
    Publication date: May 21, 2020
    Inventors: Jangil KIM, Jeongki KIM, Jong-hoon KIM, Jeaheon AHN, Myoungjong LEE, Seok-joon HONG
  • Stack packages including bridge dies
    Patent number: 10658332
    Abstract: A stack package includes a second sub-package stacked on a first sub-package. The stack package also includes a plurality of dummy balls located between the first and second sub-packages to support the second sub-package. Each of the first and second sub-packages includes a semiconductor die and a bridge, die which are spaced apart from each other.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: May 19, 2020
    Assignee: SK hynix Inc.
    Inventors: Ki Jun Sung, Jong Hoon Kim
  • MEMORY MODULES, MEMORY SYSTEMS, AND METHODS OF OPERATING MEMORY MODULES
    Publication number: 20200126609
    Abstract: A memory module includes semiconductor memory devices mounted on a circuit board and a control device mounted on the circuit board. The control device receives a command, an address, and a clock signal from an external device, and provides the command, the address, and the clock signal to the semiconductor memory devices. The control device, in a hidden training mode during a normal operation, performs a command/address training on at least one semiconductor memory device of the semiconductor memory devices by transmitting a first command/address and a first clock signal to the at least one semiconductor memory device and receiving a second command/address and a second clock signal in response to the first command/address and the first clock signal, from the at least one semiconductor memory device.
    Type: Application
    Filed: April 22, 2019
    Publication date: April 23, 2020
    Inventors: JONG-HOON KIM, YOUNG YUN, WANG-SOO KIM, YOO-JEONG KWON, SI-HOON RYU, YOUNG-HO LEE, SUNG-JOO PARK
  • Electronic device comprising antenna
    Patent number: 10608324
    Abstract: An electronic device includes a metal housing, a conductive member disposed adjacent to the metal housing, a plurality of ground parts including a first ground part electrically connected with a first point of the conductive member and a second ground part electrically connected with a second point of the conductive member, a ground plate electrically connected with the metal housing and electrically connected with the conductive member via the plurality of ground parts, and a feeding part electrically connected with the conductive member.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: March 31, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang Ha Lee, Kyung Jae Lee, Jae Ho Lim, Dong Hwan Kim, Young Jun Kim, Un Kim, Jong Hoon Kim, Min Seok Park
  • Tooth-attachable patch capable of being removed by tooth brushing
    Patent number: 10603252
    Abstract: The present invention relates to a tooth-attachable patch comprising: a drug layer for delivering drugs to a tooth; and a backing layer positioned on the opposite side of a tooth attachment surface of the drug layer, and including, both a water-soluble polymer and a water-insoluble polymer. The patch of the present invention can be easily removed by merely brushing the teeth without separately stripping off a backing layer.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: March 31, 2020
    Assignee: LG Household & Health Care Ltd.
    Inventors: Jong-Hoon Kim, Jae-Hyun Ahn, Kwang-Ho Oh, In-Ho Lee
  • STACK PACKAGES INCLUDING BRIDGE DIES
    Publication number: 20200075542
    Abstract: A stack package includes a second sub-package stacked on a first sub-package. The stack package also includes a plurality of dummy balls located between the first and second sub-packages to support the second sub-package. Each of the first and second sub-packages includes a semiconductor die and a bridge, die which are spaced apart from each other.
    Type: Application
    Filed: December 13, 2018
    Publication date: March 5, 2020
    Applicant: SK hynix Inc.
    Inventors: Ki Jun SUNG, Jong Hoon KIM
  • MULTILAYER CAPACITOR
    Publication number: 20200027658
    Abstract: A multilayer capacitor may include a capacitor body including an active area including a plurality of dielectric layers, and a plurality of first and second internal electrodes, upper and lower cover layers disposed on upper and lower surfaces of the active area, and having first to six external surfaces; first and second external electrodes including first and second connection portions and first and second band portions, respectively; and a plurality of dummy electrodes disposed on the upper and lower cover layers with a dielectric layer interposed therebetween, and exposed through corners of the capacitor body, a portion of the plurality of dummy electrodes being disposed between the upper and lower surfaces of the capacitor body and the first and second band portions.
    Type: Application
    Filed: February 27, 2019
    Publication date: January 23, 2020
    Inventors: Hee Soo LEE, Ah Young SHIN, Dong Hoon KIM, Jong Hoon KIM, Hong Seok KIM, Jong Ho LEE