Abstract: Proposed is a method of efficiently storing critical information in a secure place within a hardware security module. The method includes: generating, by a host, access control request information for requesting control of access to a secure data piece associated with at least one application program when the at least one application program is executed; authenticating, by a security module, the at least one application program according to the access control request information; and processing, by the security module, the access control request information according to a result of the authenticating.

Abstract: A semiconductor device includes a substrate, a conductive pattern, a side spacer, and an air gap. The substrate includes an interlayer insulating layer and a trench penetrating the interlayer insulating layer. The conductive pattern is disposed within the trench of the substrate. The side spacer is disposed within the trench. The side spacer covers an upper side surface of the conductive pattern. The air gap is disposed within the trench. The air gap is bounded by a sidewall of the trench, the side spacer, and a lower side surface of the conductive pattern. A level of a bottom surface of the conductive pattern is lower than a level of bottom surfaces of the side spacer.

Abstract: An organic layer deposition apparatus, and a method of manufacturing an organic light-emitting display device using the organic layer deposition apparatus. The organic layer deposition apparatus includes: an electrostatic chuck that fixedly supports a substrate that is a deposition target; a deposition unit including a chamber maintained at a vacuum and an organic layer deposition assembly for depositing an organic layer on the substrate fixedly supported by the electrostatic chuck; and a first conveyor unit for moving the electrostatic chuck fixedly supporting the substrate into the deposition unit, wherein the first conveyor unit passes through inside the chamber, and the first conveyor unit includes a guide unit having a receiving member for supporting the electrostatic chuck to be movable in a direction.

Abstract: A semiconductor device includes a metal pattern filling a trench formed through at least a portion of an insulating interlayer on a substrate and including copper, and a wetting improvement layer pattern in the metal pattern including at least one of tantalum, tantalum nitride, titanium, titanium nitride, ruthenium, cobalt and manganese.

Abstract: A deposition apparatus includes: a transfer unit including a first transfer unit and a second transfer unit, wherein the first transfer unit transfers, in a first direction, a moving unit to which a substrate is detachably fixed, and the second transfer unit transfers, in an opposite direction of the first direction, the moving unit from which the substrate is separated, and a deposition unit including a deposition assembly wherein the deposition assembly deposits a material on the substrate spaced apart from the deposition assembly while the first transfer unit transfers the substrate which is fixed to the moving unit, wherein the first transfer unit includes a first support unit that supports both ends of the moving unit in the first direction, and a second support unit that supports a side of the moving unit opposite to a side close to the deposition assembly.

Abstract: An organic layer deposition apparatus, and a method of manufacturing an organic light-emitting display device using the organic layer deposition apparatus. The organic layer deposition apparatus includes: an electrostatic chuck that fixedly supports a substrate that is a deposition target; a deposition unit including a chamber maintained at a vacuum and an organic layer deposition assembly for depositing an organic layer on the substrate fixedly supported by the electrostatic chuck; and a first conveyer unit for moving the electrostatic chuck fixedly supporting the substrate into the deposition unit, wherein the first conveyer unit passes through inside the chamber, and the first conveyer unit includes a guide unit having a receiving member for supporting the electrostatic chuck to be movable in a direction.

Abstract: An organic layer deposition apparatus, and a method of manufacturing an organic light-emitting display device using the organic layer deposition apparatus. The organic layer deposition apparatus includes: an electrostatic chuck that fixedly supports a substrate that is a deposition target; a deposition unit including a chamber maintained at a vacuum and an organic layer deposition assembly for depositing an organic layer on the substrate fixedly supported by the electrostatic chuck; and a first conveyor unit for moving the electrostatic chuck fixedly supporting the substrate into the deposition unit, wherein the first conveyor unit passes through inside the chamber, and the first conveyor unit includes a guide unit having a receiving member for supporting the electrostatic chuck to be movable in a direction.

Abstract: A thin film deposition apparatus includes: a deposition source that discharges a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in the first direction; a position detection member that detects a relative position of the substrate to the patterning slit sheet; and an alignment control member that controls a relative position of the patterning slit sheet to the substrate by using the relative position of the substrate detected by the position detection member, wherein the thin film deposition apparatus and the substrate are separated from each other, and the thin film deposition apparatus and the substrate are moved relative to each other.

Abstract: A semiconductor device includes a metal pattern filling a trench formed through at least a portion of an insulating interlayer on a substrate and including copper, and a wetting improvement layer pattern in the metal pattern including at least one of tantalum, tantalum nitride, titanium, titanium nitride, ruthenium, cobalt and manganese.

Abstract: A semiconductor device includes a metal pattern filling a trench formed through at least a portion of an insulating interlayer on a substrate and including copper, and a wetting improvement layer pattern in the metal pattern including at least one of tantalum, tantalum nitride, titanium, titanium nitride, ruthenium, cobalt and manganese.

Abstract: A semiconductor device includes a substrate, a conductive pattern, a side spacer, and an air gap. The substrate includes an interlayer insulating layer and a trench penetrating the interlayer insulating layer. The conductive pattern is disposed within the trench of the substrate. The side spacer is disposed within the trench. The side spacer covers an upper side surface of the conductive pattern. The air gap is disposed within the trench. The air gap is bounded by a sidewall of the trench, the side spacer, and a lower side surface of the conductive pattern. A level of a bottom surface of the conductive pattern is lower than a level of bottom surfaces of the side spacer.

Abstract: An apparatus for reading identification information of a biosensor is provided, including a biosensor sensing unit detecting the biosensor, a light-emitting unit emitting light on an identification information recording unit when the biosensor sensing unit detects the biosensor, the identification information recording unit having the identification information of the biosensor recorded thereon, a light-receiving unit that receives the light emitted from the light-emitting unit, and reflected or refracted by or passing through the identification information recording section and an identification information reading unit analyzing the light received by the light-receiving unit and reading the identification information of the biosensor.

Abstract: A semiconductor device includes a substrate, a conductive pattern, a side spacer, and an air gap. The substrate includes an interlayer insulating layer and a trench penetrating the interlayer insulating layer. The conductive pattern is disposed within the trench of the substrate. The side spacer is disposed within the trench. The side spacer covers an upper side surface of the conductive pattern. The air gap is disposed within the trench. The air gap is bounded by a sidewall of the trench, the side spacer, and a lower side surface of the conductive pattern. A level of a bottom surface of the conductive pattern is lower than a level of bottom surfaces of the side spacer.

Abstract: A biosensor is provided, including an identification information recording unit having identification information of the biosensor recorded thereon, where the identification information recording unit is a color tag that is attached on the biosensor and indicates the identification information by color, chroma of color, or arrangement pattern of colors.

Abstract: A thin film deposition apparatus includes: a deposition source that discharges a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in the first direction; a position detection member that detects a relative position of the substrate to the patterning slit sheet; and an alignment control member that controls a relative position of the patterning slit sheet to the substrate by using the relative position of the substrate detected by the position detection member, wherein the thin film deposition apparatus and the substrate are separated from each other, and the thin film deposition apparatus and the substrate are moved relative to each other.

Abstract: An apparatus for reading identification information of a biosensor is provided, including a biosensor sensing unit detecting the biosensor, a light-emitting unit emitting light on an identification information recording unit when the biosensor sensing unit detects the biosensor, the identification information recording unit having the identification information of the biosensor recorded thereon, a light-receiving unit that receives the light emitted from the light-emitting unit, and reflected or refracted by or passing through the identification information recording section, and an identification information reading unit analyzing the light received by the light-receiving unit and reading the identification information of the biosensor.

Abstract: A method of manufacturing an organic light-emitting display device is provided. An alignment master member is loaded on a moving unit. An organic layer deposition assembly is pre-aligned to the alignment master member. After the pre-aligning of the organic layer deposition assembly, a substrate is loaded on the moving unit. The organic layer deposition assembly is aligned to the substrate positioned as is after the loading of the substrate. An organic layer is formed on the substrate while the moving unit is moving along the moving direction. While the moving unit is moving along the moving direction, the organic layer deposition assembly is adjusted so that an interval between the organic layer deposition assembly and part of the substrate is maintained as substantially constant. The part of the substrate receives a deposition material emitted from the organic layer deposition assembly to form the organic layer.

Abstract: Provided is a sputtering apparatus which deposits a metal catalyst on an amorphous silicon layer at an extremely low concentration in order to crystallize amorphous silicon, and particularly minimizes non-uniformity of the metal catalyst caused by a pre-sputtering process without reducing process efficiency. This sputtering apparatus improves the uniformity of the metal catalyst deposited on the amorphous silicon layer at an extremely low concentration. The sputtering apparatus includes a process chamber having first and second regions, a metal target located inside the process chamber, a target transfer unit moving the metal target and having a first shield for controlling a traveling direction of a metal catalyst discharged from the metal target, and a substrate holder disposed in the second region to be capable of facing the metal target.

Abstract: Provided is a sputtering apparatus which deposits a metal catalyst on an amorphous silicon layer at an extremely low concentration in order to crystallize amorphous silicon, and particularly minimizes non-uniformity of the metal catalyst caused by a pre-sputtering process without reducing process efficiency. This sputtering apparatus improves the uniformity of the metal catalyst deposited on the amorphous silicon layer at an extremely low concentration. The sputtering apparatus includes a process chamber having first and second regions, a metal target located inside the process chamber, a target transfer unit moving the metal target and having a first shield for controlling a traveling direction of a metal catalyst discharged from the metal target, and a substrate holder disposed in the second region to be capable of facing the metal target.

Abstract: A thin film deposition apparatus includes: a deposition source that discharges a deposition material; a deposition source nozzle unit disposed at a side of the deposition source and including a plurality of deposition source nozzles arranged in a first direction; a patterning slit sheet disposed opposite to the deposition source nozzle unit and including a plurality of patterning slits arranged in the first direction; a position detection member that detects a relative position of the substrate to the patterning slit sheet; and an alignment control member that controls a relative position of the patterning slit sheet to the substrate by using the relative position of the substrate detected by the position detection member, wherein the thin film deposition apparatus and the substrate are separated from each other, and the thin film deposition apparatus and the substrate are moved relative to each other.