Abstract: A semiconductor package includes: semiconductor chips being offset-stacked to expose edge regions adjacent to first side surfaces; chip pads disposed in each of the edge regions of the semiconductor chips, the chip pads including a plurality of first chip pads arranged in a first column and a plurality of second chip pads arranged in a second column; a horizontal common interconnector having one end connected to the second chip pad of a semiconductor chip of the semiconductor chips, and another end connected to the first chip pad of another semiconductor chip; and a vertical common interconnector having one end connected to the second chip pad of the uppermost semiconductor chip, which is electrically connected to the first chip pad of the uppermost semiconductor chip connected to the horizontal common interconnector.

Abstract: The present invention provides a patch for attaching to teeth or a surrounding part of teeth, and the patch can be easily removed by tooth brushing alone.

Abstract: A color filter panel includes: a base substrate having a first pixel area, a second pixel area, and a light blocking area between the first pixel area and the second pixel area; a first color filter on the base substrate in the first pixel area; a second color filter on the base substrate in the second pixel area; a first photoluminescence pattern on the first color filter in the first pixel area and configured to convert a color of light; and a second photoluminescence pattern on the second color filter in the second pixel area and configured to convert a color of light. The second photoluminescence pattern partially overlaps the first photoluminescence pattern in the light blocking area.

Abstract: A system and a method for providing a gifting service between a first country and a second country can include a service server of a first country receives a gift-giving request from a buyer client of the first country; the service server of the first country provides a plurality of product lists for each brand to the buyer client of the first country; the service server of the first country receives a selection of a specific product from the plurality of product lists from the buyer client of the first country; the service server of the first country requests payment for the specific product to the buyer client of the first country; and upon completion of payment, the service server of the first country requests a gift-giving of the specific product to a service server of a second country.

Abstract: There are provided a semiconductor and a method of fabricating the same. The semiconductor device may include a second semiconductor substrate directly bonded to a first semiconductor substrate. The first semiconductor substrate may include a first through via with an end portion protruding through a first top surface, the first top surface being a top surface of a first semiconductor substrate body, a liner extending to partially expose a side surface of the end portion of the first through via, and a first diffusion barrier layer. The liner may include a third top surface that is positioned at a lower height than a second top surface, the second top surface being a top surface of the end portion of the first through via and substantially equal to the first top surface. Alternatively, the liner may include a third surface positioned at a height that is lower than the second top surface and higher than the first top surface.

Abstract: A capacitor component includes a body including a dielectric layer and internal electrode layers, with the dielectric layer interposed therebetween; and an external electrode disposed on the body and connected to the internal electrode layers. Each of the internal electrode layers has a capacitance formation portion disposed to overlap an adjacent internal electrode layer, and a lead-out portion extending from the capacitance formation portion and connected to the external electrode. A ratio (H2/H1) of a height difference H2 to a height difference H1 is 0.2 or less, where the height difference H2 is a height difference between the capacitance formation portion and the lead-out portion of a lowermost internal electrode layer the height difference H1 is a height difference between the capacitance formation portion and the lead-out portion of an uppermost internal electrode layer. An average thickness of the dielectric layer is 420 nm or less.

Abstract: The present disclosure relates to a hair transplanter mounting module which is mounted on a robot arm configured with a plurality of arms and a plurality of joints, and an automatic hair transplant device having the same, and in an embodiment, the hair transplanter mounting module includes: a bracket which is coupled to the robot arm; a first sliding block which is installed on the bracket and is slidable in a vertical direction with respect to the bracket; and a second sliding block which is installed on the bracket and is disposed at one side of the first sliding block in parallel, and is slidable in the vertical direction with respect to the bracket, and a multi-channel hair transplanter module is removably mounted on the first sliding block.

Abstract: A color conversion panel and a display device are provided to include: substrate; a transparent filter layer and a plurality of first partitioning wall layers that are on the substrate; a first refractive layer that is on the transparent filter layer and the plurality of first partitioning wall layers; a plurality of second partitioning wall layers that are on the first refractive layer, and overlap the plurality of first partitioning wall layers; and a plurality of color conversion layers that are on the first refractive layer, and in a region defined by the plurality of first partitioning wall layers and the plurality of second partitioning wall layers.

Abstract: A color conversion substrate includes a first bank structure, a second bank structure, a spacer, and a color conversion layer. The first bank structure includes a first partition wall that has a first opening area and a second opening area, and that divides the second opening area into a central area and a peripheral area that surrounds the central area. The second bank structure is spaced apart from the first partition wall and disposed in a central area of the second opening area. The spacer is disposed to overlap the second bank structure. The color conversion layer is disposed in the first opening area and includes a color conversion particle.

Abstract: A display device includes: a display layer in which a plurality of light emitting regions are defined; a barrier rib disposed on the display layer and having a plurality of first openings overlapping the plurality of light emitting regions defined therein; and a plurality of optical patterns disposed in the plurality of first openings. The barrier rib may include a first portion around the plurality of first openings and a second portion spaced apart from the plurality of first openings with the first portion therebetween, and the first portion may be more liquid repellent than the second portion.

Abstract: The display panel includes an upper display substrate including a display area and a non-display area adjacent to the display area and a lower display substrate that faces the upper display substrate to emit first color light, the lower display substrate including a plurality of display elements respectively overlapping the pixel areas. The display area includes a plurality of pixel areas and a light blocking area adjacent to the pixel areas. The upper display substrate includes a base substrate, a first light control layer on the base substrate to control the first color light, a capping layer including an absorption part overlapping the display area and on the first light control layer and a barrier part overlapping the light blocking area and protruding from the absorption part in a thickness direction of the base substrate, and a second light control layer on the barrier part.

Abstract: A display device having a first substrate including lower electrodes, an upper electrode and a light-emitting layer disposed between the lower electrodes and the upper electrode. A second substrate is combined with the first substrate and defines light-emitting areas. The second substrate includes a color filter layer overlapping the light-emitting areas. A light-blocking member overlaps a light-blocking area surrounding the light-emitting areas. The light-blocking member includes openings overlapping the lower electrodes.

Abstract: A semiconductor package includes: a second semiconductor chip including a second through electrode that penetrates a second body portion and a second connection electrode that is connected to one end of the second through electrode; a first semiconductor chip stack disposed over the second semiconductor chip and including a plurality of first semiconductor chips, each of the plurality of first semiconductor chips includes a first through electrode and a first connection electrode connected to one end of the first through electrode; a molding layer; a third semiconductor chip disposed over the molding layer and the first semiconductor chip stack; and an external connection electrode electrically connected to an other end of the second through electrode, wherein, the second semiconductor chip and the plurality of first semiconductor chips are electrically connected through the second through electrode, the second connection electrode, the first through electrodes, and the first connection electrodes.

Abstract: Example memory controllers are disclosed. An example memory controller may include a PHY module including a first PHY terminal connected to a plurality of pins of a device connector, a MAC module including a first MAC terminal that is enabled to form a first lane with the first PHY terminal, and a second MAC terminal that is disabled without being connected to the first PHY terminal, a switch controller configured to receive a signal of a host connector connected to the device connector from at least one of the plurality of pins and output a switch signal in response to the signal of the host connector, and a switch configured to disable the second MAC terminal and form the first lane by connecting the first PHY terminal to the first MAC terminal in response to the switch signal.

Abstract: A display device that includes a plurality of pixels arranged in a row direction and a column direction crossing the row direction. The display device includes a first substrate including light-emitting elements each disposed in the respective pixels. A second substrate faces the first substrate. A plurality of optical patterns are disposed on the second substrate in pixel columns, respectively, and extend along the column direction. Light-blocking patterns are disposed on the second substrate. The light-blocking patterns include a main light-blocking pattern extending along pixel column boundaries and fill spaces between adjacent optical patterns, and a subsidiary light-blocking pattern disposed on the optical patterns at pixel row boundaries and having a thickness smaller than a thickness of the main light-blocking pattern.

Abstract: A display device includes: a substrate including an alignment area in a non-display area, and a display area including a plurality of material layers on the substrate; in the alignment area, a plurality of keys including a first alignment key and a second alignment key. Each alignment key includes a light blocking pattern, a layer pattern and a display pattern. The position of the display pattern within the first alignment key is different from the position of the display pattern within the second alignment key, the layer pattern of the alignment key and one material layer among the plurality of material layers are respective portions of a same material layer on the substrate, and the layer pattern of the first alignment key and the layer pattern of the second alignment key are respective portions of different material layers among the plurality of material layers on the substrate.

Abstract: A semiconductor package is described. The semiconductor packager includes a chip stack mounted over a package substrate, a first wire disposed over the package substrate, and a molding layer surrounding the chip stack and the first wire. The first wire has an acute angle.

Abstract: A display panel includes a first substrate which includes a display device and a second substrate which is disposed on the first substrate. The second substrate covers a base layer, a color filter layer, a first sealing layer, a color control layer, a step compensating layer, and a second sealing layer. The base layer includes a display area and a non-display area adjacent to the display area. The color filter layer overlaps the display area in a plan view, and is disposed under the base layer. The first sealing layer covers the color filter layer. The color control layer overlaps the display area in the plan view, and is disposed under the first sealing layer. The step compensating layer overlaps the non-display area in the plan view, and is disposed under the base layer. The second sealing layer covers the color control layer and the step compensating layer.

Abstract: A color conversion substrate includes: a bank having a first open region and a second open region; a color conversion layer in the first opening region, the color conversion layer including color conversion particles; a first partition wall partitioning the second opening region into a central region and a peripheral region surrounding the central region, the first partition wall having a polygonal shape with n vertices in a plan view where n is a natural number greater than or equal to 3; and n second partition walls extending from the n vertices of the first partition wall to an edge of the second opening region, respectively, to partition the peripheral region into n sub-regions.