Abstract: A semiconductor device and method of manufacture are provided. In embodiments a memory array is formed by manufacturing portions of a word line during different and separate processes, thereby allowing the portions formed first to act as a structural support during later processes that would otherwise cause undesired damage to the structures.

Abstract: A memory array device includes a stack of transistors over a semiconductor substrate, a first transistor of the stack being disposed over a second transistor of the stack. The first transistor includes a first memory film along a first word line and a first channel region along a source line and a bit line, the first memory film being disposed between the first channel region and the first word line. The second transistor includes a second memory film along a second word line and a second channel region along the source line and the bit line, the second memory film being disposed between the second channel region and the second word line. The memory array device includes a first via electrically connected to the first word line and a second via electrically connected to the second word line, the second staircase via and the first staircase via having different widths.

Abstract: In an embodiment of the present invention, a proton conductive oxide fuel cell comprising an electrode substrate, a proton conductive oxide electrolyte layer positioned on the electrode substrate, a proton conductive oxide reaction prevention layer positioned on the electrolyte layer, and a proton conductive oxide air electrode layer positioned on the reaction prevention layer, wherein the reaction prevention layer is composed of ABO3-? structured perovskite proton conductive oxide, may be provided.

Abstract: Some embodiments relate to an integrated chip including a substrate having a first side and a second side opposite the first side. The integrated chip further includes a first photodetector positioned in a first pixel region within the substrate. A floating diffusion region with a first doping concentration of a first polarity is positioned on the first side of the substrate in the first pixel region. A first body contact region with a second doping concentration of a second polarity different from the first polarity is positioned on the second side of the substrate in the first pixel region.

Abstract: In accordance with embodiments, a memory array is formed with a multiple patterning process. In embodiments a first trench is formed within a multiple layer stack and a first conductive material is deposited into the first trench. After the depositing the first conductive material, a second trench is formed within the multiple layer stack, and a second conductive material is deposited into the second trench. The first conductive material and the second conductive material are etched.

Abstract: A battery module includes: a battery cell stack in which a plurality of battery cells are stacked, each battery cell of the plurality of battery cells including a portion of a battery case body extended outward as a cell terrace, a busbar frame connected to the battery cell stack, electrode leads protruding from the cell terraces, respectively, of the plurality of battery cells, and a partition wall disposed between immediately adjacent electrode leads and formed on the busbar frame, the partition wall located between the cell terrace protruding from an outermost battery cell of the plurality of battery cells in the battery cell stack and the cell terrace protruding from the battery cell immediately adjacent to the outermost battery cell.

Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.

Abstract: Disclosed is a battery module, which includes: a battery cell assembly having at least one battery cell; a module case configured to accommodate the battery cell assembly; and at least one injection hole provided in a bottom portion of the module case to inject a thermally conductive adhesive into the module case.

Abstract: A device structure according to the present disclosure may include a first die having a first substrate and a first interconnect structure, a second die having a second substrate and a second interconnect structure, and a third die having a third interconnect structure and a third substrate. The first interconnect structure is bonded to the second substrate via a first plurality of bonding layers. The second interconnect structure is bonded to the third interconnect structure via a second plurality of bonding layers. The third substrate includes a plurality of photodiodes and a first transistor. The second die includes a second transistor having a source connected to a drain of the first transistor, a third transistor having a gate connected to drain of the first transistor and the source of the second transistor, and a fourth transistor having a drain connected to the source of the third transistor.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor including first chip and a second chip. The first chip includes a first substrate, a plurality of photodetectors disposed in the first substrate, a first interconnect structure disposed on a front side of the first substrate, and a first bond structure disposed on the first interconnect structure. The second chip underlies the first chip. The second chip includes a second substrate, a plurality of semiconductor devices disposed on the second substrate, a second interconnect structure disposed on a front side of the second substrate, and a second bond structure disposed on the second interconnect structure. A first bonding interface is disposed between the second bond structure and the first bond structure. The second interconnect structure is electrically coupled to the first interconnect structure by way of the first and second bond structures.

Abstract: A semiconductor device includes channels, a gate structure, and a source/drain layer. The channels are disposed at a plurality of levels, respectively, and spaced apart from each other in a vertical direction on an upper surface of a substrate. The gate structure is disposed on the substrate, at least partially surrounds a surface of each of the channels, and extends in a first direction substantially parallel to the upper surface of the substrate. The source/drain layer is disposed at each of opposite sides of the gate structure in a second direction substantially parallel to the upper surface of the substrate and substantially perpendicular to the first direction and is connected to sidewalls of the channels. A length of the gate structure in the second direction changes along the first direction at a first height from the upper surface of the substrate in the vertical direction.

Abstract: An integrated circuit (IC) device includes: a fin-type active area protruding from a substrate and extending in a first horizontal direction; a first nanosheet disposed above an upper surface of the fin-type active area with a first separation space therebetween; a second nanosheet disposed above the first nanosheet with a second separation space therebetween; a gate line extending on the substrate in a second horizontal direction intersecting the first horizontal direction, at least a portion of the gate line being disposed in the second separation space; and a bottom insulation structure disposed in the first separation space.

Abstract: Provided herein is a memory device that may include a string, a voltage generation circuit, a page buffer, and a channel initializing circuit. The string may include select transistors and memory cells coupled in series between a bit line and a source line. The page buffer may be configured to precharge or discharge the bit line. The voltage generation circuit may be configured to apply a turn-on voltage or a turn-off voltage to select lines coupled to the select transistors, apply at least one operating voltage to word lines coupled to the memory cells, or discharge the select lines or the word lines. The channel initializing circuit may be configured to control the voltage generation circuit and the page buffer so as to initialize a channel of the string when an operation performed on the memory cells is completed or is suspended before being completed.

Abstract: The wake-up detection device may include a sensor configured to detect a movement of a person and a biosignal of the person; and a controller configured to analyze the movement and the biosignal recognized by the sensor, and determine whether the person wakes up from sleep, on the basis of a result of analyzing the movement and the biosignal. The controller may determine a change in a heart rate of the person when the person converts from a sleep state to a non-sleep state, and when it is determined that the change in the heart rate and the movement of the person increase, the controller may output a first alarm.

Abstract: A method of acupuncture needle packaging includes inserting an acupuncture needle body of an acupuncture needle including an acupuncture needle handle at an upper portion thereof into an acupuncture needle tube starting from the acupuncture needle handle; disposing the acupuncture needle in the acupuncture needle tube in a state in which the upper portion of the acupuncture needle handle is exposed to an exterior of the acupuncture needle tube; ascending the upper portion of the acupuncture needle handle exposed to the exterior using a pressing jig; irradiating a laser to an area where the acupuncture needle tube and the acupuncture needle handle abut each other; and coupling the acupuncture needle handle and the acupuncture needle tube by thermally deforming the area where the acupuncture needle tube and the acupuncture needle handle abut each other with a heat generated by the laser.

Abstract: Proposed is a wireless communication-based system for managing a lubricating oil injection apparatus, the system including: a lubricating oil injection apparatus being installed in an industrial mechanical apparatus and automatically operating in a situational manner, thereby injecting lubricating oil; a monitoring unit being installed in the lubricating oil injection apparatus, checking a state thereof, generating a first signal containing information on the checked state, and transmitting the generated first signal to the outside through wireless communication; a user terminal receiving the first signal from the monitoring unit, outputting the information on the checked state, the information being contained in the first signal, and transmitting the first signal to the outside; a management server receiving the first signal from the user terminal; and a database receiving the first signal from the management server and storing the received first signal on a per lubricating oil injection apparatus basis.

Abstract: Proposed is a wireless communication-based system for managing a lubricating oil injection apparatus, the system including: a lubricating oil injection apparatus being installed in an industrial mechanical apparatus and automatically operating in a situational manner, thereby injecting lubricating oil; a monitoring unit being installed in the lubricating oil injection apparatus, checking a state thereof, generating a first signal containing information on the checked state, and transmitting the generated first signal to the outside through wireless communication; a user terminal receiving the first signal from the monitoring unit, outputting the information on the checked state, the information being contained in the first signal, and transmitting the first signal to the outside; a management server receiving the first signal from the user terminal; and a database receiving the first signal from the management server and storing the received first signal on a per lubricating oil injection apparatus basis.

Abstract: A light-emitting device includes an emission structure, a current block layer on the emission structure, a reflective layer on the current block layer, a protection layer that covers the reflective layer, and an electrode layer on the protection layer.

Abstract: A light-emitting device includes an emission structure, a current block layer on the emission structure, a reflective layer on the current block layer, a protection layer that covers the reflective layer, and an electrode layer on the protection layer.

Abstract: A method of acupuncture needle packaging includes inserting an acupuncture needle body of an acupuncture needle including an acupuncture needle handle at an upper portion thereof into an acupuncture needle tube starting from the acupuncture needle handle; disposing the acupuncture needle in the acupuncture needle tube in a state in which the upper portion of the acupuncture needle handle is exposed to an exterior of the acupuncture needle tube; ascending the upper portion of the acupuncture needle handle exposed to the exterior using a pressing jig; irradiating a laser to an area where the acupuncture needle tube and the acupuncture needle handle abut each other; and coupling the acupuncture needle handle and the acupuncture needle tube by thermally deforming the area where the acupuncture needle tube and the acupuncture needle handle abut each other with a heat generated by the laser.