Abstract: The present invention relates to a complex sample pretreatment apparatus that enables extraction of a DNA or RNA component from a complex sample, such as excretion, which is a mixture of liquid and solid phases, through a series of pretreatment processes. The apparatus may comprise: a housing; a cartridge seating device which is installed inside the housing and onto which a cartridge is seated; a spin drive device which is installed in the housing, is coupled to an object to be spun which is mounted on the cartridge or mounted on the cartridge mounting device, and rotates the object to be spun; and a pump drive device which is installed in the housing, is coupled to a dispensing tip mounted on the cartridge or on the cartridge mounting device, and dispenses a sample or reagent by using the dispensing tip.

Abstract: Provided is a collected sample pretreatment apparatus capable of rapidly and accurately analyzing a deoxyribonucleic acid (DNA) or ribonucleic acid (RNA) sample collected by a swab or another collector, through a series of automated processes, the collected sample pretreatment apparatus including a housing, a cartridge mounting device to hold a cartridge, a spin drive device coupled with a spin tip provided in the cartridge or the cartridge mounting device to rotate the spin tip, a pump drive device coupled with a dispensing tip provided in the cartridge or the cartridge mounting device to dispense a buffer solution by using the dispensing tip, and a tip removal device to remove the spin tip from the spin drive device or the dispensing tip from the pump drive device by using relative motion of the spin drive device and the pump drive device.

Abstract: Provided is a cartridge system for extracting a collected sample. The cartridge system may include: a cartridge body; a dewatering tip-receiving unit in which a dewatering tip is received such that a collecting member to which a sample is collected can be received; a spin cover-receiving unit in which a spin cover is received such that a spin head of a robot device can be equipped with the spin cover; a buffer chamber unit in which a buffer solution is received such that the sample from the collecting member through dewatering by the rotation of the spin head can be received in the buffer solution; and a dispensing tip-receiving unit in which a dispensing tip is received such that a pump head of the robot device can be equipped with the dispensing tip to suction the buffer solution including the sample.

Abstract: The cartridge system for extraction of a complex sample may include: a cartridge body; a complex sample collector for collecting a complex sample to provide same to the cartridge body; a buffer solution receiving unit formed in the cartridge body and configured to accommodate a buffer solution therein and provide a space in which, after a collecting unit of the complex sample collector is immersed in the buffer solution, the collecting unit is rotated by a spin head of a robot device such that the complex sample is mixed with the buffer solution or mixed beads included in the buffer solution; and a complex sample collector disposal unit formed in the cartridge body and configured to temporarily store the complex sample collector to discard same after the complex sample is provided to the buffer solution receiving unit.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate, and a sealing portion having the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate. The shielding wall includes at least one insulating layer and at least one conductive layer disposed on the insulating layer.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate, and a sealing portion having the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate. The shielding wall includes at least one insulating layer and at least one conductive layer disposed on the insulating layer.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.

Abstract: An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on an outer surface thereof; at least one electronic device mounted on the mounting electrodes; a molded part sealing the electronic device; and at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part, wherein the protective insulation layer is disposed to be spaced apart from the connective conductor.

Abstract: An electronic device module includes a board including external connecting electrodes and mounting electrodes; an electronic device mounted on the mounting electrodes; a molded portion sealing the electronic device; connection conductors having an end bonded to the external connecting electrodes and penetrating through the molded portion; and external terminals bonded to another end of the connection conductors.

Abstract: A semiconductor package and manufacturing method thereof includes a chip member installed on an upper surface, a lower surface, or both of a substrate. The semiconductor package and manufacturing method thereof also include a mold part stacked embedding the chip member, a connection member disposed at a center portion of the mold part, and a solder part formed on a portion of the connection member.

Abstract: A double-sided package module includes a substrate, a first sealing member, a second sealing member, and an extension portion. The substrate includes electronic components positioned on a first surface and a second surface of the substrate. The first sealing member and the second sealing member are positioned on the first surface and the second surface, respectively. The extension portion protrudes from a lateral surface of the substrate into a space between the first sealing member and the second sealing member.