Patents by Inventor Joseph F. Ahadian
Joseph F. Ahadian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150062563Abstract: An optical time domain reflectometer (OTDR) system with an integrated high speed optical modulator is capable of operating at a speed similar to the OTDR pulse width to improve the measurement resolution and reduce the time required to acquire a high dynamic range OTDR measurement over existing approaches. ASICs can be used to control the modulator and generation of pulses. The high-speed optical modulator enables high resolution single-photon OTDR measurement by blocking out all return light except from the region of fiber under examination.Type: ApplicationFiled: April 10, 2013Publication date: March 5, 2015Inventors: Joseph F. Ahadian, Kris Kusumoto, Charles B. Kuznia
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Patent number: 8854609Abstract: An optical time domain reflectometry system is described which provides low-power, low weight, optical fiber system integrity measurements in an in-situ optical fiber system. The system can be integrated within the transmitter component to allow both data transmission and OTDR measurement functions. A method of providing several different modes of OTDR measurement through external control is also disclosed.Type: GrantFiled: March 31, 2011Date of Patent: October 7, 2014Assignee: Ultra Communications, Inc.Inventors: Joseph F. Ahadian, Charles B. Kuznia, Richard T. Hagan, Ricard J. Pommer
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Patent number: 8724944Abstract: A component for coupling light bi-directionally between optical waveguides and optoelectronic devices is described. This component can be inexpensively manufactured and fits within the existing form-factor of fiber optic transceivers or transmitters, and has features for efficiently coupling laser light to a waveguide and light from the same waveguide to a detector. The described components can be formed as an array to operate within system that operation over parallel optical fibers. Applicability for these components is for optical time domain reflectometry, bi-directional optical communications, remote fiber sensing, and optical range finders.Type: GrantFiled: December 3, 2012Date of Patent: May 13, 2014Assignee: Ultra Communications, Inc.Inventors: Charles B. Kuznia, Joseph F. Ahadian, Richard T. Hagan, Richard J. Pommer
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Publication number: 20140099059Abstract: A device structure and system for connecting optical waveguides to optical transmit and receive components is described. The structure is made of two parts. The lower part contains active optoelectronic components, such as lasers and photodetectors, and optical lenses. The lower part can be assembled by steps of aligning and bonding planar components. The upper part contains optical waveguides and lenses for coupling light into and out of the waveguides. The top part is mechanically connected to the lower part to form a mechanically sound connection. The lens system provides some tolerance to mis-alignment between the top and bottom parts. The system has features that enable fiber optic components to operate and survive in harsh environments, particularly large temperature extremes.Type: ApplicationFiled: May 15, 2012Publication date: April 10, 2014Applicant: Ultra Communications,Inc.Inventors: Richard J. Pommer, Joseph F. Ahadian, Charles B. Kuznia, Richard T. Hagan
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Publication number: 20130208264Abstract: An optical time domain reflectometry system is described which provides low-power, low weight, optical fiber system integrity measurements in an in-situ optical fiber system. The system can be integrated within the transmitter component to allow both data transmission and OTDR measurement functions. A method of providing several different modes of OTDR measurement through external control is also disclosed.Type: ApplicationFiled: March 31, 2011Publication date: August 15, 2013Inventors: Joseph F. Ahadian, Charles B. Kuznia, Richard T. Hagan, Richard J. Pommer
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Publication number: 20130094026Abstract: A component for coupling light bi-directionally between optical waveguides and optoelectronic devices is described. This component can be inexpensively manufactured and fits within the existing form-factor of fiber optic transceivers or transmitters, and has features for efficiently coupling laser light to a waveguide and light from the same waveguide to a detector. The described components can be formed as an array to operate within system that operation over parallel optical fibers. Applicability for these components is for optical time domain reflectometry, bi-directional optical communications, remote fiber sensing, and optical range finders.Type: ApplicationFiled: December 3, 2012Publication date: April 18, 2013Inventors: Charles B. Kuznia, Joseph F. Ahadian, Richard T. Hagan, Richard J. Pommer
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Patent number: 8348522Abstract: A component system and method is described that is made of components for transmitting, routing and receiving “in-air” optical signals for placement on printed wiring boards (PWBs). The transmitters are components including a light source attached to a transparent substrate and aligned to a coupling lens. The transparent substrate can contain circuitry for controlling the light source, or the circuitry could be attached to the transparent substrate. The receivers include a light detector attached to a transparent substrate with circuitry for converting optical signals to electrical circuitry (integrated onto the transparent substrate or separately attached). The routing components include a lens for coupling light into an optical waveguide, an optical waveguide and, optionally, a second lens for coupling light from the optical waveguide.Type: GrantFiled: September 11, 2009Date of Patent: January 8, 2013Assignee: Ultra Communications, Inc.Inventors: Charles B. Kuznia, Joseph F. Ahadian, Richard T. Hagan, Richard J. Pommer, Brian Catanzaro
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Patent number: 8335411Abstract: A component for coupling light bi-directionally between optical waveguides and optoelectronic devices is described. This component can be inexpensively manufactured and fits within the existing form-factor of fiber optic transceivers or transmitters, and has features for efficiently coupling laser light to a waveguide and light from the same waveguide to a detector. The described components can be formed as an array to operate within system that operation over parallel optical fibers. Applicability for these components is for optical time domain reflectometry, bi-directional optical communications, remote fiber sensing, and optical range finders.Type: GrantFiled: November 12, 2009Date of Patent: December 18, 2012Assignee: Ultra Communications, Inc.Inventors: Charles B. Kuznia, Joseph F. Ahadian, Richard T. Hagan, Richard J. Pommer
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Publication number: 20120176680Abstract: A photonic device is described that contains patterns on the backside of a transparent substrate that perform several functions, including anti-reflection coating in certain areas but not in other areas, light blocking in certain areas and not in others. The patterned layers provide improved product performance and improved radiation tolerance.Type: ApplicationFiled: July 19, 2010Publication date: July 12, 2012Inventors: Joseph F. Ahadian, Charles B. Kuznia, Richard T. Hagan, Richard J. Pommer
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Patent number: 8111104Abstract: Biasing methods and devices for power amplifiers are described. The described methods and devices use the power amplifier output voltage to generate bias voltages. The bias voltages are obtained using rectifiers and voltage dividers. The described biasing methods and devices can be used with class-E power amplifiers.Type: GrantFiled: January 25, 2010Date of Patent: February 7, 2012Assignee: Peregrine Semiconductor CorporationInventors: Joseph F. Ahadian, Vikas Sharma, Neil Calanca, Jaroslaw E. Adamski
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Publication number: 20110181364Abstract: Biasing methods and devices for power amplifiers are described. The described methods and devices use the power amplifier output voltage to generate bias voltages. The bias voltages are obtained using rectifiers and voltage dividers. The described biasing methods and devices can be used with class-E power amplifiers.Type: ApplicationFiled: January 25, 2010Publication date: July 28, 2011Inventors: Joseph F. Ahadian, Vikas Sharma, Neil Calanca, Jaroslaw E. Adamski
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Publication number: 20110097037Abstract: A component for coupling light bi-directionally between optical waveguides and optoelectronic devices is described. This component can be inexpensively manufactured and fits within the existing form-factor of fiber optic transceivers or transmitters, and has features for efficiently coupling laser light to a waveguide and light from the same waveguide to a detector. The described components can be formed as an array to operate within system that operation over parallel optical fibers. Applicability for these components is for optical time domain reflectometry, bi-directional optical communications, remote fiber sensing, and optical range finders.Type: ApplicationFiled: November 12, 2009Publication date: April 28, 2011Applicant: ULTRA COMMUNICATIONS, INC.Inventors: Charles B. KUZNIA, Joseph F. AHADIAN, Richard T. HAGAN, Richard J. POMMER
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Publication number: 20100067853Abstract: A component system and method is described that is made of components for transmitting, routing and receiving “in-air” optical signals for placement on printed wiring boards (PWBs). The transmitters are components including a light source attached to a transparent substrate and aligned to a coupling lens. The transparent substrate can contain circuitry for controlling the light source, or the circuitry could be attached to the transparent substrate. The receivers include a light detector attached to a transparent substrate with circuitry for converting optical signals to electrical circuitry (integrated onto the transparent substrate or separately attached). The routing components include a lens for coupling light into an optical waveguide, an optical waveguide and, optionally, a second lens for coupling light from the optical waveguide.Type: ApplicationFiled: September 11, 2009Publication date: March 18, 2010Inventors: Charles B. Kuznia, Joseph F. Ahadian, Richard T. Hagan, Richard J. Pommer, Brian Catanzaro
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Publication number: 20090245736Abstract: A connector attachment to a low height module is described that has a lid configured with an attached spring extension that is substantially planar to the lid. At the end of the spring extension is a spring or compressing mechanism that fits over an external mechanically transferable (MT) ferrule, the ferrule being connected to a ribbon of fibers or communication lines. The external ferrule is fitted to a side of the low height profile module that has an opening to couple the communication lines to the interior/devices in the module. The connector attachment is secured to the module via screws, for example. The combination of the lid with the spring extension and spring/compressing mechanism provides for a very elegant low profile connector assembly that allows communication lines to be more robustly attached to the module than currently practiced and also preserves the overall height of the low height profile module.Type: ApplicationFiled: March 31, 2009Publication date: October 1, 2009Inventors: Joseph F. Ahadian, Charles B. Kuznia, Richard T. Hagan, Richard J. Pommer
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Patent number: 7418163Abstract: An integrated optoelectrical package for optoelectrical integrated circuits (ICs) is disclosed. The package includes a package substrate having contact receiving members on an upper surface. The contact receiving members are electrically connected to contacts on the lower surface. An optoelectronic receiver package and an optoelectronic transmitter package are each electrically mounted to respective first and second subsets of the contact receiving members. Input and output waveguide arrays are formed atop the substrate package and are optically coupled to the optoelectronic receiver package and the optoelectronic transmitter package, respectively. The contacts on the lower surface of the package substrate are designed to contact and engage the contact receiving members of a standard printed circuit board (PCB).Type: GrantFiled: March 28, 2002Date of Patent: August 26, 2008Inventors: Kishore K. Chakravorty, Joseph F. Ahadian, Johanna Swan, Thomas P. Thomas, Brandon C. Barnett, Ian Young
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Patent number: 7049704Abstract: A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structure in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens directly attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.Type: GrantFiled: May 6, 2004Date of Patent: May 23, 2006Assignee: Intel CorporationInventors: Kishore K. Chakravorty, Johanna Swan, Brandon C. Barnett, Joseph F. Ahadian, Thomas P. Thomas, Ian Young
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Patent number: 7026883Abstract: A voltage-controlled oscillator includes an inductor capacitor (LC) tank; a drive circuit having a current source; and a feedback loop circuit. The feedback loop includes a peak detect circuit to generate a peak detect voltage; a reference voltage generator to generate a single reference voltage; and an operational amplifier, coupled to the peak detect circuit and the reference voltage generator, to generate an analog bias signal to adjust a current of the current source.Type: GrantFiled: March 12, 2004Date of Patent: April 11, 2006Assignee: Intel CorporationInventors: Harish Muthali, Ian Young, Joseph F. Ahadian
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Publication number: 20040208416Abstract: A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structures in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens directly attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.Type: ApplicationFiled: May 6, 2004Publication date: October 21, 2004Applicant: INTEL CORPORATIONInventors: Kishore K. Chakravorty, Johanna Swan, Brandon C. Barnett, Joseph F. Ahadian, Thomas P. Thomas, Ian Young
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Patent number: 6754407Abstract: A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structures in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.Type: GrantFiled: May 30, 2002Date of Patent: June 22, 2004Assignee: Intel CorporationInventors: Kishore K. Chakravorty, Johanna Swan, Brandon C. Barnett, Joseph F. Ahadian, Thomas P. Thomas, Ian Young
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Publication number: 20030185484Abstract: An integrated optoelectrical package for optoelectrical integrated circuits (ICs) is disclosed. The package includes a package substrate having contact receiving members on an upper surface. The contact receiving members are electrically connected to contacts on the lower surface. An optoelectronic receiver package and an optoelectronic transmitter package are each electrically mounted to respective first and second subsets of the contact receiving members. Input and output waveguide arrays are formed atop the substrate package and are optically coupled to the optoelectronic receiver package and the optoelectronic transmitter package, respectively. The contacts on the lower surface of the package substrate are designed to contact and engage the contact receiving members of a standard printed circuit board (PCB).Type: ApplicationFiled: March 28, 2002Publication date: October 2, 2003Applicant: Intel CorporationInventors: Kishore K. Chakravorty, Joseph F. Ahadian, Johanna Swan, Thomas P. Thomas, Brandon C. Barnett, Ian Young