Abstract: A system of connecting errors in the control loop using multiple additional loops. A first loop carries out control in a desired way, and the additional loops are provided for the purpose of determining a specified error value. That specified error value may be, for example, a quiescent current. The specified error value is then used to correct for errors in the first loop.

Abstract: An integrated photodetector means for controlling the output of a light source, where the control means is a photodetector formed on a silicon-on-insulator substrate. The integrated photodetector senses the optical power from the light source and provides an electrical feedback signal which can be used to adjust the DC bias levels of the light source control driver circuit. The approach readily lends itself to large arrays of light sources bonded to silicon-on-sapphire driver circuits and is especially suitable for controlling light sources such as VCSELs in arrays such as are found in communications systems.

Abstract: A system of connecting errors in the control loop using multiple additional loops. A first loop carries out control in a desired way, and the additional loops are provided for the purpose of determining a specified error value. That specified error value may be, for example, a quiescent current. The specified error value is then used to correct for errors in the first loop.

Abstract: A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has optical waveguide structures in addition to electrical connections. An optically active device may be flip-bonded directly to an integrated circuit using solder bump technology. The integrated circuit then flip-bonded or wire-bonded to a BGA package. The package has alignment rails or balls and V-grooves to anchor the alignment rails/balls to align the BGA package to the PCB. The BGA package is bonded to the PCB using solder reflow technology.

Abstract: A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has optical waveguide structures in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens attached to it to facillitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a BGA package. The BGA package is bonded to the PCB using solder reflow technology.

Abstract: A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has optical waveguide structures in addition to electrical connections. An optically active device may be flip-bonded directly to an integrated circuit using solder bump technology. The integrated circuit then flip-bonded or wire-bonded to a BGA package. The package has alignment rails or balls and V-grooves to anchor the alignment rails/balls to align the BGA package to the PCB. The BGA package is bonded to the PCB using solder reflow technology.

Abstract: In a method for bonding a silicon substrate to a III-V material substrate, a silicon substrate is contacted together with a III-V material substrate and the contacted substrates are annealed at a first temperature that is above ambient temperature, e.g., at a temperature of between about 150° C. and about 350° C. The silicon substrate is then thinned. This bonding process enables the fabrication of thick, strain-sensitive and defect-sensitive optoelectronic devices on the optimum substrate for such, namely, a thick III-V material substrate, while enabling the fabrication of silicon electronic devices in a thin silicon layer, resulting from the thinned Si substrate, that is sufficient for such fabrication but which has been thinned to eliminate thermally-induced stress in both the Si and III-V materials. The III-V material substrate thickness thereby provides the physical strength of the composite substrate structure, while the thinned silicon substrate minimizes stress in the composite structure.