Abstract: A method for displaying a route of a navigation terminal by using a drawing gesture includes determining a first route from a departure point to a destination by receiving a drawing gesture for determining the first route and displaying information on the first route. The drawing gesture is formed by free movement of a touch point on a touch display of the navigation terminal that is displaying a map, and the free movement is movement of a touch point that is not limited to a road included in the map.

Abstract: A packaging device including bumps and a method of manufacturing the packaging device are presented. In the method of manufacturing a packaging device, a dielectric layer that covers a packaging base is formed and a lower layer is formed over a packaging base including first and second connecting pads. A plurality of dummy bumps that overlaps with the dielectric layer is formed. A sealing pattern that covers the dummy bumps, filling areas between the dummy bumps, is formed. A lower layer pattern in which the plurality of dummy bumps have been disposed is formed by removing portions of the lower layer that are exposed and do not overlap with the sealing pattern.

Abstract: A semiconductor device includes: a first stack including first material layers and second material layers that are alternately stacked; a penetration structure extending through the first stack and including an air gap; and a second stack located under the first stack and Including a key pattern located to correspond to the air gap.

Abstract: A semiconductor device is provided with differently-shaped conductive through-vias, having different-shape horizontal cross-sections. The cross-sectional shapes of the via include but are not limited to circular and ring shaped, which are cross sections that correspond to vias that are pillar shaped and tube-shaped respectively.

Abstract: A packaging device including bumps and a method of manufacturing the packaging device are presented. In the method of manufacturing a packaging device, a dielectric layer that covers a packaging base is formed and a lower layer is formed over a packaging base including first and second connecting pads. A plurality of dummy bumps that overlaps with the dielectric layer is formed. A sealing pattern that covers the dummy bumps, filling areas between the dummy bumps, is formed. A lower layer pattern in which the plurality of dummy bumps have been disposed is formed by removing portions of the lower layer that are exposed and do not overlap with the sealing pattern.

Abstract: The present invention relates to a control collaboration method for an area that requires a patrol or inspection work, such as an urban area or a large building, in which a control room computer 10 and a mobile terminal 50 of a field agent are connected to a control server 30, and a CPS server 40 equipped with a CPS model 41 is connected to the control server 30, so that location information and video information 17 transmitted from the mobile terminal 50 are output to be combined with a model object 18 provided by the CPS model 41. Through the present invention, as information can be shared smoothly between field agents and the control room in performing control works in a wide area such as a large building, an urban area, or the like, the field agents may faithfully utilize information provided by the digital twin CPS server 40, and control room workers may accurately and quickly grasp the situations at the scene.

Abstract: A battery control apparatus and a method are disclosed. A processor of the battery control apparatus may identify average open-circuit voltage (OCV) corresponding to all of a plurality of state-of-charge (SOC) sections by performing at least one of charging a battery, discharging the battery, or any combination thereof by using a designated current smaller than or equal to a threshold current. The processor may obtain a hysteresis parameter according to each of the plurality of SOC sections of the battery by using at least one of the battery information, the average OCV, or any combination thereof. The processor may identify the SOC of the battery while performing at least one of charging the battery, discharging the battery, or any combination thereof, by using the hysteresis parameter and a Kalman filter according to each of the plurality of SOC sections.

Abstract: The present invention relates to a video monitoring method in an area where a plurality of CCTV cameras is installed, such as an urban area. As a digital twin Cyber Physical System (CPS) is constructed, and a control server connected to a camera and a computer connected to the control server are configured, and a model object generated from a CPS model and video information transmitted from the camera are collected in the control server and transmitted to the computer, users may confirm a digital twin-based model object together with actually captured video information. Through the present invention, it is possible to immediately and clearly confirm surrounding spaces, as well as the location of a camera transmitting specific video information in video monitoring of a wide area such as urban areas, and efficiency and accuracy of viewing the video information of a plurality of cameras can be dramatically improved.

Abstract: The present disclosure relates to a substrate processing apparatus that controls supply of a process gas through a valve block. The substrate processing apparatus includes a substrate support on which a substrate is supported, a shower head part provided to face the substrate support and configured to inject a process gas toward the substrate, and a gas supply part configured to supply the process gas to the shower head part. The gas supply part includes a valve block part installed on an upper portion of the shower head part to adjust a flow of the process gas.

Abstract: A multilayer electronic component includes a body including a dielectric layer and a plurality of internal electrodes, and external electrodes. The internal electrodes each include a main portion and a lead-out portion extending from the main portion and having a connection terminal in contact with a corresponding one of the external electrodes. A width of the lead-out portion gradually decreases from the main portion to the connection terminal. The main portion includes a first saddle portion disposed on an end portion spaced apart from the lead-out portion, and the lead-out portion includes a second saddle portion disposed on a side end portion. Thicknesses of the first and second saddle portions are greater than a thickness of a central portion of the main portion. The lead-out portion of one internal electrode has an overlap region overlapping the main portion of a neighboring internal electrode among the plurality of internal electrodes.

Abstract: Provided is a process monitoring method including injecting a laser beam capable of forming excited carriers in a thin film, irradiating an electromagnetic wave onto the thin film while the excited carriers in the thin film are recombining, measuring characteristic information of the electromagnetic wave reacting with the excited carriers in the thin film, and determining whether the thin film is normal, by comparing reference data to a result using the measured characteristic information of the electromagnetic wave.

Abstract: Provided is a substrate processing apparatus that performs respectively processes on a plurality of substrates in a plurality of sub chambers. The substrate processing apparatus includes a plurality of sub chambers in which processes are performed on a substrate, respectively, and a common exhaust part connected to the plurality of sub chambers to exhaust the inside of each of the plurality of sub chambers. Each of the plurality of sub chambers includes a substrate support on which the substrate is supported, a shower head provided to face the substrate support and configured to supply a process gas toward the substrate, an exhaust port provided below the substrate support and connected to the common exhaust part, and a flow control part including a cover plate provided along a circumference of the substrate support and configured to adjust an exhaust flow of the process gas to a lower portion of the substrate support.

Abstract: Provided are a process gas supply device, which stably controls a temperature of a process gas to supply the process gas, and a substrate processing system including the same. The process gas supply device includes a gas hub to which a process gas is supplied from a gas supply source, a plurality of gas lines branched from the gas hub to transfer the supplied process gas, and an integrated heater part provided to surround the plurality of gas lines and the gas hub so as to heat the gas hub and the plurality of gas lines at the same time.

Abstract: Provided is a semiconductor structure defect monitoring method including injecting a laser beam into a semiconductor structure to form excited carriers in the semiconductor structure; irradiating an electromagnetic wave onto the semiconductor structure while the excited carriers in the semiconductor structure are recombining; measuring characteristic information of the electromagnetic wave reacting with the excited carriers in the semiconductor structure; and determining a defect density or defect distribution of the semiconductor structure by using a parameter including the measured characteristic information of the electromagnetic wave.

Abstract: Provided is a thin film monitoring method including: injecting a laser beam into a thin film on a substrate to form excited carriers in the thin film, irradiating an electromagnetic wave onto the thin film while the excited carriers in the thin film are recombining, measuring characteristic information of the electromagnetic wave reacting with the excited carriers in the thin film, and determining composition uniformity or defect distribution of the thin film based on locations on the substrate by using a parameter including the measured characteristic information of the electromagnetic wave.

Abstract: Example memory controllers are disclosed. An example memory controller may include a PHY module including a first PHY terminal connected to a plurality of pins of a device connector, a MAC module including a first MAC terminal that is enabled to form a first lane with the first PHY terminal, and a second MAC terminal that is disabled without being connected to the first PHY terminal, a switch controller configured to receive a signal of a host connector connected to the device connector from at least one of the plurality of pins and output a switch signal in response to the signal of the host connector, and a switch configured to disable the second MAC terminal and form the first lane by connecting the first PHY terminal to the first MAC terminal in response to the switch signal.

Abstract: A display device is provided. A display device including a plurality of light-output areas through which incident light is emitted and a light-blocking area which blocks the incident light, the display device includes a substrate, a bank layer which is disposed in the light-blocking area on the substrate and defines a plurality of openings, each of which is disposed in one of the plurality of light-output areas, and a color control pattern disposed in the opening of the bank layer, wherein the bank layer includes a first bank area which has a first thickness and defines the plurality of openings and a second bank area which is disposed between the plurality of openings and has a second thickness smaller than the first thickness.

Abstract: There are provided a semiconductor and a method of fabricating the same. The semiconductor device may include a second semiconductor substrate directly bonded to a first semiconductor substrate. The first semiconductor substrate may include a first through via with an end portion protruding through a first top surface, the first top surface being a top surface of a first semiconductor substrate body, a liner extending to partially expose a side surface of the end portion of the first through via, and a first diffusion barrier layer. The liner may include a third top surface that is positioned at a lower height than a second top surface, the second top surface being a top surface of the end portion of the first through via and substantially equal to the first top surface. Alternatively, the liner may include a third surface positioned at a height that is lower than the second top surface and higher than the first top surface.