Patents by Inventor Jong Tae Kim

Jong Tae Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090016575
    Abstract: Provided are a real-time face recognition-based selective recording apparatus and method. The apparatus includes a face recognition unit which recognizes a face of a person in a decompressed input image frame; a recording position setting unit which sets one of an image frame in which the person appears and a scene change start frame including the image frame as a valid recording point if the recognized face is detected for a predetermined period of time or detected a predetermined number of times, and identifies a position, which corresponds to a set image frame, in an image compression stream; and a recording unit which records the image compression stream from the identified position and storing the recorded image compression stream in real time.
    Type: Application
    Filed: November 12, 2007
    Publication date: January 15, 2009
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Eun-Sang BAK, Jong-Tae Kim, Jin-Man Park
  • Publication number: 20090003704
    Abstract: Browser controlling method and system using an image are provided. The method includes inputting an image; recognizing the image; and executing a command based on the recognized image. Accordingly, the command based on the user's input image can be executed in the browser. Also, since the browser does not need to display various function buttons, the screen can be utilized more efficiently.
    Type: Application
    Filed: March 26, 2008
    Publication date: January 1, 2009
    Applicant: NHN CORPORATION
    Inventors: Jun-Ho Hwang, Byoung-Seok Yang, Gun-Pyo Na, Dong-Hyun Kim, Jong-Tae Kim
  • Publication number: 20080224388
    Abstract: An image forming apparatus including a guide unit including: a length-adjusting assembly including a length-adjusting rack part, which is adjusted according to a length of printing medium; a width-adjusting assembly including a width-adjusting rack part, which is adjusted according to a width of printing medium; and a pinion assembly, which interlocks the width-adjusting assembly interlock with the length-adjusting assembly. The pinion assembly includes a first pinion part, which engages with the length-adjusting rack, and a second pinion part, which engages with the width-adjusting rack and rotates together with the first pinion part. The first pinion part and the second pinion part have a stepped shape.
    Type: Application
    Filed: February 20, 2008
    Publication date: September 18, 2008
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: JONG TAE KIM, Se Hyun Lyu
  • Publication number: 20080208756
    Abstract: An apparatus and method for providing a security domain are provided. The apparatus includes a security domain which is not connected to an external system and which manages a digital rights management (DRM) license requiring security; a non-security domain which can be connected to the external system and which manages encrypted DRM content; and a virtual controller which controls the security domain and the non-security domain. The method includes requesting checking of a license for encrypted content; checking whether the license for encrypted content exists, in response to the requesting checking of the license; and if it is determined that the license exists, requesting transmission of encrypted content, decrypting the encrypted content, and playing the decrypted content.
    Type: Application
    Filed: August 24, 2007
    Publication date: August 28, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-tae KIM, Sang-dok MO, Sung-min LEE, Bok-deuk JEONG, Sang-bum SUH
  • Publication number: 20080170055
    Abstract: A connector receives first and second differential signals. First and second signal lines are connected to the connector, and transmit the first and second differential signals, respectively. First and second differential capacitors have first and second end terminals to remove noise components of the first and second differential signals. Each of the first end terminals is connected to ground potential. The second end terminals are connected to the first and second differential lines, respectively. A differential resistor is connected to the first and second signal lines to remove the noise components of the first and second differential signals. A receiving part is connected to the first and second signal lines to receive the first and second differential signals through the differential resistor and the first and second differential capacitors.
    Type: Application
    Filed: January 3, 2008
    Publication date: July 17, 2008
    Inventors: Jong-Tae Kim, Seoung-Bum Pyoun
  • Publication number: 20070262769
    Abstract: A handler for sorting semiconductor chips after they have been tested includes a loading unit for loading chips to be tested and an unloading unit for unloading chips that have been already tested. Chips arrive in trays at the loading unit, and a loading picker removes the chips from the tray. When a tray is empty, it is moved over to the unloading unit by a tray transfer mechanism so that tested chips can be placed back into the tray. The tray transfer mechanism rotates the empty trays upside down as it is moved from the loading unit to the unloading unit to ensure that the tray is completely empty before it arrives at the unloading unit.
    Type: Application
    Filed: April 23, 2007
    Publication date: November 15, 2007
    Inventor: Jong Tae Kim
  • Patent number: 7272345
    Abstract: A power coupling device including a driving coupler mounted in the driving unit having a first connection part and a first positioning part; and a driven coupler mounted in the driven part having a second connection part and a second positioning part, respectively. The driven coupler having a first coupler member fixed to the driven part; a second coupler member having the second connection part and the second positioning part for connection with the first coupler member; and a connection for connecting the first coupler member with the second coupler member to control the connecting position. The connection means has a plurality of projections formed at one of the first and the second coupler members; and a plurality of depressions formed at the other one of the first and the second coupler members.
    Type: Grant
    Filed: July 20, 2005
    Date of Patent: September 18, 2007
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Jong-Tae Kim, Geun-Yong Park
  • Publication number: 20070041747
    Abstract: An image forming apparatus having a vibration reducing member is provided. The image forming apparatus includes a photosensitive member, a developing roller, an axis of the developing roller, and a gear train for driving the developing roller. Accordingly, the quality of print image is improved by providing the vibration reducing member in which the natural frequency in the rotation direction of the developing roller is less than the exciting frequency in the direction of the developing roller.
    Type: Application
    Filed: July 12, 2006
    Publication date: February 22, 2007
    Inventors: Jong-tae Kim, Sung-dae Kim
  • Publication number: 20060181009
    Abstract: A skew adjusting apparatus is provided for an image forming apparatus having a plurality of skew adjusting parts arranged in a plurality of laser scanning units, respectively. The automatic skew adjusting apparatus comprises a driving source, an actuating part arranged on a driving shaft of the driving source so that the actuating part can be selectively connected with one of the skew adjusting parts depending on a position of the driving source. The actuating part actuates the connected skew adjusting part as the driving shaft rotates. A positioning part moves the driving source and a power transmission part transmits or cuts off the power of the driving source to the positioning part so as to move the driving source or stop the movement of the driving source.
    Type: Application
    Filed: September 13, 2005
    Publication date: August 17, 2006
    Inventors: Jong-Tae Kim, Hyun-Seong Shin
  • Publication number: 20060133853
    Abstract: A wet-type image forming apparatus includes an intermediate transfer medium for receiving images which are formed in a plurality of photosensitive media and overlapped thereon to form an image and transferring the image to a print medium. The intermediate transfer medium runs along a predetermined path. A drying unit heats the intermediate transfer medium to evaporate part of carrier included in the image on the intermediate transfer medium before the image is transferred onto the print medium. A cooling unit cools the heated intermediate transfer medium after the image is transferred onto the print medium by making the intermediate transfer medium directly contact a coolant.
    Type: Application
    Filed: November 8, 2005
    Publication date: June 22, 2006
    Inventors: Hun-Sup Kim, Hyun-Soo Kim, Jong-Tae Kim, Geun-Yong Park, Hyeong-Ill Lee, Hyun-Seong Shin
  • Publication number: 20060120774
    Abstract: An image forming apparatus having a transfer unit is provided. The transfer unit includes a transfer belt which is wound, for example, in a circular shape. A belt support unit supports and fixes edges of the transfer belt and rotates along with the transfer belt.
    Type: Application
    Filed: September 27, 2005
    Publication date: June 8, 2006
    Inventor: Jong-Tae Kim
  • Publication number: 20060018681
    Abstract: A power coupling device comprises a driving coupler mounted in the driving unit having a first connection part and a first positioning part; and a driven coupler mounted in the driven part having a second connection part and a second positioning part, respectively. The driven coupler having a first coupler member fixed to the driven part; a second coupler member having the second connection part and the second positioning part for connection with the first coupler member; and a connection means for connecting the first coupler member with the second coupler member to control the connecting position. The connection means has a plurality of projections formed at one of the first and the second coupler members; and a plurality of depressions formed at the other one of the first and the second coupler members.
    Type: Application
    Filed: July 20, 2005
    Publication date: January 26, 2006
    Inventors: Jong-Tae Kim, Geun-Yong Park
  • Patent number: 6928719
    Abstract: A method for fabricating a surface acoustic wave filter chip package includes: mounting a surface acoustic wave filter chip on a substrate; forming a underfill in a space between the substrate and the chip; forming a metal shield layer on a whole outer wall of the chip by using a spray process; and molding resins on the metal shield layer. The metal shield layer is formed from a conductive epoxy with the use of a spray nozzle.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: August 16, 2005
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hoon Kim, Chan Wang Park, Joo Hun Park, Jong Tae Kim
  • Publication number: 20050100485
    Abstract: A device for filtering discharged air of a wet-type electrophotographic image forming apparatus capable of diffusing heat transmitted from a heater and an oxidation catalyst filter to prevent transformation of a casing of the device. The filtering device comprises a heater connected to a power unit of the image forming apparatus to generate heat. An oxidation catalyst filter is disposed adjacent to the heater to filter the discharged air through a chemical reaction with the discharged air. A filter casing holds the heater and the oxidation catalyst filter inside. A filtering device casing having the filter casing at a predetermined distance inside to form an air path through which the discharged air is drawn through a discharge path of the image forming apparatus.
    Type: Application
    Filed: August 10, 2004
    Publication date: May 12, 2005
    Inventors: Jong-tae Kim, Young-sil Lee, Eun-sang Park
  • Publication number: 20040250407
    Abstract: Disclosed are a device, in which a plurality of components are vertically stacked on a substrate without any cavity being formed thereon, and a method for manufacturing the device, thereby easily manufacturing the device, improving the productivity of the device, and reducing the production cost of the device. The device of the present invention is manufactured by mounting a plurality of first components on a base substrate and forming supporters on the upper surface of the base substrate so that two or more of the supporters are arranged around each of the first components, molding the upper surface of the base substrate including the first components and the supporters, dicing the molded base substrate into device units, and mounting a second component on each of the upper surfaces of the diced parts of the base substrate.
    Type: Application
    Filed: July 12, 2004
    Publication date: December 16, 2004
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Il You, Jong Tae Kim
  • Patent number: 6777858
    Abstract: Disclosed is a ceramic package mounted with a crystal oscillator. The structure of the ceramic package is improved in order to reduce its size while minimizing thermal influence to a crystal wafer mounted on the ceramic package. The crystal oscillator ceramic package has a bottom sheet, a buffer sheet disposed on a periphery of the bottom sheet and having internal terminals on a top thereof, a crystal wafer mounted on the buffer sheet, a supporting sheet formed on a periphery of the buffer sheet and spaced from the internal terminal on the buffer sheet at a designated interval and a lib covering the supporting sheet for sealing a portion of the ceramic package for receiving the crystal wafer.
    Type: Grant
    Filed: April 16, 2003
    Date of Patent: August 17, 2004
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Shin Woong Bang, Se Young Seo, Hee Young Jun, Jong Pil Lee, Jong Tae Kim
  • Publication number: 20040140856
    Abstract: Disclosed is a ceramic package mounted with a crystal oscillator. The structure of the ceramic package is improved in order to reduce its size while minimizing thermal influence to a crystal wafer mounted on the ceramic package. The crystal oscillator ceramic package has a bottom sheet, a buffer sheet disposed on a periphery of the bottom sheet and having internal terminals on a top thereof, a crystal wafer mounted on the buffer sheet, a supporting sheet formed on a periphery of the buffer sheet and spaced from the internal terminal on the buffer sheet at a designated interval and a lib covering the supporting sheet for sealing a portion of the ceramic package for receiving the crystal wafer.
    Type: Application
    Filed: April 16, 2003
    Publication date: July 22, 2004
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Shin Woong Bang, Se Young Seo, Hee Young Jun, Jong Pil Lee, Jong Tae Kim
  • Patent number: 6750729
    Abstract: A temperature compensated crystal includes a crystal package including a package board and a crystal oscillating piece, conductive patterns for constituting a temperature compensating circuit formed on a surface of the package board, exterior terminals formed at corners of the board, temperature compensating components formed on the surface of the board, and resin molded part enveloping the surface of the board. With a lower surface of a crystal package serving as a component mounting area, it is not necessary to provide an additional printed circuit board required for mounting of temperature compensating components, and it is possible to provide a compact TCXO having a surface area corresponding to that of a crystal package.
    Type: Grant
    Filed: May 3, 2002
    Date of Patent: June 15, 2004
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong Tae Kim, Hyung Kon Kim
  • Publication number: 20040012309
    Abstract: A method of manufacturing high reliability quartz crystal oscillators and a quartz crystal oscillator produced therefrom is disclosed. In the present invention, a quartz crystal oscillating plate is mounted to a ceramic base within the top cavity of the ceramic base by means of a plurality of metal bumps. The quartz crystal oscillator has a ceramic base formed by laminating a second ceramic layer along the periphery of the top surface of a first ceramic layer. The ceramic base has a top cavity, with a plurality of electrode terminals formed on the first ceramic layer at predetermined positions and electrically connected to external electrodes. A quartz crystal oscillating plate, having a plurality of electrode patterns, is mounted to the electrode terminals of the first ceramic base within the top cavity through a plurality of metal bumps such that a remaining part of the oscillating plate except for the terminals is spaced apart from the ceramic base by a gap.
    Type: Application
    Filed: March 11, 2003
    Publication date: January 22, 2004
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong-Tae Kim, Hu-Nam Choi, Gum-Young Youn, Jong-Pil Lee
  • Publication number: 20030205837
    Abstract: Disclosed are a device, in which a plurality of components are vertically stacked on a substrate without any cavity being formed thereon, and a method for manufacturing the device, thereby easily manufacturing the device, improving the productivity of the device, and reducing the production cost of the device. The device of the present invention is manufactured by mounting a plurality of first components on a base substrate and forming supporters on the upper surface of the base substrate so that two or more of the supporters are arranged around each of the first components, molding the upper surface of the base substrate including the first components and the supporters, dicing the molded base substrate into device units, and mounting a second component on each of the upper surfaces of the diced parts of the base substrate.
    Type: Application
    Filed: June 25, 2002
    Publication date: November 6, 2003
    Applicant: Samsung Electro-Mechanics Co. Ltd.
    Inventors: Jae Il You, Jong Tae Kim