Abstract: Methods of fabricating phase change memory elements include forming an insulating layer on a semiconductor substrate, forming a through hole penetrating the insulating layer, forming a lower electrode in the through hole and forming a recess having a sidewall comprising a portion of the insulating layer by selectively etching a surface of the lower electrode relative to the insulating layer. A phase change memory layer is formed on the lower electrode. The phase change memory layer has a portion confined by the recess and surrounded by the insulating layer. An upper electrode is formed on the phase change memory layer. Phase change memory elements are also provided.

Abstract: Disclosed herein are slurry compositions for use in CMP(chemical mechanical polishing) process of metal wiring in manufacturing semiconductor devices, comprising a peroxide, an inorganic acid, a propylenediaminetetraacetate(PDTA)-metal complex, a carboxylic acid, a metal oxide powder, and de-ionized water, wherein the PDTA-metal complex plays a major role in improving overall polishing performance and reproducibility thereof by preventing abraded tungsten oxide from readhesion onto the polished surface, as well as in improving the dispersion stability of the slurry composition.

Abstract: A dielectric layer is formed on a region of a microelectronic substrate. A sacrificial layer is formed on the dielectric layer, and portions of the sacrificial layer and the dielectric layer are removed to form an opening that exposes a portion of the region. A conductive layer is formed on the sacrificial layer and in the opening. Portions of the sacrificial layer and the conductive layer on the dielectric layer are removed to leave a conductive plug in the dielectric layer and in contact with the region. Removal of the sacrificial layer and portions of the conductive layer on the dielectric layer may include polishing to expose the sacrificial layer and to leave a conductive plug in the sacrificial layer and the dielectric layer, etching the sacrificial layer to expose the dielectric layer and leave a portion of the conductive plug protruding from the dielectric layer, and polishing to remove the protruding portion of the conductive plug.

Abstract: A protection layer is formed on a semiconductor substrate having a cell array region and an alignment key region. A plurality of data storage elements are formed on the protection layer in the cell array region. An insulating layer is formed on the data storage elements, a barrier layer is formed on the insulating layer, and a sacrificial layer is formed on the barrier layer. The sacrificial layer, the barrier layer and the insulating layer are patterned to form contact holes that expose the data storage elements, and conductive plugs are formed in the contact holes. The sacrificial layer is etched to leave portions of the conductive plugs protruding from the barrier layer. The protruding portions of the conductive plugs are removed by polishing.

Abstract: Chemical mechanical apparatuses including a polishing pad conditioning unit for improving a conditioning rate and wear uniformity of a polishing pad are provided. In one aspect, a chemical mechanical polishing apparatus includes a polishing pad conditioner including conditioning disks disposed in a radial direction of a planarizing surface of a circular polishing pad and contacted with the planarizing surface of the circular polishing pad during rotation of the circular polishing pad. The conditioning disks are connected to first drive units supported by an arm disposed over the circular polishing pad and extended in a radial direction of a planarizing surface of the circular polishing pad. The arm is connected to second drive units. The second drive units move the arm horizontally and reciprocally in the radial direction of the planarizing surface of the circular polishing pad. Thus, a conditioning rate and wear uniformity of the polishing pad may be improved.

Abstract: Disclosed herein are slurry compositions for use in CMP (chemical mechanical polishing) process of metal wiring in manufacturing semiconductor devices, comprising a peroxide, an inorganic acid, a propylenediaminetetraacetate (PDTA)-metal complex, a carboxylic acid, a metal oxide powder, and de-ionized water, wherein the PDTA-metal complex plays a major role in improving overall polishing performance and reproducibility thereof by preventing abraded tungsten oxide from readhesion onto the polished surface, as well as in improving the dispersion stability of the slurry composition.

Abstract: An integrated circuit device includes a substrate that has a pair of conductive structures disposed thereon. An insulating interlayer is on the substrate between the pair of conductive structures. The insulating interlayer includes a carbon-containing silicon oxide layer on the substrate and a silicon oxide layer on the carbon-containing silicon oxide layer.

Abstract: The present invention relates to a novel process for preparing hepatitis C virus (HCV) envelope glycoproteins employing Chinese Hamster Ovary (CHO) cells transformed with recombinant expression vectors containing the hepatitis C virus genome. The present invention provides CHO cells cotransfected with DHFR (dihydrofolate reductase) minigene pDCHIP and recombinant expression vectors containing cDNAs of HCV E1 and E2/NS1 ligated with tissue plasminogen activator signal sequence. HCV E1 and E2/NS1 envelope glycoproteins are produced in a massive manner from the transformed CHO cells adapted in methotrexate. The HCV envelope glycoproteins produced by the present invention can be applied to the development of a diagnostic reagent and a potential preventive HCV vaccine.

Abstract: A clothes washing machine includes outer and inner tubs, the inner tub being rotatable to perform a spin-dry operation. An oscillating pulsator is disposed in the inner tub for agitating water and laundry in the inner tub. A pumping member disposed below the pulsator is oscillatable along with the pulsator for pumping water upwardly through a central opening in the pulsator to generate an upward water current in a center of the inner tube which minimizes entanglement of clothes during a wash cycle.