Abstract: A display panel includes a substrate including a display area and a pad area, a plurality of pad electrodes disposed on the pad area, and an insulating layer disposed between adjacent ones of the plurality of pad electrodes and including a heat absorbing particle. A laser is irradiated to heat the insulating layer, and the heat absorbing particle in the insulating layer absorbs the heat and cures an anisotropic conductive film by heat transfer to electrically connect the plurality of pad electrodes to a plurality of bump electrodes.

Abstract: An apparatus for manufacturing a display device comprises a stage, a panel cell disposed on the stage and including a first alignment line, and a second alignment line extending parallel to the first alignment line, a field application part providing an alignment signal to the first alignment line and the second alignment line of the panel cell, and light-emitting elements aligned between the first alignment line and the second alignment line. The field application part provides an alignment signal to the first alignment line and the second alignment line, the alignment signal having the same positive integral value and negative integral value, having a different positive peak voltage from the alignment signal's negative peak voltage, and having a different positive pulse width from the alignment signal's negative pulse width.

Abstract: A display device includes a circuit board including multiple circuit pads, a display panel including multiple pad regions and multiple non-pad regions alternately arranged in a first direction, and a conductive adhesive member electrically connecting the circuit board and the display panel and including a photoinitiator. The display panel includes multiple display pads respectively corresponding to the circuit pads, arranged in the first direction, and disposed in the pad regions, respectively, and a base layer disposed under the display pads and having multiple openings. The openings are arranged in the first direction and disposed in the non-pad regions, respectively, and a width of each of the plurality of display pads in the first direction is less than a width of each of the plurality of circuit pads in the first direction.

Abstract: A display device includes a first substrate that includes a first electrode, a second substrate disposed under the first substrate and that includes, a second electrode that overlaps the first electrode, and an anisotropic conductive film disposed between the first substrate and the second substrate. The anisotropic conductive film includes an insulating resin layer and a plurality of conductive particles in the insulating resin layer. The conductive particles include first conductive particles that overlap the first electrode and the second electrode, and second conductive particles other than the first conductive particles. Each of the first conductive particles and the second conductive particles includes a first flat surface, a second flat surface that faces the first flat surface, and a curved surface rounded between the first flat surface and the second flat surface.

Abstract: A method of manufacturing a display device including the steps of providing a lower substrate having a display area and a pad area, forming a display structure in the display area of the lower substrate, forming pad electrodes in the pad area of the lower substrate to be spaced apart from each other in a first direction parallel to a top surface of the lower substrate, forming an upper substrate on the display structure to face the lower substrate in the display area, forming a conductive film member including a non-cured resin layer and conductive balls arranged in a lattice shape on the pad electrodes, the non-cured resin layer overlapping the pad electrodes, and forming a film package on the non-cured resin layer, the film package including bump electrodes overlapping the pad electrodes.

Abstract: A display device includes: a substrate, a display pad disposed on the substrate, and a circuit board including an electrode facing the display pad. The display pad includes: a first pad electrode disposed on the substrate; a second pad electrode disposed on the first pad electrode, overlapping the first pad electrode in a thickness direction, and electrically connected to the first pad electrode; and insulating members spaced apart from each other with a top surface of the second pad electrode interposed therebetween, and disposed on the second pad electrode while covering opposite edges of the top surface of the second pad electrode and opposite side surfaces of the second pad electrode.

Abstract: A display device includes a display panel including a first signal pad and a second signal pad, a circuit board overlapped with the first and second signal pads, and an adhesive film overlapped with the first and second signal pads and disposed between the circuit board and the display panel. The adhesive film includes a base resin and a plurality of conductive balls dispersed in the base resin. The circuit board includes a first driving pad and a second driving pad. The first and second driving pads protrude toward the adhesive film and are arranged in a first direction. The first and second driving pads overlap with the first and second signal pads, respectively. The display device may be configured to satisfy the inequality: T ? G + B × S W + S .

Abstract: An apparatus for manufacturing a display device comprises a stage, a panel cell disposed on the stage and including a first alignment line, and a second alignment line extending parallel to the first alignment line, a field application part providing an alignment signal to the first alignment line and the second alignment line of the panel cell, and light-emitting elements aligned between the first alignment line and the second alignment line. The field application part provides an alignment signal to the first alignment line and the second alignment line, the alignment signal having the same positive integral value and negative integral value, having a different positive peak voltage from the alignment signal’s negative peak voltage, and having a different positive pulse width from the alignment signal’s negative pulse width.

Abstract: A display device comprises banks spaced apart from each other on a substrate, a first electrode disposed on the banks, a second electrode disposed on the banks and spaced apart from the first electrode, and a light emitting element disposed on the first electrode and the second electrode. The first electrode and the second electrode cover the banks. The first electrode includes a first electrode portion overlapping the banks in a plan view and a first pattern portion separated from the first electrode portion. The second electrode includes a second electrode portion overlapping the banks in a plan view and a second pattern portion separated from the second electrode portion.

Abstract: An apparatus for manufacturing a display device includes a panel cell disposed on a stage and comprising a first alignment line and a second alignment line extending in at least one direction, an electric field applying part that supplies a first alignment signal and a second alignment signal to the panel cell, and a light emitting element aligned between the first and second alignment lines. The electric field applying part supplies the first and second alignment signals having a potential difference to the first and second alignment lines, respectively, during a first period, and supplies the first and second alignment signals having a same potential to the first and second alignment lines, respectively, during a second period after the first period.

Abstract: The disclosure relates to a display device and an anisotropic conductive film. An anisotropic conductive film disposed between a display panel and a printed circuit board, the anisotropic conductive film including a base resin, a plurality of first conductive balls dispersed in the base resin, each of the plurality of first conductive balls including a core made of a polymer material and at least one metal layer surrounding the core, and a plurality of second conductive balls dispersed in the base resin, each of the plurality of second conductive balls being made of a meltable material, and the anisotropic conductive film having a first area in which the anisotropic conductive film overlaps the first pad electrode and the first lead electrode in a thickness direction of the display device, and a second area as an area disposed between the first lead electrode and the second lead electrode.

Abstract: A circuit board includes a board, first connection pads disposed on the board and arranged in a first direction, second connection pads disposed on the board and arranged in the first direction, a driving chip disposed on the board and between the first connection pads and the second connection pads, and a first adhesive layer disposed on the board and overlapping with an entirety of the first connection pads in a plan view. The second connection pads are spaced apart from the first connection pads in a second direction perpendicular to the first direction.

Abstract: There is provided a an apparatus for manufacturing a display device. An apparatus for manufacturing a display device comprises a body generating ultrasonic vibration; and a horn including a horn body portion connected to the body and amplifying the ultrasonic vibration and a horn tip portion connected to the horn body portion and applying the ultrasonic vibration onto a bonding object, wherein the horn body portion includes at least one body groove surrounded by the horn body portion and completely penetrating the horn body portion in a thickness direction from the surface of the horn body portion.

Abstract: A circuit board includes a board, first connection pads disposed on the board and arranged in a first direction, second connection pads disposed on the board and arranged in the first direction, the second connection pads spaced apart from the first connection pads in a second direction perpendicular to the first direction, and a driving chip disposed on the board between the first connection pads and the second connection pads. Each of the first connection pads includes a first conductive layer disposed on the board, a second conductive layer which entirely overlaps with the first conductive layer in a plan view, is disposed on the first conductive layer and is formed of a different material from that of the first conductive layer, and a third conductive layer entirely overlapping with the second conductive layer and disposed on the second conductive layer.

Abstract: A display device includes: a panel including a plurality of panel pads; a circuit board including a plurality of connection pads corresponding to the plurality of panel pads, respectively; and a layer disposed between the panel and the circuit board and including a plurality of conductive particles. The layer includes: an overlapping portion that overlaps the plurality of panel pads and the plurality of connection pads in a first direction; and a non-overlapping portion that does not overlap the plurality of panel pads and the plurality of connection pads in the first direction. In the non-overlapping portion, the conductive particles are adjacent to one side of one panel pad of adjacent panel pads in a second direction intersecting the first direction.

Abstract: A display panel includes a substrate including a display area and a pad area, a plurality of pad electrodes disposed on the pad area, and an insulating layer disposed between adjacent ones of the plurality of pad electrodes and including a heat absorbing particle. A laser is irradiated to heat the insulating layer, and the heat absorbing particle in the insulating layer absorbs the heat and cures an anisotropic conductive film by heat transfer to electrically connect the plurality of pad electrodes to a plurality of bump electrodes.

Abstract: A display device includes a first substrate that includes a first electrode, a second substrate disposed under the first substrate and that includes, a second electrode that overlaps the first electrode, and an anisotropic conductive film disposed between the first substrate and the second substrate. The anisotropic conductive film includes an insulating resin layer and a plurality of conductive particles in the insulating resin layer. The conductive particles include first conductive particles that overlap the first electrode and the second electrode, and second conductive particles other than the first conductive particles. Each of the first conductive particles and the second conductive particles includes a first flat surface, a second flat surface that faces the first flat surface, and a curved surface rounded between the first flat surface and the second flat surface.

Abstract: A circuit board includes a board, first connection pads disposed on the board and arranged in a first direction, second connection pads disposed on the board and arranged in the first direction, a driving chip disposed on the board and between the first connection pads and the second connection pads, and a first adhesive layer disposed on the board and overlapping with an entirety of the first connection pads in a plan view. The second connection pads are spaced apart from the first connection pads in a second direction perpendicular to the first direction.

Abstract: A circuit board includes a board, first connection pads disposed on the board and arranged in a first direction, second connection pads disposed on the board and arranged in the first direction, a driving chip disposed on the board and between the first connection pads and the second connection pads, and a first adhesive layer disposed on the board and overlapping with an entirety of the first connection pads in a plan view. The second connection pads are spaced apart from the first connection pads in a second direction perpendicular to the first direction.

Abstract: A method of manufacturing a display device including the steps of providing a lower substrate having a display area and a pad area, forming a display structure in the display area of the lower substrate, forming pad electrodes in the pad area of the lower substrate to be spaced apart from each other in a first direction parallel to a top surface of the lower substrate, forming an upper substrate on the display structure to face the lower substrate in the display area, forming a conductive film member including a non-cured resin layer and conductive balls arranged in a lattice shape on the pad electrodes, the non-cured resin layer overlapping the pad electrodes, and forming a film package on the non-cured resin layer, the film package including bump electrodes overlapping the pad electrodes.