Abstract: There are provided an electronic component module capable of increasing a degree of integration by mounting electronic components on both surfaces of a substrate, and a manufacturing method thereof. The electronic component module according to an exemplary embodiment of the present disclosure includes: a substrate; a plurality of electronic components mounted on both surfaces of the substrate; connection conductors each having one end bonded to one surface of the substrate using an conductive adhesive; and a molded portion having the connection conductor embedded therein and formed on one surface of the substrate, wherein the connection conductor may have at least one blocking member preventing a spread of the conductive adhesive.

Abstract: There is provided a semiconductor package module including: a substrate having one or more connection terminals formed thereon; first electronic components mounted on a first surface of the substrate; second electronic components mounted on a second surface of the substrate; and third electronic components formed on the substrate and including connection electrodes connecting the one or more connection terminals and external terminals to each other.

Abstract: There are provided an electronic component module allowing for a circuit wiring to be disposed outside of a molded part by a plating process, and a manufacturing method thereof, the electronic component module including a substrate; at least one electronic component mounted on the substrate; a molded part sealing the electronic component; a plurality of conductive connectors having one ends bonded to the substrate or one surface of the electronic component and formed in the molded part to penetrate through the molded part; and at least one plane pattern formed on an outer surface of the molded part and electrically connected to at least one of the conductive connectors.

Abstract: A method for fabricating a window member for a display device of a portable terminal includes: fabricating a high-hardness sheet to be attached to a surface of the window member (‘sheet fabrication step’), fabricating a body of the window member with a high-polymer synthetic resin (‘body fabrication step’), and attaching the high-hardness sheet to an outer surface of the body (‘attaching step’), in which the outer surface of the body is formed to have a curved surface in the body fabrication step.

Abstract: An embedded printed circuit board (PCB) includes: a copper foil laminate; an internal electronic component inserted into the copper foil laminate; a first circuit pattern formed on a surface of the internal electronic component; and a second circuit pattern formed on the copper foil laminate.

Abstract: A window member and a method for fabricating the same. The window member includes a glass member, a semi-transparent printed layer formed on the glass member, and a metal or metal oxide layer formed on the semi-transparent printed layer. In some embodiments, the semi-transparent printed layer includes embossments formed on a surface thereof facing the metal or metal oxide layer, or contains an additive to generate virtual embossments.

Abstract: Disclosed herein is a capacitor-embedded printed circuit board, including first to fourth layers forming a four-layer laminated structure; and one or more capacitors embedded through the second layer and the third layer among the first to fourth layers, wherein the respective capacitors embedded through the second layer and the third layer are electrically connected to one or more power terminals of active elements and ground terminals, and wherein at the second or third layer, power terminal wirings are connected to thereby allow the capacitors to form a mutual parallel connection structure, and thus, in embedding capacitors in a laminated structured board having a plurality of layers, a capacitor-embedded printed circuit board capable of reducing the impedance in the entire frequency region and having a high capacitance and a low equivalent series inductance can be realized by effectively connecting capacitors embedded inside the printed circuit board in parallel with each other.

Abstract: An electronic component-embedded printed circuit board and a method of manufacturing the same. The printed circuit board includes a base substrate including a hollow electronic component case, an electronic component inserted into the electronic component case, circuit pattern layers formed on upper and lower surfaces of the base substrate, and an insulating layer formed to cover the circuit pattern layers. Accordingly, since the printed circuit board includes the electronic component case formed therein and the electronic component is inserted into only the printed circuit board, which has no defect after manufacture and final inspection of the printed circuit board, component loss due to yield of the printed circuit board can be reduced.

Abstract: Disclosed herein is an embedded printed circuit board (PCB) including: a copper foil laminate; an internal electronic component inserted into the copper foil laminate; a first circuit pattern formed on a surface of the internal electronic component; and a second circuit pattern formed on the copper foil laminate. Since the surface space of the electronic component embedded in the substrate is utilized as a wiring space, a wiring design can be optimized, layers can be simplified, and an increase in the thickness of the substrate can be prevented. Also, malfunction of the embedded electronic component or a warping phenomenon of a PCB due to generated heat can be prevented.

Abstract: A method for fabricating a window member for a display device of a portable terminal includes: fabricating a high-hardness sheet to be attached to a surface of the window member (‘sheet fabrication step’), fabricating a body of the window member with a high-polymer synthetic resin (‘body fabrication step’), and attaching the high-hardness sheet to an outer surface of the body (‘attaching step’), in which the outer surface of the body is formed to have a curved surface in the body fabrication step.

Abstract: An interposer includes: an insulation plate where a via is formed, the insulation plate including a resin or a ceramic; a first upper redistribution layer electrically connected to the via along a circuit pattern designed on the top surface of the insulation plate; a first upper protection layer laminated to expose a portion of the first upper redistribution layer and protecting the first upper redistribution layer; a second upper redistribution layer electrically connected to the first upper redistribution layer and laminated along a designed circuit pattern designed; a second upper protection layer laminated to expose a portion of the second upper redistribution layer and protecting the second upper redistribution layer; and an under bump metallization (UBM) formed at the exposed portion of the second upper redistribution layer.

Abstract: Provided are a method and system for preventing personal information of a user using server registration information and an authentication system connected to the Internet. The method includes collecting information regarding servers which provide an Internet service; classifying the safety of sites using the servers based on the information; and providing site information containing the information regarding the servers at the request of a client which tries to access the servers. In the method, addresses of servers of major organizations connected to a network are registered in advance. Therefore, when a terminal of a user tries to access an external site through the network, it is possible to identify which organization has actually registered an address of the site and determine whether the site is a harmful site. If the site is determined to be harmful, the access to the site is blocked, thereby preventing the damages of phishing.

Abstract: Provided are an apparatus and method of protecting a user's privacy information and corporate intellectual property against a denial-of-information (DoI) attack, and more particularly, a privacy & intellectual property protection framework (PIPPF) and a network-based privacy & intellectual property protection system (NPIPPS). The PIPPF includes the NPIPPS and an integrated identity access and management (IAM)/network access control (NAC) solution. The NPIPPS monitors inbound and outbound contents at the network level and prevents the leakage of important information. In addition, the integrated IAM/NAC solution prevents abnormal user activity within a network and unauthorized use of information.

Abstract: The present invention relates to a structured catalyst for reforming of gasoline and a method of preparing the same, more particularly to a structured catalyst for reforming of gasoline for fuel-cell powered vehicles prepared by wash-coating the transition metal based reforming catalyst on the surface of the ceramic honeycomb support wash-coated with sub-micron sized alumina or its precursor to sufficiently increase the effective surface area and the performance of the catalyst and a method of preparing the same.

Abstract: The present invention relates to a high performance water gas shift catalyst and a method of preparing the same, more particularly to a high performance water gas shift catalyst comprising active components such as copper (Cu), nickel (Ni) and platinum (Pt) and a ceria (CeO2) support, which has better catalytic activity and thermal cycling durability with minimum platinum supporting amount of 1 wt % or less compared with the conventional Pt/CeO2 catalyst and LTS catalyst, and a method of preparing the same.

Abstract: Disclosed herein is RF modulator with a narrow bandpass filter. The RF modulator for modulating video and audio signals into RF signals corresponding to a frequency band of a predetermined channel includes an oscillation unit for generating a predetermined RF signal suitable for the frequency band of the predetermined channel; a mixer for modulating the video and audio signals using the RF signal generated from the oscillation unit; and a narrow bandpass filter for receiving an RF-modulated signal from the mixer, and passing only a signal of the frequency band of the predetermined channel from among the RF-modulated signal. Therefore, the RF modulator can remove or block unnecessary components such as lower side band and harmonic-frequency signals generated after video and audio signals have been RF-modulated, such that it can prevent interference between channels from being generated, resulting in the creation of more excellent video and audio signals.

Abstract: The present invention relates to a solid oxide fuel cell for internal reforming of hydrocarbons and carbon dioxide, in particular, to a solid oxide fuel cell in which one side of solid oxide electrolyte (YSZ) is attached to an air electrode (La0.8Sr0.2MnO3) and its other side is attached to a catalyst electrode of Ni-YSZ type or perovskite type metal oxide. The electrochemical conversion system using the solid oxide fuel cell permits the occurrence of internal reforming of hydrocarbons and carbon dioxide concomitantly with the coproduction of a syngas and electricity, and overcomes the shortcomings associated with the catalytic deactivation due to carbon deposition and the high-energy consumption.

Abstract: The present invention relates to a structured catalyst for reforming of gasoline and a method of preparing the same, more particularly to a structured catalyst for reforming of gasoline for fuel-cell powered vehicles prepared by wash-coating the transition metal based reforming catalyst on the surface of the ceramic honeycomb support wash-coated with sub-micron sized alumina or its precursor to sufficiently increase the effective surface area and the performance of the catalyst and a method of preparing the same.

Abstract: The bandpass filter according to the present invention includes a housing having a plurality of cavities, wherein said plurality of cavities are isolated from each other by partitions and wherein each said partition have a coupling window; input/output connectors formed at both ends of said housing so as to pass output signals from a transmitter; coupling loops connected to said input/output connectors so as to excite an applied signal power and to combine resonance modes; dielectric resonators installed in said cavities of said housing so as to resonate a signal power transmitted from said coupling loop to the desired frequency band, said dielectric resonators including: a first resonator group formed in both said cavities which are adjacent to said coupling loops; and a second resonator group formed in said cavities which are positioned between both said cavities which are adjacent to said coupling loops, wherein said resonators of said second resonator group are stepped resonators; a plurality of frequency