Abstract: A handler for sorting semiconductor chips after they have been tested includes a loading unit for loading chips to be tested and an unloading unit for unloading chips that have been already tested. Chips arrive in trays at the loading unit, and a loading picker removes the chips from the tray. When a tray is empty, it is moved over to the unloading unit by a tray transfer mechanism so that tested chips can be placed back into the tray. The tray transfer mechanism rotates the empty trays upside down as it is moved from the loading unit to the unloading unit to ensure that the tray is completely empty before it arrives at the unloading unit.

Abstract: A power coupling device including a driving coupler mounted in the driving unit having a first connection part and a first positioning part; and a driven coupler mounted in the driven part having a second connection part and a second positioning part, respectively. The driven coupler having a first coupler member fixed to the driven part; a second coupler member having the second connection part and the second positioning part for connection with the first coupler member; and a connection for connecting the first coupler member with the second coupler member to control the connecting position. The connection means has a plurality of projections formed at one of the first and the second coupler members; and a plurality of depressions formed at the other one of the first and the second coupler members.

Abstract: An image forming apparatus having a vibration reducing member is provided. The image forming apparatus includes a photosensitive member, a developing roller, an axis of the developing roller, and a gear train for driving the developing roller. Accordingly, the quality of print image is improved by providing the vibration reducing member in which the natural frequency in the rotation direction of the developing roller is less than the exciting frequency in the direction of the developing roller.

Abstract: A skew adjusting apparatus is provided for an image forming apparatus having a plurality of skew adjusting parts arranged in a plurality of laser scanning units, respectively. The automatic skew adjusting apparatus comprises a driving source, an actuating part arranged on a driving shaft of the driving source so that the actuating part can be selectively connected with one of the skew adjusting parts depending on a position of the driving source. The actuating part actuates the connected skew adjusting part as the driving shaft rotates. A positioning part moves the driving source and a power transmission part transmits or cuts off the power of the driving source to the positioning part so as to move the driving source or stop the movement of the driving source.

Abstract: A wet-type image forming apparatus includes an intermediate transfer medium for receiving images which are formed in a plurality of photosensitive media and overlapped thereon to form an image and transferring the image to a print medium. The intermediate transfer medium runs along a predetermined path. A drying unit heats the intermediate transfer medium to evaporate part of carrier included in the image on the intermediate transfer medium before the image is transferred onto the print medium. A cooling unit cools the heated intermediate transfer medium after the image is transferred onto the print medium by making the intermediate transfer medium directly contact a coolant.

Abstract: An image forming apparatus having a transfer unit is provided. The transfer unit includes a transfer belt which is wound, for example, in a circular shape. A belt support unit supports and fixes edges of the transfer belt and rotates along with the transfer belt.

Abstract: A power coupling device comprises a driving coupler mounted in the driving unit having a first connection part and a first positioning part; and a driven coupler mounted in the driven part having a second connection part and a second positioning part, respectively. The driven coupler having a first coupler member fixed to the driven part; a second coupler member having the second connection part and the second positioning part for connection with the first coupler member; and a connection means for connecting the first coupler member with the second coupler member to control the connecting position. The connection means has a plurality of projections formed at one of the first and the second coupler members; and a plurality of depressions formed at the other one of the first and the second coupler members.

Abstract: A method for fabricating a surface acoustic wave filter chip package includes: mounting a surface acoustic wave filter chip on a substrate; forming a underfill in a space between the substrate and the chip; forming a metal shield layer on a whole outer wall of the chip by using a spray process; and molding resins on the metal shield layer. The metal shield layer is formed from a conductive epoxy with the use of a spray nozzle.

Abstract: A device for filtering discharged air of a wet-type electrophotographic image forming apparatus capable of diffusing heat transmitted from a heater and an oxidation catalyst filter to prevent transformation of a casing of the device. The filtering device comprises a heater connected to a power unit of the image forming apparatus to generate heat. An oxidation catalyst filter is disposed adjacent to the heater to filter the discharged air through a chemical reaction with the discharged air. A filter casing holds the heater and the oxidation catalyst filter inside. A filtering device casing having the filter casing at a predetermined distance inside to form an air path through which the discharged air is drawn through a discharge path of the image forming apparatus.

Abstract: Disclosed are a device, in which a plurality of components are vertically stacked on a substrate without any cavity being formed thereon, and a method for manufacturing the device, thereby easily manufacturing the device, improving the productivity of the device, and reducing the production cost of the device. The device of the present invention is manufactured by mounting a plurality of first components on a base substrate and forming supporters on the upper surface of the base substrate so that two or more of the supporters are arranged around each of the first components, molding the upper surface of the base substrate including the first components and the supporters, dicing the molded base substrate into device units, and mounting a second component on each of the upper surfaces of the diced parts of the base substrate.

Abstract: Disclosed is a ceramic package mounted with a crystal oscillator. The structure of the ceramic package is improved in order to reduce its size while minimizing thermal influence to a crystal wafer mounted on the ceramic package. The crystal oscillator ceramic package has a bottom sheet, a buffer sheet disposed on a periphery of the bottom sheet and having internal terminals on a top thereof, a crystal wafer mounted on the buffer sheet, a supporting sheet formed on a periphery of the buffer sheet and spaced from the internal terminal on the buffer sheet at a designated interval and a lib covering the supporting sheet for sealing a portion of the ceramic package for receiving the crystal wafer.

Abstract: Disclosed is a ceramic package mounted with a crystal oscillator. The structure of the ceramic package is improved in order to reduce its size while minimizing thermal influence to a crystal wafer mounted on the ceramic package. The crystal oscillator ceramic package has a bottom sheet, a buffer sheet disposed on a periphery of the bottom sheet and having internal terminals on a top thereof, a crystal wafer mounted on the buffer sheet, a supporting sheet formed on a periphery of the buffer sheet and spaced from the internal terminal on the buffer sheet at a designated interval and a lib covering the supporting sheet for sealing a portion of the ceramic package for receiving the crystal wafer.

Abstract: A temperature compensated crystal includes a crystal package including a package board and a crystal oscillating piece, conductive patterns for constituting a temperature compensating circuit formed on a surface of the package board, exterior terminals formed at corners of the board, temperature compensating components formed on the surface of the board, and resin molded part enveloping the surface of the board. With a lower surface of a crystal package serving as a component mounting area, it is not necessary to provide an additional printed circuit board required for mounting of temperature compensating components, and it is possible to provide a compact TCXO having a surface area corresponding to that of a crystal package.

Abstract: A method of manufacturing high reliability quartz crystal oscillators and a quartz crystal oscillator produced therefrom is disclosed. In the present invention, a quartz crystal oscillating plate is mounted to a ceramic base within the top cavity of the ceramic base by means of a plurality of metal bumps. The quartz crystal oscillator has a ceramic base formed by laminating a second ceramic layer along the periphery of the top surface of a first ceramic layer. The ceramic base has a top cavity, with a plurality of electrode terminals formed on the first ceramic layer at predetermined positions and electrically connected to external electrodes. A quartz crystal oscillating plate, having a plurality of electrode patterns, is mounted to the electrode terminals of the first ceramic base within the top cavity through a plurality of metal bumps such that a remaining part of the oscillating plate except for the terminals is spaced apart from the ceramic base by a gap.

Abstract: Disclosed are a device, in which a plurality of components are vertically stacked on a substrate without any cavity being formed thereon, and a method for manufacturing the device, thereby easily manufacturing the device, improving the productivity of the device, and reducing the production cost of the device. The device of the present invention is manufactured by mounting a plurality of first components on a base substrate and forming supporters on the upper surface of the base substrate so that two or more of the supporters are arranged around each of the first components, molding the upper surface of the base substrate including the first components and the supporters, dicing the molded base substrate into device units, and mounting a second component on each of the upper surfaces of the diced parts of the base substrate.

Abstract: A temperature compensated crystal oscillator is disclosed, which comprises a crystal package including a package board and a crystal oscillating piece, conductive patterns for constituting a temperature compensating circuit formed on a surface of the package board, exterior terminals formed at corners of the board, temperature compensating components formed on the surface of the board, and resin molded part enveloping the surface of the board. With a lower surface of a crystal package serving as a component mounting area, it is not necessary to provide an additional printed circuit board required for mounting of temperature compensating components, and it is possible to provide a compact TCXO having a surface area corresponding to that of a crystal package.

Abstract: Disclosed herein is a lead bonding method for SMD packages. The lead bonding method includes the step of placing a package body with its lead-positioning surface facing upward. A lead with solder is arranged on the lead-positioning surface of the package body using vision system. The lead is spot-welded onto the package body to fix the lead to the package body. The package body spot-welded together with the lead is arranged in a positioning depression of a jig with the lead facing downward. The solder formed on the lead are melted to bond the lead to the package body.

Abstract: A system for real time three-dimensional model display in a machine tool includes a plurality of motors each capable of providing relative movement between a tool and a workpiece along an associated one of multiple axes, a servo driver for controlling the motors, a numerical controller coupled to the servo driver for transmitting target three-dimensional coordinates of points stored in a memory to the servo driver such that the motors can be caused to move into the target coordinates of points and for receiving actual three-dimensional coordinates of points fed back from the motors, and an image processor for receiving the actual three-dimensional coordinates of points from the numerical controller and for directly transmitting the actual three-dimensional coordinates of points to a display screen, so as to achieve a real time workpiece shape display based on the actual three-dimensional coordinates of points of the motors.

Abstract: Disclosed is a method for fabricating a surface acoustic wave filter chip package comprising the steps of mounting the surface acoustic wave filter chip on a substrate; forming a underfill in a space between the substrate and the surface acoustic wave filter chip; forming a metal shield layer on an whole outer wall of the surface acoustic wave filter chip by using a spray process; and molding resins on the metal shield layer. The method has advantages in that a fillet forming step for improving a step-coverage is removed by forming a metal shield layer from a conductive epoxy with the use of a spray nozzle, a one-ply metal shield layer is formed without an additional metal layer for preventing oxidation of the metal layer by forming an exterior of the SAW filter chip package with the use of a top molding process, and that a structurally stable SAW filter package can be fabricated.

Abstract: A method of manufacturing high reliability quartz crystal oscillators and a quartz crystal oscillator produced therefrom is disclosed. In the present invention, a quartz crystal oscillating plate is mounted to a ceramic base within the top cavity of the ceramic base by means of a plurality of metal bumps. The quartz crystal oscillator has a ceramic base formed by laminating a second ceramic layer along the periphery of the top surface of a first ceramic layer. The ceramic base has a top cavity, with a plurality of electrode terminals formed on the first ceramic layer at predetermined positions and electrically connected to external electrodes. A quartz crystal oscillating plate, having a plurality of electrode patterns, is mounted to the electrode terminals of the first ceramic base within the top cavity through a plurality of metal bumps such that a remaining part of the oscillating plate except for the terminals is spaced apart from the ceramic base by a gap.