Abstract: A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.

Abstract: Electrodeposition in surface finishing as well as in electroforming can be performed in a broad range of hydrodynamic conditions. In some instances, such as barrel plating, the liquid is barely moving relative to the work piece, while in jet plating the solution moves up to several meters per second relative to the piece to be plated. In such a wide range of hydrodynamic conditions, the selection of appropriate quality control (QC) methods for each particular operation is very critical. The QC method has to resemble the manufacturing operation in terms of the hydrodynamic conditions otherwise the quality control and the functional test for the bath performance have no meaning. Available Hull Cell systems have a limited capability in varying the liquid velocity. At best a relative velocity of up to 20 or perhaps 30 cm/sec can be achieved with uneven distribution.

Abstract: A cyanide based aqueous solution for stripping palladium from copper-containing substrate. The solution includes a cyanide radical source compound, Na.sub.2 CO.sub.3, a nitrobenzoic acid, NaOH, thallium compound, an organo mercapto compound, and water. The presence of the organo mercapto compound in thallium containing cyanide bath permits efficient stripping of palladium from copper containing substrates with minimum corrosion damage to the substrate.

Abstract: A packaged device with a lead frame, a lead frame and an article of manufacture comprising a base metal, a layer of nickel on the base metal, and a protective composite of metal layers on the nickel. The composite includes, in succession from the nickel layer, a layer of palladium or soft gold strike, a layer of palladium-nickel alloy, a layer of palladium and a layer of gold. The palladium or soft gold strike layer acts primarily as a bonding (an adhesive) layer between the Ni and Pd-Ni alloy layers and as a layer that enhances reduction in porosity of subsequent layers, Pd-Ni alloy layer acts as a trap for base metal ions, Pd layer acts as a trap for Ni ions from the Pd-Ni alloy layer, and the outer gold layer synergistically enhances the quality to the Pd layer. The various layers are in thickness sufficient to effectively accomplish each of their designated roles, depending on the processing and use conditions.

Abstract: This invention pertains to an apparatus and method for measuring throwing power of electroplating solutions. The apparatus is easy to use and gives reproducible measurements. The apparatus emulates the performance of a conventional Haring Blum cell. The major disadvantage of the standard Haring Blum cell is its limited aility to vary the solution mass transport, thus limiting its applicability to very low current density applications. Furthermore, even under low-mass transport conditions, non-uniform solution distribution is experienced leading to erroneous interpretation. This invention permits the study of throwing power of electroplating solutions under a whole variety of solution agitation. The invention embodies an instrument for and a method of measuring the throwing power of electrolytes.

Abstract: The invention provides, in electroplating quality control methods for manufacturing, better similarity and relevance between a Hull Cell quality control test and a particular plating operation. The invention is a simple and yet functional instrument which can be used to identify the performance of the plating bath prior to manufacturing operation under similar hydrodynamic conditions. The instrument is a rotating cylinder with a flexible Cu test panel attached to its surface. Like a Hull Cell, a range of current density can be simultaneously applied. Unlike a Hull Cell, the rotating speed of the cylinder and hence the solution agitation is practically unlimited. The operator can identify the operating window for the particular process and apply them to the production line. The instrument has also demonstrated usefulness in developing proprietary electroplating chemistries.

Abstract: This invention is concerned with production of electrical devices comprising an electrodeposited conductive region free from cracking defects. In the production of a contact portion of the device from a metal strip electroplated with a conductive stripe of an alloy, the stripe exhibited, upon stamping and forming operation, cracked areas. Typically, the stripe coating on the metal strip, such as a copper bronze material, includes a layer of nickel, a layer of palladium alloyed with nickel, cobalt, arsenic or silver, and a flash coating of hard gold. The cracking defects were eliminated by subjecting the plated strip to an annealing treatment prior to the stamping and forming operation. After the heat-treatment, the stripe was free from cracks and separations between the successive layers.

Abstract: This invention is an acid palladium strike bath which improves adhesion and porosity of subsequent platings of palladium or palladium alloys on metal substrates, especially those susceptible to passivation such as nickel, chromium, bronze and steel. The acid palladium strike bath which is useful for both low-speed and high speed plating operation includes a complexing agent selected from organic diamines and has a pH ranging from 2.0 to 6.0, preferably from 3.7 to 4.1. When used on easily corrodable substrates, such as copper, the palladium strike deposit protects the parts from chemical attack in the subsequent mainplating bath and prevents its contamination.

Abstract: This invention embodies a process for synthesizing electrodialythically palladium ammine hydroxide for use in palladium plating baths. The electrodialysis takes place in a cell with a catholyte, a product and an anolyte compartments which are divided by a fluorinated anion permselective membranes. Catholyte solution readily supplies OH ions, raw starting solution contains palladium ammine ions and anions capable of migrating into the anolyte compartment, and anolyte solution readily absorbs the anions from the raw solution. Electrodes, placed in the outer compartments, are placed no more than 5 cm apart. The process is conducted with current densities of 500 ASF or less, with 200 ASF being preferable, with current efficiencies of 50 to 90 percent, with 60-80 percent being preferable, and at bath temperatures of from above freezing to 40.degree. C., with 25.degree.-40.degree. C. being preferable.

Abstract: An electroplating process is described for electroplating alloys of palladium and arsenic. The resulting electrodeposits are bright, ductile and remain ductile and crack-free even when the electrodeposits are quite thick. The deposits are quite hard and suitable for contact surfaces particularly in situations where wear characteristics require thick deposits. The electroplating process is also useful for making articles such as bellows by electroform procedures particularly since the electroplated material has extraordinary physical properties (good resilience, low stress and ductility) as well as good corrosion resistance.

Abstract: A process for electroplating palladium containing deposits from baths comprising a combination of a surfactant and a brightener combination. The surfactant is an alkyl, ammonium-type salt containing 4 to 35 carbon atoms. The brightener is 0-benzaldehydesulfonic acid, 1-naphthalene sulfonic acid, 2-naphthalenesulfonic acid, benzenesulfinic acid, oxy-4,4-bis (benzene) sulfinic acid, p-toluene sulfinic acid, 3-trifluoromethyl benzene sulfinic acid, allyl phenyl sulfone, 0-benzoic sulfamide, benzylsulfonyl propionamide, phenylsulfonyl acetamide, 3-(phenylsulfonyl) propionamide, benzene sulfonamide, bis (phenylsulfonyl) methane, guanidine carbonate, sulfaguanidine or nicotinic acid. This combination provides deposits having superior adhesion and ductility.

Abstract: A process is described for electroplating palladium and palladium alloys. The process involves the use of an alkyl hydroxyamine as complexing agent and is particularly good for palladium alloys such as palladium-nickel and palladium-cobalt.

Abstract: The invention is a process for electroplating palladium in which at least part of the palladium in the electroplating bath is added as a palladium ammine hydroxide. Both the solid form and solution form of palladium ammine hydroxide are useful in supplying palladium to the palladium electroplating bath. Both solution and crystals are chemically stable and can be stored for long periods of time. Further, use of the palladium ammine hydroxide compounds permit replenishment without accumulation of undesirable ions in the bath and also neutralizes hydrogen ions formed in the plating process.

Abstract: A palladium electroplating process is described in which certain unique anode structures are used. These anodes have surfaces made of conducting ferrites such as nickel ferrite. Such anodes have low oxygen overvoltage, high chemical stability and minimum decomposition of complexing agent in the palladium electroplating bath.

Abstract: A palladium electroplating procedure is disclosed which permits rapid and efficient plating and yields ductile, adherent palladium films. The electroplating bath comprises a unique palladium complex. The procedure is also useful for electroplating a variety of palladium alloys. In addition, the bath is highly stable and does not adversely affect the base material being plated.

Abstract: A silver electroplating procedure is disclosed which permits rapid and efficient plating and yields ductile, adherent silver films. The electroplating bath comprises silver complexed with an aliphatic polyamine compound with 3 to 20 carbon atoms. Particularly useful are such polyamines as diaminopropane (particularly 1,3-diaminopropane), diethylenetriamine, 1,4-diaminobutane, 1,6-diaminohexane, etc. The procedure is also useful for electroplating a variety of silver alloys. In addition, the bath is highly stable, does not adversely affect the base material being plated and does not contain hazardous materials which require special disposal procedures.

Abstract: The invention is a process for electroplating palladium in which at least part of the palladium in the electroplating bath is added as a palladium ammine hydroxide. Both the solid form of and solution form of palladium ammine hydroxide are useful in supplying palladium to the palladium electroplating bath. Both solution and crystals are chemically stable and can be stored for long periods of time. Further, use of the palladium ammine hydroxide compounds permit replenishment without accumulation of undesirable ions in the bath and also neutralizes hydrogen ions formed in the plating process.

Abstract: A procedure is described for electroplating platinum and platinum alloys. This procedure permits rapid electroplating of platinum and yields platinum films with excellent properties. The electroplating bath comprises a unique platinum complexing agent, namely an organic polyamine compound. The procedure is also useful for electroplating a variety of platinum alloys. In addition, the bath is highly stable and does not adversely affect the base material being plated.

Abstract: A process is described for electrolessly plating palladium metal on a variety of surfaces including palladium surfaces. The process involves use of a special electroless plating bath which is sufficiently stable for practical commercial use and yields excellent plating results. The plating bath contains a palladium salt and organic ligand. A narrow class of reducing agents is used including formaldehyde. The bath is made acid generally by the addition of nitric acid or hydrochloric acid. The process yields plating rates of about 6 microinches per minute and plating thicknesses in excess of 1 micrometer.