Abstract: An optical sensor interrogation system comprises: a multi-frequency optical source configured to generate an optical interrogation signal, at least one optical sensor configured to filter light at a wavelength corresponding to a value of a sensed parameter and generate an optical sensor data signal, a photodetector configured to detect a reference signal and the optical sensor data signal and generate an electrical difference frequency signal corresponding to a wavelength difference between the reference signal and the optical sensor data signal, and an electrical frequency measurement module configured to measure the electrical difference frequency.

Abstract: A microwave probe for use in a microwave sensor assembly includes an emitter body and an emitter coupled to the emitter body. The emitter includes a first portion, a second portion, and a connecting portion coupling the first portion to the second portion. The first portion and the second portion generate an electromagnetic field when at least one microwave signal is received, and a loading is induced to the emitter when an object is positioned within the electromagnetic field.

Abstract: A micro-electromechanical system (MEMS) device that in one embodiment includes at least two MEMS switches coupled to each other in a back-to-back configuration. The first and second suspended elements corresponding to first and second MEMS switches are electrically coupled. Further, first and second contacts corresponding to the first and second MEMS switches are configured such that a differential voltage between the second suspended element and the second contact is approximately equal to a differential voltage between the first suspended element and the first contact. The MEMS device includes at least one actuator coupled to one or more of the first and second suspended elements to actuate one or more of the first and the second suspended elements. In one example, the MEMS device includes one or more passive elements coupled to one or more of the first and second MEMS switches.

Abstract: The present embodiments are directed towards the optical control of switching an electrical assembly. For example, in an embodiment, an electrical package is provided. The electrical package generally includes a micro electromechanical systems (MEMS) device configured to interface with an electrical assembly, the MEMS device being operable to vary the electrical assembly between a first electrical state and a second electrical state, a MEMS device driver in communication with the MEMS device and being operable to produce high voltage switching logic from an electrical signal, and an optical detector in communication with the MEMS device driver and configured to produce the electrical signal from an optical signal produced by a light source in response to an applied current-based electrical control signal.

Abstract: An apparatus includes a plurality of magnetic resonance (MR) coil elements and a plurality of voltage-actuated switches coupled to the plurality of MR coil elements, each voltage-actuated switch configured to selectively activate a respective MR coil element. The apparatus also includes a voltage source configured to supply a voltage to the plurality of voltage-actuated switches, a control unit coupled to the voltage source, and a plurality of transmission lines coupled to the plurality of voltage-actuated switches and to the control unit and configured to provide an actuation signal from the voltage source to the plurality of voltage-actuated switches. The plurality of transmission lines being free of discrete resistive elements and having a substantially uniform resistivity such that an interaction between the plurality of transmission lines and the plurality of MR coil elements is minimized and thermal dissipation is distributed over a length of each of the plurality of transmission lines.

Abstract: Certain embodiments of the invention may include systems, methods, and apparatus for providing detecting lightning strikes. According to an example embodiment of the invention, a method for determining a lightning strike event, classification, and location is provided. The method includes receiving lightning electrical current in least one down conductor, generating voltage and polarity signals based at least in part on the received lightning electrical current, storing the generated voltage and polarity signals, and determining the lightning strike event, classification, and location based at least in part on the stored voltage and polarity signals.

Abstract: An interconnect assembly for use in high frequency applications includes an interconnect structure, a plurality of electronic die disposed on the interconnect structure, and an encapsulant at least partially surrounding the plurality of electronic die. The interconnect structure includes a plurality of layers. The interconnect assembly further includes a thermal management layer disposed within a portion of the encapsulant and proximate to the plurality of electronic die and a controlled impedance interconnect connected to the interconnect structure and extending to a peripheral surface of the interconnect assembly.

Abstract: An apparatus includes a plurality of magnetic resonance (MR) coil elements and a plurality of voltage-actuated switches coupled to the plurality of MR coil elements, each voltage-actuated switch configured to selectively activate a respective MR coil element. The apparatus also includes a voltage source configured to supply a voltage to the plurality of voltage-actuated switches, a control unit coupled to the voltage source, and a plurality of transmission lines coupled to the plurality of voltage-actuated switches and to the control unit and configured to provide an actuation signal from the voltage source to the plurality of voltage-actuated switches. The plurality of transmission lines being free of discrete resistive elements and having a substantially uniform resistivity such that an interaction between the plurality of transmission lines and the plurality of MR coil elements is minimized and thermal dissipation is distributed over a length of each of the plurality of transmission lines.

Abstract: A remote control system for a modulatable device is provided. The remote control system comprises a receiver system coupled to the modulatable device and configured to obtain an output characteristic of the modulatable device, the receiver system being located remotely with respect to the modulatable device. The system further comprises a command signal setting system coupled to the receiver system and configured to use the output characteristic to generate a drive command signal and a bias system coupled to the command signal setting system and configured to receive the drive command signal and set a bias point of the modulatable device based on the drive command signal. The bias system is located locally with respect to the modulatable device. The command signal setting system and the bias system are coupled via a first optical conduit.

Abstract: A radio frequency (RF) communication device may include an RF 90-degree hybrid combiner having stable phase and loss characteristics over greater than one octave of bandwidth, while providing a high degree of isolation between input and isolated port. The structure may include a first element and a second element. The first element includes a first port, a first section for phasing matching, a second section for conductive-layer inversion, a third section for phase-matching section, and a third port. The second element includes a fourth port, a fourth section for phasing matching, a fifth section for conductive-layer inversion, a sixth section for phase-matching, and a second port. In one example, the second and fifth sections are utilized for signal coupling. In another example, the first, third, fourth, and sixth sections are utilized for signal coupling. Different ports may have matched phase differences.

Abstract: A method for forming an ultra thin die electronic package includes disposing a first polymer film on a first substrate, applying a first adhesive layer to the first polymer film, disposing at least one die on the first adhesive layer, disposing a second polymer film on at least one additional substrate, applying a second adhesive layer to the second polymer film on at least one additional substrate, applying a second adhesive layer to the second polymer film, and attaching the first substrate and the at least one additional substrate via the first adhesive layer and the second adhesive layer such that the at least one die is interspersed between. The method also includes forming multiple vias on a top and/or bottom side of the first and the additional substrate(s), wherein the multiple vias are directly connected to the die, and forming an electrical interconnection between the first substrate, the at least one additional substrate and a die pad of the at least one die.

Abstract: A method for forming an ultra thin die electronic package is provided. The method includes disposing a first polymer film on a first substrate. The method also includes applying a first adhesive layer to the first polymer film on the first substrate. The method further includes disposing at least one die on the first adhesive layer on the first substrate. The method also includes disposing a second polymer film on at least one additional substrate. The method further includes applying a second adhesive layer to the second polymer film on the at least one additional substrate. The method further includes attaching the first substrate and the at least one additional substrate via the first adhesive layer and the second adhesive layer such that the at least one die is interspersed between. The method also includes forming multiple vias on at least one of a top side, and at least one of a bottom side of the first and the at least one additional substrate, wherein the multiple vias are attached to the die.

Abstract: An integrated electro-optical module apparatus includes in one embodiment an optical modulator configured to modulate an input optical signal coupled thereto; and a control circuit assembly configured to provide electrical control signals to the optical modulator to modulate the input optical signal; wherein the control circuit assembly is attached to the optical modulator in a stacked arrangement.

Abstract: Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants.

Abstract: A true time delay (“TTD”) system with wideband passive amplitude compensation is provided. The TTD system includes an input switch, an output switch, a reference delay line disposed between the input switch and the output switch, and time delay lines disposed between the input switch and the output switch. Each time delay line (“TDL”) has a different line length, and includes a center conductor between two corresponding ground planes. Each center conductor has a width and is separated from the two corresponding ground planes by a gap space. For each TDL, the width of the center conductor is configured such that a loss of the TDL is substantially the same as a loss of every other TDL over a range of operating frequencies. For each TDL, the gap space is configured such that an impedance of the TDL is substantially the same as an impedance of every other TDL.

Abstract: An integrated electro-optical module apparatus includes in one embodiment an optical modulator configured to modulate an input optical signal coupled thereto; and a control circuit assembly configured to provide electrical control signals to the optical modulator to modulate the input optical signal; wherein the control circuit assembly is attached to the optical modulator in a stacked arrangement.

Abstract: Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants.

Abstract: A remote control system for a modulatable device is provided. The remote control system comprises a receiver system coupled to the modulatable device and configured to obtain an output characteristic of the modulatable device, the receiver system being located remotely with respect to the modulatable device. The system further comprises a command signal setting system coupled to the receiver system and configured to use the output characteristic to generate a drive command signal and a bias system coupled to the command signal setting system and configured to receive the drive command signal and set a bias point of the modulatable device based on the drive command signal. The bias system is located locally with respect to the modulatable device. The command signal setting system and the bias system are coupled via a first optical conduit.

Abstract: A magnetic resonance (MR) system and method for generating information about an object is provided. The MR system comprises at least one MR detector configured to sense a plurality of electromagnetic signals and a modulator coupled to the MR detector and configured to modulate optical signals with the electromagnetic signals to generate corresponding modulated optical signals. The MR system further comprises a resonant matching circuit configured for matching an impedance of the MR detector to an impedance of the modulator to achieve at least one of a voltage gain or a noise performance. An optical conduit coupled to the modulator is configured to transmit the modulated optical signals from within a shielded environment to outside the shielded environment. A signal detector coupled to the optical conduit is configured to convert the modulated optical signals to electrical signals.

Abstract: An electronic component assembly includes a flexible printed circuit, and further includes two components disposed on the flexible printed circuit, having electrical connections with the flexible printed circuit. The flexible layer is folded so that the components face each other and a thermal management device is disposed between the components. The thermal management device may be glued by a thermally conducting adhesive or otherwise held in a stable arrangement, in order to remove the heat generated from the components.