Abstract: An organic light emitting device includes a substrate, first and second ohmic contacts formed on the substrate, a driving semiconductor formed on the substrate and the first and second ohmic contacts and including polysilicon, a driving input electrode electrically connected to the first ohmic contact, a driving output electrode electrically connected to the second ohmic contact, a first gate insulating layer formed on the driving semiconductor, the driving input electrode, and the driving output electrode, and a driving control electrode formed on the first gate insulating layer and overlapping the driving semiconductor.

Abstract: A thin film transistor array panel for an X-ray detector includes a dummy pixel including a photo diode and a TFT for detecting leakage current. The photo diode includes first and second electrodes (178,195) facing each other and a photo-conductive layer (800) disposed between the first electrode and the second electrode. The TFT includes a semiconductor layer (150), a gate electrode (123), a source electrode (173) connected to a data line, a drain electrode (175) connected to the photo diode. The dummy pixel further includes a light blocking layer (196) for blocking light incident on the photo diode. Alternatively, the semiconductor layer is disconnected between the source electrode and the drain electrode.

Abstract: In an OELD panel capable of decreasing a cross-talk and an OELD apparatus having the OELD panel, a switching part is formed in a unit pixel defined by a data line and a scan line to control the output of a data signal in response to a scan signal. A current supply line is disposed on at least two sides of the unit pixel to transfer a current. The sides of the unit pixel are disposed adjacent to one another. An organic electro luminescent part generates a light in response to the current. A driving part is disposed between the organic electro luminescent part and the current supply line to control the current in response to the data signal outputted from the switching part. Therefore, the current supply line forms a net shape to decrease a cross-talk.

Abstract: The present invention relates to an organic light emitting device and a manufacturing method thereof. An organic light emitting device includes a first substrate, a thin film structure disposed on the first substrate, a second substrate comprising an inner surface and an outer surface, a first sealing member disposed between the first substrate and the second substrate, the first sealing member comprising an inner surface and an outer surface, and a second sealing member disposed on the outer surface of the second substrate.

Abstract: The present invention relates to an OLED display and a manufacturing method thereof, including a substrate, a control electrode formed on the substrate, a polysilicon semiconductor formed on the control electrode, a data line including an input electrode at least partially overlapping the polysilicon semiconductor and an output electrode facing the input electrode, an insulating layer covering the data line and the output electrode and having a contact hole, a gate line connected to the control electrode through the contact hole, and a pixel electrode connected to the output electrode.

Abstract: An organic electro-luminescent display (OELD) device for processing multi-color gray-scale data, comprises a four-color converting part for converting primary RGB gray-scale data into compensated RGBW gray-scale data by adding white gray-scale data to the primary RGB gray-scale data, a data driving part for processing the compensated RGBW gray-scale data provided from the four-color converting part to generate four-color signals in an analog type, a scan driving part for generating scan signals in sequence, and an OELD panel for emitting light with a color in response to the four-color signals from the data driving part and the scan signals from the scan driving part.

Abstract: In an apparatus of forming a thin film, the apparatus has a printing chamber that forms a thin film on a substrate. The apparatus has at least two drying chambers that receive the substrate on which the thin film is formed and dry the thin film on the substrate. The two drying chambers may be independently controlled. Accordingly, the apparatus may reduce process time for forming the thin film without contamination of the substrate.

Abstract: A thin film transistor substrate that includes a substrate, first and second gate electrodes that are formed on the substrate, a gate insulating layer that is formed on the first and second gate electrodes, a first semiconductor and a second semiconductor that are formed on the gate insulating layer, and that overlap the first gate electrode and the second gate electrode, respectively, a first source electrode and a first drain electrode that are formed on the first semiconductor, and positioned opposed to and spaced from each other, a source electrode connected to the first drain electrode and a second drain electrode positioned opposed to and spaced from the second source electrode, wherein the second source and second drain electrodes are formed on the second semiconductor, and a pixel electrode that is electrically connected to the second drain electrode, a method of manufacturing the same, and a display apparatus having the same.

Abstract: In a method of manufacturing a thin film transistor substrate, a semiconductor pattern is formed on a substrate, a first etch stop layer and a second etch stop layer are sequentially formed on the semiconductor pattern, and the second etch stop layer and the first etch stop layer are sequentially patterned to form a second etch stop pattern and a first etch stop pattern. Thus, when the second etch stop layer is patterned using an etchant, the first etch stop layer covers the semiconductor pattern, thereby preventing the semiconductor pattern from being etched by the etchant.

Abstract: A thin film transistor according to one or more embodiments of the present invention includes: an insulation substrate; a gate electrode formed on the substrate; a gate insulating layer formed on the gate electrode; a semiconductor formed on the gate insulating layer and having a pair of openings facing each other; ohmic contact layers formed in the openings and including a conductive impurity; and a source electrode and a drain electrode in contact with their respective ohmic contact layers. An organic light emitting device in accordance with an embodiment includes: a first signal line and a second signal line intersecting each other on an insulation substrate; a switching thin film transistor connected to the first signal line and the second signal line; a driving thin film transistor connected to the switching thin film transistor; and a light emitting diode (LED) connected to the driving thin film transistor.

Abstract: In an apparatus for supplying a droplet on a substrate and a method of manufacturing a display apparatus, the apparatus includes a base body, a dropping unit and a vapor supplying unit. The base body corresponds to the substrate disposed on a stage. The dropping unit is disposed on the base body. The dropping unit includes a nozzle to drop the droplet on the substrate. The vapor supplying unit is disposed adjacent to the dropping unit to supply the droplet dropped onto the substrate with a volatile solvent vapor. Therefore, an evaporation rate of the droplet dropped onto pixels is adjusted to uniformize a thickness of the layer, thereby improving the image display quality.

Abstract: A driving circuit for an organic light emitting display apparatus includes first and second switching elements and a driving element. The first switching element is controlled by a scan signal supplied from a scan line. The second switching element is controlled by the scan signal. The driving element provides an end of an organic electroluminescent element with a first reference voltage via the second switching element. The driving element has amorphous silicon thin film transistors so that the manufacturing cost of the organic light emitting display apparatus may be reduced.

Abstract: A thin film transistor is provided, which includes: a semiconductor layer including an intrinsic portion; a gate electrode overlapping the intrinsic portion; a gate insulating layer disposed between the semiconductor layer and the gate electrode; and source and drain electrodes that have edges opposing each other with respect to the intrinsic portion of the semiconductor layer and are connected to the semiconductor layer, wherein the intrinsic portion has a curved surface contacting the gate insulating layer.

Abstract: A method of manufacturing a transistor and a method of manufacturing an organic electroluminescence display are disclosed. When an amorphous silicon layer is crystallized, a silicon oxide layer formed on a polysilicon layer is subsequently patterned. Impurity ions are implanted into first and second regions of the amorphous silicon layer to form first and second doped regions. The silicon oxide layer is patterned so that the silicon oxide layer may be removed from an ohmic contact region of the polysilicon layer, and covers only a channel region of the polysilicon layer.

Abstract: A display device including a plurality of pixels is disclosed. Each of the pixels includes a switching transistor, a plurality of scanning lines connected to the switching transistors and a plurality of data lines connected to the switching transistors. The scanning lines transmit a gate turn-on voltage that turns on the switching transistors and a gate turn-off voltage that turns off the switching transistors and the data lines transmit a data voltage. The gate turn-on voltage is determined based on a maximum value of the data voltage. The gate turn-on voltage based on the maximum value of the data voltage results in high luminance and less crosstalk phenomenon.

Abstract: An organic light emitting device and a manufacturing method thereof, including a first signal line and a second signal line intersecting each other on an insulating substrate, a switching thin film transistor connected to the first signal line and the second signal line, a driving thin film transistor connected to the switching thin film transistor, and a light emitting diode (“LD”) connected to the driving thin film transistor. The driving thin film transistor includes a driving control electrode and a driving semiconductor overlapping the driving control electrode, crystallized silicon having a doped region and a non-doped region, a driving gate insulating layer disposed between the driving control electrode and the driving semiconductor, and a driving input electrode and a driving output electrode opposite to each other on the driving semiconductor, wherein the interface between the driving gate insulating layer and the driving semiconductor includes nitrogen gas.

Abstract: In a thin film transistor substrate, an active pattern of a thin film transistor includes a lower semiconductor pattern and an upper semiconductor pattern that are patterned through different process steps. The lower semiconductor pattern defines a channel area of the thin film transistor, and the upper semiconductor pattern is connected to a side portion of the lower semiconductor pattern and makes contact with the source electrode and the drain electrode. An etch stop layer is formed on the lower semiconductor pattern corresponding to the channel area, and the etch stop layer is formed through the same patterning process as the lower semiconductor pattern. Also, an ohmic contact pattern is formed on the upper semiconductor pattern, and the ohmic contact pattern is formed by the same patterning process as the upper semiconductor pattern.

Abstract: A thin film transistor array substrate is provided. The substrate includes an insulating substrate, a first signal line formed on the insulating substrate, a first insulating layer formed on the first signal line, a second signal line formed on the first insulating layer while crossing over the first signal line, a thin film transistor connected to the first and the second signal lines, a second insulating layer formed on the thin film transistor, the second insulating layer having dielectric constant about 4.0 or less, and the second insulating layer having a first contact hole exposing a predetermined electrode of the thin film transistor, and a first pixel electrode formed on the second insulating layer while being connected to the predetermined electrode of the thin film transistor through the first contact hole.

Abstract: The present invention provides an organic light emitting device and a manufacturing method thereof. An organic light emitting device in accordance with an exemplary embodiment of the present invention includes: a thin film structure formed on a substrate; a first color filter formed on the thin film structure; a first insulating layer formed on the first color filter; a first transflective metal member formed on the first insulating layer and positioned on the first color filter; a second insulating layer formed on the first transflective metal member; a first transparent electrode formed on the second insulating layer and positioned on the first transflective metal member; a first pixel electrode formed on the first transparent electrode; a white organic light emitting member formed on the first pixel electrode; and a common electrode formed on the white organic light emitting member.

Abstract: A display substrate comprises a substrate; a source electrode arranged on the substrate; a drain electrode arranged on the substrate and spaced from the source electrode; a semiconductor layer arranged on the source electrode and the drain electrode; an insulating layer arranged on the semiconductor layer; and a gate electrode arranged on the insulating layer, wherein the semiconductor layer comprises: a first ohmic contact region that overlays an upper surface and a side surface of the source electrode; a second ohmic contact region that overlays an upper surface and a side surface of the drain electrode; and a channel region that is spaced from the source and drain electrodes and interconnects the first ohmic contact region and the second ohmic contact region.