Patents by Inventor Joseph Abys
Joseph Abys has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8349393Abstract: Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.Type: GrantFiled: July 29, 2004Date of Patent: January 8, 2013Assignee: Enthone Inc.Inventors: Yung-Herng Yau, Thomas B. Richardson, Joseph A. Abys, Karl F. Wengenroth, Anthony Fiore, Chen Xu, Chonglun Fan, John Fudala
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Patent number: 8323741Abstract: A composition for enhancing the corrosion resistance of an article comprising a silver coating deposited on a solderable copper substrate. The composition comprises: a) a multi-functional molecule comprising at least one organic functional group that interacts with and protects copper surfaces and at least one organic functional group that interacts with and protects silver surfaces; b) an alcohol; and c) a surfactant.Type: GrantFiled: July 10, 2012Date of Patent: December 4, 2012Inventors: Joseph A. Abys, Shenliang Sun, Theodore Antonellis
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Publication number: 20120285834Abstract: There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.Type: ApplicationFiled: July 24, 2012Publication date: November 15, 2012Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Jingye Li, Edward J. Kudrak, JR., Chen Xu
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Publication number: 20120276409Abstract: A method for enhancing the corrosion resistance of an article comprising a silver coating deposited on a solderable copper substrate is provided. The method comprises exposing the copper substrate having the immersion-plated silver coating thereon to an anti-corrosion composition comprising: a) a multi-functional molecule comprising at least one organic functional group that interacts with and protects copper surfaces and at least one organic functional group that interacts with and protects silver surfaces; b) an alcohol; and c) a surfactant.Type: ApplicationFiled: July 10, 2012Publication date: November 1, 2012Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Shenliang Sun, Theodore Antonellis
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Patent number: 8226807Abstract: There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.Type: GrantFiled: October 20, 2008Date of Patent: July 24, 2012Assignee: Enthone Inc.Inventors: Joseph A. Abys, Jingye Li, Edward J. Kudrak, Jr., Chen Xu
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Publication number: 20120175022Abstract: A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule comprising at least one functional group that interacts with and protects copper surfaces.Type: ApplicationFiled: July 5, 2011Publication date: July 12, 2012Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Shenliang Sun, Theodore Antonellis
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Patent number: 8216645Abstract: A method for enhancing the corrosion resistance of an article comprising a silver coating deposited on a solderable copper substrate is provided. The method comprises exposing the copper substrate having the immersion-plated silver coating thereon to an anti-corrosion composition comprising: a) a multi-functional molecule comprising at least one organic functional group that interacts with and protects copper surfaces and at least one organic functional group that interacts with and protects silver surfaces; b) an alcohol; and c) a surfactant.Type: GrantFiled: November 10, 2008Date of Patent: July 10, 2012Assignee: Enthone Inc.Inventors: Joseph A. Abys, Shenliang Sun, Theodore Antonellis
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Publication number: 20120168075Abstract: An adhesion promotion composition and method for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The adhesion promotion composition comprises a multi-functional compound comprising a first functional group and a second functional group, wherein the first functional group is an aromatic heterocyclic compound comprising nitrogen and the second functional group is selected from the group consisting of vinyl ether, amide, thiamide, amine, carboxylic acid, ester, alcohol, silane, alkoxy silane, and combinations thereof.Type: ApplicationFiled: March 23, 2009Publication date: July 5, 2012Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Theodore Antonellis, Shenliang Sun, Abayomi I. Owei, Eric Walch, Jean Rasmussen, Hanna Rasmussen
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Patent number: 7998859Abstract: A method is disclosed for metallizing a substrate comprising an interconnect feature in the manufacture of a microelectronic device, wherein the interconnect feature comprises a bottom, a sidewall, and a top opening having a diameter, D. The method comprises the following steps: depositing a barrier layer on the bottom and the sidewall of the interconnect feature, the barrier layer comprising a metal selected from the group consisting of ruthenium, tungsten, tantalum, titanium, iridium, rhodium, and combinations thereof; contacting the substrate comprising the interconnect feature comprising the bottom and sidewall having the barrier layer thereon with an aqueous composition comprising a reducing agent and a surfactant; and depositing copper metal onto the bottom and the sidewall of the interconnect feature having the barrier layer thereon.Type: GrantFiled: September 25, 2008Date of Patent: August 16, 2011Assignee: Enthone Inc.Inventors: Qingyun Chen, Xuan Lin, Vincent Paneccasio, Jr., Richard Hurtubise, Joseph A. Abys
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Patent number: 7972655Abstract: A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule comprising at least one functional group that interacts with and protects copper surfaces.Type: GrantFiled: November 21, 2007Date of Patent: July 5, 2011Assignee: Enthone Inc.Inventors: Joseph A. Abys, Shenliang Sun, Theodore Antonellis
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Publication number: 20110097597Abstract: A method is provided for depositing a whisker resistant tin-based coating layer on a surface of a copper substrate. The method is useful for preparing an article comprising a copper substrate having a surface; and a tin-based coating layer on the surface of the substrate, wherein the tin-based coating layer has a thickness between 0.5 micrometers and 1.5 micrometers and has a resistance to formation of copper-tin intermetallics, wherein said resistance to formation of copper-tin intermetallics is characterized in that, upon exposure of the article to at least seven heating and cooling cycles in which each cycle comprises subjecting the article to a temperature of at least 217° C. followed by cooling to a temperature between about 20° C. and about 28° C., there remains a region of the tin coating layer that is free of copper that is at least 0.25 micrometers thick.Type: ApplicationFiled: October 28, 2009Publication date: April 28, 2011Applicant: ENTHONE INC.Inventors: Yung-Herng Yau, Xingping Wang, Cai Wang, Robert Farrell, Pingping Ye, Edward J. Kudrak, JR., Karl F. Wengenroth, Joseph A. Abys
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Patent number: 7883738Abstract: A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an aromatic heterocycle comprising nitrogen; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.Type: GrantFiled: April 18, 2007Date of Patent: February 8, 2011Assignee: Enthone Inc.Inventors: Joseph A. Abys, Shenliang Sun, Chonglun Fan, Edward J. Kudrak, Jr.
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Publication number: 20100319572Abstract: A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a substrate comprising a copper or copper alloy surface. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; a nitrogen-containing organic compound selected from the group consisting of primary amine, secondary amine, tertiary amine, and aromatic heterocycle comprising nitrogen; and an alcohol.Type: ApplicationFiled: June 18, 2008Publication date: December 23, 2010Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Shenliang Sun, Edward J. Kudrak, JR., Katrin Zschintzsch, Theodore Antonellis
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Publication number: 20100294669Abstract: A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface.Type: ApplicationFiled: December 10, 2008Publication date: November 25, 2010Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Edward J. Kudrak, JR., Jingye Li, Chen Xu, Chonglun Fan
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Publication number: 20100291303Abstract: A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule comprising at least one functional group that interacts with and protects copper surfaces.Type: ApplicationFiled: November 21, 2007Publication date: November 18, 2010Applicant: Enthone Inc.Inventors: Joseph A. Abys, Shenliang Sun, Theodore Antonellis
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Patent number: 7794531Abstract: An organic solderability preservative (OSP) composition comprising an alkyl cyclic alcohol and an azole compound having enhanced composition stability against crystallization of the azole compound.Type: GrantFiled: January 8, 2007Date of Patent: September 14, 2010Assignee: Enthone Inc.Inventors: Joseph A. Abys, Shenliang Sun
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Publication number: 20100151263Abstract: A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an organic compound comprising a nitrogen-containing functional group; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.Type: ApplicationFiled: April 18, 2008Publication date: June 17, 2010Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Shenliang Sun, Chonglun Fan, Edward J. Kudrak, JR., Cai Wang
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Patent number: 7713859Abstract: A process for forming a solder bump on an under bump metal structure in the manufacture of a microelectronic device comprising exposing the under bump metal structure to an electrolytic bath comprising a source of Sn2+ ions, a source of Ag+ ions, a thiourea compound and/or a quaternary ammonium surfactant; and supplying an external source of electrons to the electrolytic bath to deposit a Sn—Ag alloy onto the under bump metal structure.Type: GrantFiled: August 9, 2006Date of Patent: May 11, 2010Assignee: Enthone Inc.Inventors: Thomas B. Richardson, Marlies Kleinfeld, Christian Rietmann, Igor Zavarine, Ortrud Steinius, Yun Zhang, Joseph A. Abys
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Patent number: 7670950Abstract: A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate comprising immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition comprising a source of copper ions, an organic sulfonic acid or inorganic acid, or one or more organic compounds selected from among polarizers and/or depolarizers, and chloride ions.Type: GrantFiled: August 4, 2008Date of Patent: March 2, 2010Assignee: Enthone Inc.Inventors: Thomas B. Richardson, Yun Zhang, Chen Wang, Vincent Paneccasio, Jr., Cai Wang, Xuan Lin, Richard Hurtubise, Joseph A. Abys
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Publication number: 20090145764Abstract: There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.Type: ApplicationFiled: December 11, 2007Publication date: June 11, 2009Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Jingye Li, Edward J. Kudrak, JR., Chen Xu