Patents by Inventor Jong-hoon Lee

Jong-hoon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9287748
    Abstract: A spindle motor includes: a rotor; a rotating shaft whose one end is combined with the rotor; a sleeve bearing whose inner circumference rotatably supports the outer circumferential surface of the rotating shaft, and on the outer circumferential surface of which at least one oil circulation recess is provided along the lengthy direction of the sleeve bearing; a bearing housing having a first recess accommodating the sleeve bearing and a second recess that supports the other end of the rotating shaft at a central portion of the first recess, and made of a resin; and a number of protrusions that are protrudingly formed at a gap radially spaced apart from each other around the rotating shaft so that a plurality of guide grooves through which oil passes are formed on the bottom of the first recess, and on which the bottom of the sleeve bearing is mounted.
    Type: Grant
    Filed: January 5, 2012
    Date of Patent: March 15, 2016
    Assignee: SAMHONGSA CO., LTD.
    Inventors: Jong Hoon Lee, Chang Seob Song
  • Publication number: 20160066414
    Abstract: A semiconductor package according to some examples of the disclosure may include a first body layer, a transformer that may comprise one or more inductors, coupled inductors, or inductive elements positioned above the first body layer. A first ground plane is on a top of the first body layer between the first body layer and the inductive element. The first ground plane may have conductive lines generally perpendicular to a magnetic field generated by the inductive element, and a second ground plane on a bottom of the first body layer opposite the first ground plane. The first and second ground planes may also provide heat dissipation elements for the semiconductor as well as reduce or eliminate eddy current and parasitic effects produced by the inductive element.
    Type: Application
    Filed: September 2, 2014
    Publication date: March 3, 2016
    Inventors: Uei-Ming JOW, Young Kyu SONG, Jung Ho YOON, Jong-Hoon LEE, Xiaonan ZHANG
  • Patent number: 9247647
    Abstract: A package substrate (or printed circuit board) that includes at least one dielectric layer, a first inductor structure is at least partially located in the dielectric layer, a third interconnect, and a second inductor structure. The first inductor structure includes a first interconnect, a first via coupled to the first interconnect, and a second interconnect coupled to the first via. The third interconnect is coupled to the first inductor structure. The third interconnect is configured to provide an electrical path for a ground signal. The second inductor structure is at least partially located in the dielectric layer. The second inductor is coupled to the third interconnect. The second inductor structure includes a fourth interconnect, a second via coupled to the fourth interconnect, and a fifth interconnect coupled to the second via. The first and second inductor structures are configured to operate with a capacitor as a 3rd harmonic suppression filter.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: January 26, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Jung Ho Yoon, Xiaonan Zhang, Jong-Hoon Lee, Young Kyu Song, Uei-Ming Jow
  • Publication number: 20160020193
    Abstract: Some features pertain to an integrated device (e.g., package-on-package (PoP) device) that includes a substrate, a first die, a first encapsulation layer, a first redistribution portion, a second die, a second encapsulation layer, and a second redistribution portion. The substrate includes a first surface and a second surface. The substrate includes a capacitor. The first die is coupled to the first surface of the substrate. The first encapsulation layer encapsulates the first die. The first redistribution portion is coupled to the first encapsulation. The second die is coupled to the second surface of the substrate. The second encapsulation layer encapsulates the second die. The second redistribution portion is coupled to the second encapsulation layer.
    Type: Application
    Filed: July 17, 2014
    Publication date: January 21, 2016
    Inventors: Jong-Hoon Lee, Young Kyu Song, Daeik Daniel Kim, Jung Ho Yoon, Uei-Ming Jow, Mario Francisco Velez, Jonghae Kim, Xiaonan Zhang, Ryan David Lane
  • Patent number: 9209668
    Abstract: Provided is a spindle motor having an electrostatic discharge (ESD) path that can stably discharge electric charges introduced from the outside to a rotating shaft through a base plate, in a structure of forming a bearing housing by using a resin and insert-molding the base plate. The spindle motor includes: a rotor to the central portion of which one end of a rotating shaft is coupled; a bearing that rotatably supports the rotating shaft; a bearing housing that accommodates the bearing in the inside of a groove and that is made of a resin; and a base plate whose inner circumferential portion is buried and combined in the inside of the bearing housing, wherein part of the base plate is in contact with the bearing to thus discharge externally introduced static electricity through the rotating shaft, bearing, and the base plate.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: December 8, 2015
    Assignee: SAMHONGSA CO., LTD.
    Inventors: Jong Hoon Lee, Chang Seob Song
  • Patent number: 9160328
    Abstract: Radio-frequency (RF) switch circuits are disclosed providing improved switching performance. An RF switch system includes a plurality of field-effect transistors (FETs) connected in series between first and second nodes, each FET having a gate and a body. A compensation network including a gate-coupling circuit couples the gates of each pair of neighboring FETs. The compensation network may further including a body-coupling circuit that couples the bodies of each pair of neighboring FETs.
    Type: Grant
    Filed: July 6, 2013
    Date of Patent: October 13, 2015
    Inventors: Fikret Altunkilic, Guillaume Alexandre Blin, Haki Cebi, Hanching Fuh, Mengshu Hsu, Jong-Hoon Lee, Anuj Madan, Nuttapong Srirattana, Chuming Shih, Steven Christopher Sprinkle
  • Publication number: 20150188936
    Abstract: According to a method and system for real-time malware detection based on web browser plugin, the method and system may connect a web server of a web site through a web browser module, execute a security module through a browser plugin of the web site, update a database for a browser cache of the web site from the web server by the security module, cache a web content of the web site from the web server, match cache data of the web content with the database, and warn about the web content if data matched with the cache data of the web content does not exist in the database.
    Type: Application
    Filed: April 10, 2014
    Publication date: July 2, 2015
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Jung Tae KIM, Min Ho HAN, Jong Hoon LEE, Ik Kyun KIM, Hyun Sook CHO
  • Patent number: 9016411
    Abstract: An engine encapsulation structure of a vehicle may include an engine room encapsulation member disposed at an upper portion of an engine compartment and covering an upper portion of a power train having an engine and a transmission, an underbody encapsulation member disposed at a lower portion of the engine compartment and covering a lower portion of the power train, wherein the engine room encapsulation member and the underbody encapsulation member form an inner space and enclose the power train in the inner space when being assembled each other, and a front inlet formed at a front portion of the assembly to allow air through the front inlet and to cool the power train while the air passes through the inner space of the assembly, the air being discharged through a rear outlet formed to the assembly.
    Type: Grant
    Filed: July 10, 2012
    Date of Patent: April 28, 2015
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Jong Woo Nam, Won Sik Kim, Han Shin Chung, Min Soo Oh, Jae Yeon Kim, Jong Hoon Lee
  • Patent number: 8987061
    Abstract: Methods for antenna switch modules are disclosed. In certain implementations, a method of making an antenna switch module is provided. The method includes providing a package substrate implemented to receive one or more electrical components, attaching a silicon on insulator (SOI) die to the package substrate, and providing an integrated filter. The SOI die includes a capacitor and a switch coupled to a plurality of radio frequency (RF) signal paths. The integrated filter filters an RF signal received on a first RF signal path of the plurality of RF signal paths, and includes the capacitor of the SOI die and an inductor.
    Type: Grant
    Filed: June 19, 2014
    Date of Patent: March 24, 2015
    Assignee: Skyworks Soultions, Inc.
    Inventors: Jong-Hoon Lee, Chuming Shih
  • Patent number: 8978233
    Abstract: A transmission mount type of side assembling includes a cylindrical insulator; a core having a plurality of longitudinal holes and inserted in the insulator; a side stopper having a support connected to one end of the core in contact with the inner side of the insulator and a protrusion protruding outside the insulator from the support; a cylindrical case accommodating the core, the side stopper, and the insulator; and a plurality of bolts that is longer than the case and inserted through holes in the core and the side stopper from a side to protrude outside the case, such that it can simplify the assembly process of fastening a transmission to a car body and reduce the manufacturing cost, without changing the existing manufacturing line, and ensure safety in assembly.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: March 17, 2015
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Hyuk Kim, Yong-Jin Kim, Seung-Won Kim, Jun-Haeng Heo, Kong-Sup Jung, Jong-Hoon Lee
  • Patent number: 8982620
    Abstract: A method of operating a non-volatile memory includes; during power-on, reading control information from an information block and lock information from an additional information block, then upon determining that a secure block should be locked, generating a lock enable signal that inhibits access to data stored in the secure block, and a read-only enable signal that prevents change in the data stored in the additional information block.
    Type: Grant
    Filed: October 3, 2013
    Date of Patent: March 17, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ho-Kil Lee, Sung-Joon Kim, Jin-Yub Lee, Sung-Kyu Jo, Seung-Jae Lee, Jong-Hoon Lee
  • Patent number: 8961154
    Abstract: An electric water pump apparatus may include a body having a stator chamber and a rotor chamber therein, a stator having a hollow cylindrical shape and being disposed in the stator chamber and generating a magnetic field, wherein the stator fluidly insulates the stator chamber and the rotor chamber, a rotor disposed in the rotor chamber and enclosed by the stator, wherein the rotor is rotated by the magnetic field, and a pump cover connected to the body and forming a volute chamber therein, wherein the volute chamber and the rotor chamber are fluidly-communicated through a connecting hole formed to the body and a coolant is supplied to the rotor chamber through the connection hole, wherein the stator includes a stator groove formed in an inner circumference therein and the stator groove is fluid-connected to the rotor chamber and the volute chamber through the connection hole.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: February 24, 2015
    Assignees: Hyundai Motor Company, Myunghwa Ind. Co., Ltd., Amotech Co., Ltd., Kia Motors Corporation
    Inventors: Jeawoong Yi, Seung Yong Lee, Gyuhwan Kim, Yun Seok Kim, Yong Sun Park, Tae-Sung Oh, Kyung-Hwan Kim, Jong-Hoon Lee, Kwang-Ho Lee
  • Patent number: 8932035
    Abstract: An electric water pump apparatus may include a body having a stator chamber and a rotor chamber therein, a stator having a hollow cylindrical shape and being disposed in the stator chamber and generating a magnetic field, wherein the stator fluidly insulates the stator chamber and the rotor chamber, a rotor disposed in the rotor chamber and enclosed by the stator, wherein the rotor is rotated by the magnetic field, and a pump cover connected to the body and forming a volute chamber therein, wherein the volute chamber and the rotor chamber are fluidly-communicated through a connecting hole formed to the body and a coolant is supplied to the rotor chamber through the connection hole, wherein the stator includes a stator groove formed in an inner circumference therein and the stator groove is fluid-connected to the rotor chamber and the volute chamber through the connection hole.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: January 13, 2015
    Assignees: Hyundai Motor Company, Myunghwa Ind. Co., Ltd., Amotech Co., Ltd., Kia Motors Corporation
    Inventors: Jeawoong Yi, Seung Yong Lee, Gyuhwan Kim, Yun Seok Kim, Yong Sun Park, Tae-Sung Oh, Kyung-Hwan Kim, Jong-Hoon Lee, Kwang-Ho Lee
  • Patent number: 8928209
    Abstract: Disclosed are a spindle motor and a method of manufacturing the same. A base plate is integrated with a bearing housing using an insert molding or insert injection method at the same time when the bearing housing is made of resin, thereby being capable of securing the verticality of a bearing and a pivot assembled with the bearing housing and the base plate, reducing the manufacturing cost, and improving the efficiency of a manufacturing process. The motor includes a rotor, a pivot configured to have one end connected to the rotor, a bearing configured to rotatably support the outer circumferential face of the pivot, and a bearing housing made of resin and configured to comprise a first concave groove for receiving the bearing and a second concave groove for supporting the other end of the pivot.
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: January 6, 2015
    Assignee: Samhongsa Co., Ltd.
    Inventors: Byung Sung Min, Jong Hoon Lee
  • Publication number: 20140319652
    Abstract: Some implementations provide an integrated device that includes a capacitor and an inductor. The inductor is electrically coupled to the capacitor. The inductor and the capacitor are configured to operate as a filter for an electrical signal in the integrated device. The inductor includes a first metal layer of a printed circuit board (PCB), a set of solder balls coupled to the PCB, and a second metal layer in a die. In some implementations, the capacitor is located in the die. In some implementations, the capacitor is a surface mounted passive device on the PCB. In some implementations, the first metal layer is a trace on the PCB. In some implementations, the inductor includes a third metal layer in the die. In some implementations, the second metal layer is an under bump metallization (UBM) layer of the die, and the third metal is a redistribution layer of the die.
    Type: Application
    Filed: July 3, 2014
    Publication date: October 30, 2014
    Inventors: Jong-Hoon Lee, Young Kyu Song, Jung Ho Yoon, Uei Ming Jow, Xiaonan Zhang, Ryan David Lane
  • Publication number: 20140300525
    Abstract: Methods for antenna switch modules are disclosed. In certain implementations, a method of making an antenna switch module is provided. The method includes providing a package substrate implemented to receive one or more electrical components, attaching a silicon on insulator (SOI) die to the package substrate, and providing an integrated filter. The SOI die includes a capacitor and a switch coupled to a plurality of radio frequency (RF) signal paths. The integrated filter filters an RF signal received on a first RF signal path of the plurality of RF signal paths, and includes the capacitor of the SOI die and an inductor.
    Type: Application
    Filed: June 19, 2014
    Publication date: October 9, 2014
    Inventors: Jong-Hoon Lee, Chuming Shih
  • Publication number: 20140304338
    Abstract: Disclosed herein is an apparatus and method that process knowledge, experience information, or the like possessed by group members via a dynamically created social group, in the form of collaborative storyboards, thus enabling the collaborative storyboards to be shared among a plurality of social groups, as well as the corresponding members. The presented apparatus includes a social group management unit for managing information about a social group and a user joining the social group as a member, and an information management unit for accepting information finally determined with respect to information of content desired to be shared, which is posted by the user on a storyboard of the social group, in collaboration with other users, as a post of the storyboard of the social group, and distributing the post to the social group.
    Type: Application
    Filed: March 24, 2014
    Publication date: October 9, 2014
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Hoon-Ki LEE, Jong-Hoon LEE, Jung-Tae KIM, Jong-Youl PARK
  • Patent number: D748672
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: February 2, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Youn Jeong, Bo-Ran Lee, Jung-Ah Seung, Gu-Hyun Yang, Jong-Hoon Lee
  • Patent number: D749625
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: February 16, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Gu-Hyun Yang, Bo-Ran Lee, Sang-Hee Bae, Jong-Hoon Lee, Jae-Youn Jeong
  • Patent number: D754748
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: April 26, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Youn Jeong, Bo-Ran Lee, Jung-Ah Seung, Gu-Hyun Yang, Jong-Hoon Lee