Abstract: A monitoring system for monitoring environmental conditions for rotary members includes a plurality of stationary reader antennas positioned proximate rotary members. A first sensor is coupled to a first rotary member and a second sensor is coupled to a second rotary member. Each sensor is configured to generate environmental condition data. A key phasor is coupled to a third rotary member and configured to generate key phasor data. The monitoring system also includes a data integrator communicatively coupled to each stationary reader antenna and configured to determine measurement values for the first and second environmental condition based on raw data from each stationary reader antennas and data from the key phasor.

Abstract: A calibration circuit includes a single-wire memory and a transmission line. The single-wire memory includes a power/interrogation terminal and a ground terminal. The single-wire memory is configured to store calibration data for a sensor. The transmission line is configured to be coupled between the sensor and a sensor reader. The transmission line includes first and second conductors. The first conductor is coupled to the power/interrogation terminal and is configured to provide the calibration data and a sensor output signal to the sensor reader. The second conductor is coupled to the ground terminal and is configured to provide a ground reference for the first conductor, the single-wire memory, and the sensor.

Abstract: A passive wireless sensor having a plurality of dielectric layers, an antenna, a diaphragm, and a feeding element is provided. Further, the antenna is disposed in at least a portion of a cavity formed by one or more dielectric layers of the plurality of dielectric layers. Moreover, the diaphragm is disposed on the cavity. Additionally, the feeding element is disposed in at least a portion of the plurality of dielectric layers. Also, the feeding element is operatively coupled to the antenna.

Abstract: The present embodiments are directed towards the optical control of switching an electrical assembly. For example, in an embodiment, an electrical package is provided. The electrical package generally includes a micro electromechanical systems (MEMS) device configured to interface with an electrical assembly, the MEMS device being operable to vary the electrical assembly between a first electrical state and a second electrical state, a MEMS device driver in communication with the MEMS device and being operable to produce high voltage switching logic from an electrical signal, and an optical detector in communication with the MEMS device driver and configured to produce the electrical signal from an optical signal produced by a light source in response to an applied current-based electrical control signal.

Abstract: A wireless actuator circuit configured to actuate a micro electromechanical system (MEMS) switch is provided. The wireless actuator circuit includes a transmitter portion and a receiver portion operatively coupled to the transmitter portion. The transmitter portion includes an oscillator device configured to generate a signal at a determined frequency and a first antenna operatively coupled to the oscillator device to receive a modulated signal. Further, the receiver portion includes a second antenna configured to receive the modulated signal from the transmitter portion, a radio frequency power detector configured to detect the modulated signal and a comparator configured to produce a control signal in response to the modulated signal detected by the radio frequency power detector to toggle the MEMS switch.

Abstract: A radio frequency (RF) die package includes a switch assembly comprising an RF transmission line and a plurality of conductive mounting pads formed on a first substrate. A switching mechanism selectively couples a first portion of the RF transmission line to a second portion of the RF transmission line. An inverted ground plane assembly is coupled to the plurality of conductive mounting pads such that an electromagnetic field generated between the RF transmission line and the inverted ground plane assembly does not permeate the first substrate in a region of the switch assembly proximate the switching mechanism.

Abstract: A radio frequency (RF) microelectromechanical system (MEMS) package includes a first mounting substrate, a signal line formed on a top surface of the first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and a ground assembly coupled to the first mounting substrate. The ground assembly includes a second mounting substrate, a ground plane formed on a bottom surface of the second mounting substrate, and at least one electrical interconnect extending through a thickness of the second mounting substrate to contact the ground plane, wherein the ground plane is spaced apart from the signal line.

Abstract: A RF MEMS package includes a MEMS die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.

Abstract: A RF MEMS package includes a MEMS die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.

Abstract: A calibration circuit includes a single-wire memory and a transmission line. The single-wire memory includes a power/interrogation terminal and a ground terminal. The single-wire memory is configured to store calibration data for a sensor. The transmission line is configured to be coupled between the sensor and a sensor reader. The transmission line includes first and second conductors. The first conductor is coupled to the power/interrogation terminal and is configured to provide the calibration data and a sensor output signal to the sensor reader. The second conductor is coupled to the ground terminal and is configured to provide a ground reference for the first conductor, the single-wire memory, and the sensor.

Abstract: A calibration circuit includes a single-wire memory and a transmission line. The single-wire memory includes a power/interrogation terminal and a ground terminal. The single-wire memory is configured to store calibration data for a sensor. The transmission line is configured to be coupled between the sensor and a sensor reader. The transmission line includes first and second conductors. The first conductor is coupled to the power/interrogation terminal and is configured to provide the calibration data and a sensor output signal to the sensor reader. The second conductor is coupled to the ground terminal and is configured to provide a ground reference for the first conductor, the single-wire memory, and the sensor.

Abstract: A rotary machine includes a rotatable shaft and a retaining ring coupled to, and at least partially extending about, the rotatable shaft. The rotatable shaft defines a longitudinal axis. The rotatable shaft and the retaining ring define an annular cavity. The rotatable shaft and the retaining ring each include a radially outer surface. The rotary machine also includes a monitoring system including a stationary reader-antenna positioned proximate the retaining ring and a radio frequency (RF) coupler. The RF coupler includes at least one flexible antenna band coupled to, and extending over, the radially outer surface of the retaining ring. The flexible antenna band is configured to establish RF coupling with the stationary reader-antenna. A sensor die is coupled to the flexible antenna band. The sensor die extends into the substantially annular cavity and the sensor die is also coupled to the radially outer surface of the rotatable shaft.

Abstract: A wireless actuator circuit configured to actuate a micro electromechanical system (MEMS) switch is provided. The wireless actuator circuit includes a transmitter portion and a receiver portion operatively coupled to the transmitter portion. The transmitter portion includes an oscillator device configured to generate a signal at a determined frequency and a first antenna operatively coupled to the oscillator device to receive a modulated signal. Further, the receiver portion includes a second antenna configured to receive the modulated signal from the transmitter portion, a radio frequency power detector configured to detect the modulated signal and a comparator configured to produce a control signal in response to the modulated signal detected by the radio frequency power detector to toggle the MEMS switch.

Abstract: An inspection system for a metal-reinforced concrete structure is described. The system includes a radio frequency (RF) system configured to be movable with respect to a surface of the concrete structure while transmitting radio signals into the interior of the structure, and receiving reflected radio signals. The system also includes a processor configured to process the reflected radio signals, so as to obtain a focused image of the reinforcement in at least one selected region within the concrete structure. The image corresponds to the physical condition of the reinforcement. A method for determining the condition of a reinforced concrete structure is also described, utilizing the inspection system.

Abstract: A passive wireless sensor having a plurality of dielectric layers, an antenna, a diaphragm, and a feeding element is provided. Further, the antenna is disposed in at least a portion of a cavity formed by one or more dielectric layers of the plurality of dielectric layers. Moreover, the diaphragm is disposed on the cavity. Additionally, the feeding element is disposed in at least a portion of the plurality of dielectric layers. Also, the feeding element is operatively coupled to the antenna.

Abstract: An inspection system for a metal-reinforced concrete structure is described. The system includes a radio frequency (RF) system configured to be movable with respect to a surface of the concrete structure while transmitting radio signals into the interior of the structure, and receiving reflected radio signals. The system also includes a processor configured to process the reflected radio signals, so as to obtain a focused image of the reinforcement in at least one selected region within the concrete structure. The image corresponds to the physical condition of the reinforcement. A method for determining the condition of a reinforced concrete structure is also described, utilizing the inspection system.

Abstract: A system includes a multi-nuclear magnetic resonance (MR) receiving coil, wherein the receiving coil includes a frequency tuning component configured operate the receiving coil at either a first frequency or a second frequency. The receiving coil also includes an impedance matching component configured to maintain a substantially constant impedance of the receiving coil when the receiving coil is operated at either the first frequency or the second frequency. Furthermore, the receiving coil is configured to measure a first nucleus when operated at the first frequency, and wherein the receiving coil is configured to measure a second nucleus when operated at the second frequency.

Abstract: The present embodiments are directed towards the optical control of switching an electrical assembly. For example, in an embodiment, an electrical package is provided. The electrical package generally includes a micro electromechanical systems (MEMS) device configured to interface with an electrical assembly, the MEMS device being operable to vary the electrical assembly between a first electrical state and a second electrical state, a MEMS device driver in communication with the MEMS device and being operable to produce high voltage switching logic from an electrical signal, and an optical detector in communication with the MEMS device driver and configured to produce the electrical signal from an optical signal produced by a light source in response to an applied current-based electrical control signal.

Abstract: The present embodiments are directed towards the optical control of switching an electrical assembly. For example, in an embodiment, an electrical package is provided. The electrical package generally includes a micro electromechanical systems (MEMS) device configured to interface with an electrical assembly, the MEMS device being operable to vary the electrical assembly between a first electrical state and a second electrical state, a MEMS device driver in communication with the MEMS device and being operable to produce high voltage switching logic from an electrical signal, and an optical detector in communication with the MEMS device driver and configured to produce the electrical signal from an optical signal produced by a light source in response to an applied current-based electrical control signal.

Abstract: A micro-electromechanical system (MEMS) device that in one embodiment includes at least two MEMS switches coupled to each other in a back-to-back configuration. The first and second suspended elements corresponding to first and second MEMS switches are electrically coupled. Further, first and second contacts corresponding to the first and second MEMS switches are configured such that a differential voltage between the second suspended element and the second contact is approximately equal to a differential voltage between the first suspended element and the first contact. The MEMS device includes at least one actuator coupled to one or more of the first and second suspended elements to actuate one or more of the first and the second suspended elements. In one example, the MEMS device includes one or more passive elements coupled to one or more of the first and second MEMS switches.