Abstract: A panel bottom assembly includes a light-blocker with first concave patterns formed on a top surface thereof. A vibration acoustic device is disposed below, and coupled to, the light-blocker. A buffer is disposed below the light-blocker. A bonding is disposed between the light-blocker and the vibration acoustic device. The bonding has second concave patterns formed on a top surface thereof. The second concave patterns are different from the first concave patterns.

Abstract: According to one aspect of the invention, a display device includes: a first layer having a display area and a non-display area adjacent thereto, the first layer including first and second pads overlapping the non-display area and spaced apart from each other in a first direction; a second layer including third and fourth pads that respectively face the first and second pads in a thickness direction of the first layer; and an adhesive layer disposed between the first and second layers and including and a plurality of conductive groups spaced apart from each other in the first direction and distributed along a second direction generally perpendicular to the first direction, wherein the conductive groups comprise conductive particles arranged in the second direction, and the adhesive layer has a thickness greater than about 0.5 times to about 2.0 times a diameter of the conductive particles.

Abstract: A bonding apparatus and method includes: a stage configured to fix a first electric component; a pressing unit configured to press a conductive adhesive film and a second electric component onto the first electric component; a driver configured to control movement of the pressing unit along a direction; and a plurality of sensors at different positions on the stage and configured to sense a change in capacitance with the pressing unit, wherein the pressing unit includes a flat metal material in first regions facing the plurality of sensors.

Abstract: A display device includes a display panel, a circuit board, and a conductive adhesive member. The display panel includes a display area and a non-display area adjacent the display area. The circuit board overlaps the non-display area and is connected to the display panel. The conductive adhesive member is between and electrically connects the circuit board and the display panel. The circuit board includes: a base layer including a pad area; circuit pads overlapping the pad area and on the base layer, the circuit pads being spaced apart in a plan view and arranged in a direction; and a first resin layer overlapping the pad area and on the base layer. In a plan view, the first resin layer overlaps an area between two adjacent circuit pads and covers side surfaces of the two adjacent circuit pads facing in the direction.

Abstract: A display device includes a display module and a circuit board. The display module includes a base substrate, which includes a display area and a non-display area adjacent to the display area, and a first pad positioned on the base substrate and overlapping the non-display area. The circuit board includes a first board and a second pad positioned on the first board and contacting the first pad, wherein the second pad is provided with a first metal layer of a single material.

Abstract: A display device including a lower substrate having a display area and a pad area, a display structure disposed in the display area of the lower substrate, an upper substrate disposed on the display structure in the display area, and facing the lower substrate, pad electrodes disposed in the pad area of the lower substrate and spaced apart from each other in a first direction parallel to a top surface of the lower substrate, a conductive film member including conductive balls disposed on the pad electrodes and having a first area overlapping the pad electrodes and a second area not overlapping the pad electrodes, and a film package disposed on the conductive film member and including bump electrodes overlapping the first area of the conductive film member, in which the shape of the conductive balls disposed in the first area is different from those disposed in the second area.

Abstract: A display device includes: a panel including a plurality of panel pads; a circuit board including a plurality of connection pads corresponding to the plurality of panel pads, respectively; and a layer disposed between the panel and the circuit board and including a plurality of conductive particles. The layer includes: an overlapping portion that overlaps the plurality of panel pads and the plurality of connection pads in a first direction; and a non-overlapping portion that does not overlap the plurality of panel pads and the plurality of connection pads in the first direction. In the non-overlapping portion, the conductive particles are adjacent to one side of one panel pad of adjacent panel pads in a second direction intersecting the first direction.

Abstract: A display device includes a display panel including a first signal pad and a second signal pad, a circuit board overlapped with the first and second signal pads, and an adhesive film overlapped with the first and second signal pads and disposed between the circuit board and the display panel. The adhesive film includes a base resin and a plurality of conductive balls dispersed in the base resin. The circuit board includes a first driving pad and a second driving pad. The first and second driving pads protrude toward the adhesive film and are arranged in a first direction. The first and second driving pads overlap with the first and second signal pads, respectively. The display device may be configured to satisfy the inequality: T ? G + B × S W + S .

Abstract: A display device includes a display module and a circuit board. The display module includes a base substrate, which includes a display area and a non-display area adjacent to the display area, and a first pad positioned on the base substrate and overlapping the non-display area. The circuit board includes a first board and a second pad positioned on the first board and contacting the first pad, wherein the second pad is provided with a first metal layer of a single material.

Abstract: According to one aspect of the invention, a display device includes: a first layer having a display area and a non-display area adjacent thereto, the first layer including first and second pads overlapping the non-display area and spaced apart from each other in a first direction; a second layer including third and fourth pads that respectively face the first and second pads in a thickness direction of the first layer; and an adhesive layer disposed between the first and second layers and including and a plurality of conductive groups spaced apart from each other in the first direction and distributed along a second direction generally perpendicular to the first direction, wherein the conductive groups comprise conductive particles arranged in the second direction, and the adhesive layer has a thickness greater than about 0.5 times to about 2.0 times a diameter of the conductive particles.

Abstract: A panel bottom assembly includes a light-blocker with first concave patterns formed on a top surface thereof. A vibration acoustic device is disposed below, and coupled to, the light-blocker. A buffer is disposed below the light-blocker. A bonding is disposed between the light-blocker and the vibration acoustic device. The bonding has second concave patterns formed on a top surface thereof. The second concave patterns are different from the first concave patterns.

Abstract: A display device including a lower substrate having a display area and a pad area, a display structure disposed in the display area of the lower substrate, an upper substrate disposed on the display structure in the display area, and facing the lower substrate, pad electrodes disposed in the pad area of the lower substrate and spaced apart from each other in a first direction parallel to a top surface of the lower substrate, a conductive film member including conductive balls disposed on the pad electrodes and having a first area overlapping the pad electrodes and a second area not overlapping the pad electrodes, and a film package disposed on the conductive film member and including bump electrodes overlapping the first area of the conductive film member, in which the shape of the conductive balls disposed in the first area is different from those disposed in the second area.

Abstract: A panel bottom assembly includes a light-blocker with first concave patterns formed on a top surface thereof. A vibration acoustic device is disposed below, and coupled to, the light-blocker. A buffer is disposed below the light-blocker. A bonding is disposed between the light-blocker and the vibration acoustic device. The bonding has second concave patterns formed on a top surface thereof. The second concave patterns are different from the first concave patterns.

Abstract: A circuit board includes a board, first connection pads disposed on the board and arranged in a first direction, second connection pads disposed on the board and arranged in the first direction, a driving chip disposed on the board and between the first connection pads and the second connection pads, and a first adhesive layer disposed on the board and overlapping with an entirety of the first connection pads in a plan view. The second connection pads are spaced apart from the first connection pads in a second direction perpendicular to the first direction.

Abstract: A circuit board includes a board, first connection pads disposed on the board and arranged in a first direction, second connection pads disposed on the board and arranged in the first direction, the second connection pads spaced apart from the first connection pads in a second direction perpendicular to the first direction, and a driving chip disposed on the board between the first connection pads and the second connection pads. Each of the first connection pads includes a first conductive layer disposed on the board, a second conductive layer which entirely overlaps with the first conductive layer in a plan view, is disposed on the first conductive layer and is formed of a different material from that of the first conductive layer, and a third conductive layer entirely overlapping with the second conductive layer and disposed on the second conductive layer.

Abstract: There is provided a an apparatus for manufacturing a display device. An apparatus for manufacturing a display device comprises a body generating ultrasonic vibration; and a horn including a horn body portion connected to the body and amplifying the ultrasonic vibration and a horn tip portion connected to the horn body portion and applying the ultrasonic vibration onto a bonding object, wherein the horn body portion includes at least one body groove surrounded by the horn body portion and completely penetrating the horn body portion in a thickness direction from the surface of the horn body portion.

Abstract: A bonding apparatus and method includes: a stage configured to fix a first electric component; a pressing unit configured to press a conductive adhesive film and a second electric component onto the first electric component; a driver configured to control movement of the pressing unit along a direction; and a plurality of sensors at different positions on the stage and configured to sense a change in capacitance with the pressing unit, wherein the pressing unit includes a flat metal material in first regions facing the plurality of sensors.

Abstract: A display device includes a display module and a circuit board. The display module includes a base substrate, which includes a display area and a non-display area adjacent to the display area, and a first pad positioned on the base substrate and overlapping the non-display area. The circuit board includes a first board and a second pad positioned on the first board and contacting the first pad, wherein the second pad is provided with a first metal layer of a single material.

Abstract: A panel bottom assembly includes a light-blocker with first concave patterns formed on a top surface thereof. A vibration acoustic device is disposed below, and coupled to, the light-blocker. A buffer is disposed below the light-blocker. A bonding is disposed between the light-blocker and the vibration acoustic device. The bonding has second concave patterns formed on a top surface thereof. The second concave patterns are different from the first concave patterns.

Abstract: A method of manufacturing an organic light-emitting display apparatus includes preparing a lower substrate comprising a display area and a peripheral area surrounding the display area. A first thin film transistors (TFTs) is formed in the display area of the lower substrate. A first insulating layer is formed and disposed in the display area and at least a portion of the peripheral area of the lower substrate and that covers the first TFTs. Organic light-emitting diodes (OLEDs) are formed to be electrically connected to the first TFTs. A barrier layer is formed on at least a portion of the first insulating layer that is formed in the peripheral area of the lower substrate. A sealant is formed on the barrier layer such that at least a portion of the sealant overlaps the first insulating layer, and an upper substrate is sealed with the lower substrate.