Abstract: Provided is a cartridge system for extracting a collected sample. The cartridge system may include: a cartridge body; a dewatering tip-receiving unit in which a dewatering tip is received such that a collecting member to which a sample is collected can be received; a spin cover-receiving unit in which a spin cover is received such that a spin head of a robot device can be equipped with the spin cover; a buffer chamber unit in which a buffer solution is received such that the sample from the collecting member through dewatering by the rotation of the spin head can be received in the buffer solution; and a dispensing tip-receiving unit in which a dispensing tip is received such that a pump head of the robot device can be equipped with the dispensing tip to suction the buffer solution including the sample.

Abstract: The cartridge system for extraction of a complex sample may include: a cartridge body; a complex sample collector for collecting a complex sample to provide same to the cartridge body; a buffer solution receiving unit formed in the cartridge body and configured to accommodate a buffer solution therein and provide a space in which, after a collecting unit of the complex sample collector is immersed in the buffer solution, the collecting unit is rotated by a spin head of a robot device such that the complex sample is mixed with the buffer solution or mixed beads included in the buffer solution; and a complex sample collector disposal unit formed in the cartridge body and configured to temporarily store the complex sample collector to discard same after the complex sample is provided to the buffer solution receiving unit.

Abstract: The present invention may provide a motor including a rotating shaft, a rotor coupled to the rotating shaft, a plurality of stator cores disposed to correspond to the rotor, and a housing disposed outside the plurality of stator cores, wherein the plurality of stator cores include yokes and teeth protruding from the yokes, and curvature centers of outer surfaces of the yokes and curvature centers of inner surfaces of the teeth are eccentrically disposed with respect to a center of the stator.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: A method includes providing an image; analyzing the image to determine one or more encodable areas; determining a plurality of distinct serial numbers; adding the plurality of distinct serial numbers to a database; and producing a first plurality of first tags based on the image, each of the first tags including encoded information in at least one encodable area thereon, the encoded information for each particular first tag including a corresponding particular unique serial number of the distinct serial numbers, wherein at least some of the encoded information is encoded using steganography. Information in the image is used to authenticate a product.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate, and a sealing portion having the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate. The shielding wall includes at least one insulating layer and at least one conductive layer disposed on the insulating layer.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: An electronic device on which an exterior surface mounting member is mounted is provided. The electronic device includes an external housing including a first plate and a second plate that is directed opposite to the first plate, and at least one electronic component that is included within the external housing. The first plate may include a transparent plate including a first surface that forms an outer surface of the first plate and a second surface that is directed opposite to the first surface, and a structure that is interposed between the transparent plate and the second plate, and includes a third surface that faces the first plate and a fourth surface that is formed opposite to the third surface, the structure containing a transparent or translucent material.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate, and a sealing portion having the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate. The shielding wall includes at least one insulating layer and at least one conductive layer disposed on the insulating layer.

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.

Abstract: The present disclosure includes a memory in which a content providing program is stored, and a processor that executes the program stored in the memory. Herein, upon execution of the program, the processor extracts a subject and a verb property including multiple verbs corresponding to the subject from a target content, infers a verb-form subject of the target content on the basis of the subject and the verb property, and extracts one or more contents matched with the target content from among multiple candidate contents on the basis of the verb-form subject of the target content. Further, the multiple verbs corresponding to the subject are extracted from an associative verb group.

Abstract: An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on an outer surface thereof; at least one electronic device mounted on the mounting electrodes; a molded part sealing the electronic device; and at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part, wherein the protective insulation layer is disposed to be spaced apart from the connective conductor.

Abstract: An electronic device module includes a board including external connecting electrodes and mounting electrodes; an electronic device mounted on the mounting electrodes; a molded portion sealing the electronic device; connection conductors having an end bonded to the external connecting electrodes and penetrating through the molded portion; and external terminals bonded to another end of the connection conductors.