Abstract: A system memory includes a memory hub controller, a memory module accessible by the memory hub controller, and an expansion module having a processor circuit coupled to the memory module and also having access to the memory module. The memory hub controller is coupled to the memory hub through a first portion of a memory bus on which the memory requests from the memory hub controller and memory responses from the memory hub are coupled. A second portion of the memory bus couples the memory hub to the processor circuit and is used to couple memory requests from the processor circuit and memory responses provided by the memory hub to the processor circuit.

Abstract: A memory system and method uses stacked memory device dice coupled to each other and to a logic die. The logic die may include a timing correction system that is operable to control the timing at which the logic die receives signals, such as read data signals, from each of the memory device dice. The timing correction controls the timing of the read data or other signals by adjusting the timing of respective strobe signals, such as read strobe signals, that are applied to each of the memory device dice. The memory device dice may transmit read data to the memory device at a time determined by when it receives the respective strobe signals. The timing of each of the strobe signals is adjusted so that the read data or other signals from all of the memory device dice are received at the same time.

Abstract: Memory systems, systems and methods are disclosed that may include a plurality of stacked memory device dice and a logic die connected to each other by through silicon vias. One such logic die includes an error code generator that generates error checking codes corresponding to write data. The error checking codes are stored in the memory device dice and are subsequently compared to error checking codes generated from data subsequently read from the memory device dice. In the event the codes do not match, an error signal can be generated. The logic die may contain a controller that records the address from which the data was read. The controller or memory access device may redirect accesses to the memory device dice at the recorded addresses. The controller can also examine addresses or data resulting in the error signals being generated to identify faults in the through silicon vias.

Abstract: Memory device systems, systems and methods are disclosed, such as those involving a plurality of stacked memory device dice and a logic die connected to each other through a plurality of conductors. The logic die serves, for example, as a memory interface device to a memory access device, such as a processor. The logic die can include a command register that allows selective operation in either of two modes. In a direct mode, conventional command signals as well as row and column address signals are applied to the logic die, and the logic die can essentially couple these signals directly to the memory device dice. In an indirect mode, a packet containing a command and a composite address are applied to the logic die, and the logic die can decode the command and composite address to apply conventional command signals as well as row and column address signals to the memory device dice.

Abstract: A computer system includes a memory hub for coupling a processor to a plurality of synchronous dynamic random access memory (“SDRAM”) devices. The memory hub includes a processor interface coupled to the processor and a plurality of memory interfaces coupled to respective SDRAM devices. The processor interface is coupled to the memory interfaces by a switch. Each of the memory interfaces includes a memory controller, a cache memory, and a prediction unit. The cache memory stores data recently read from or written to the respective SDRAM device so that it can be subsequently read by processor with relatively little latency. The prediction unit prefetches data from an address from which a read access is likely based on a previously accessed address.

Abstract: A memory hub for a memory module having a DMA engine for performing DMA operations in system memory. The memory hub includes a link interface for receiving memory requests for access at least one of the memory devices of the system memory, and further including a memory device interface for coupling to the memory devices, the memory device interface coupling memory requests to the memory devices for access to at least one of the memory devices. A switch for selectively coupling the link interface and the memory device interface is further included in the memory hub. Additionally, a direct memory access (DMA) engine is coupled through the switch to the memory device interface to generate memory requests for access to at least one of the memory devices to perform DMA operations.

Abstract: The present disclosure includes methods and devices for operating a solid state drive. One method embodiment includes receiving an indication of a desired number of write input/output operations (IOPs) per unit time performed by the solid state drive. The method can also include managing the number of write IOPs performed by the solid state drive at least partially based on the desired number of write IOPs per unit time, a number of spare blocks in the solid state drive, and a desired operational life for the solid state drive.

Abstract: A plurality of stacked memory device die and a logic circuit are connected to each other through a plurality of conductors. The stacked memory device die are arranged in a plurality of vaults. The logic circuit die serves as a memory interface device to a memory access device, such as a processor. The logic circuit die includes a plurality of link interfaces and downstream targets for transmitting received data to the vaults. The logic circuit die includes a packet builder and broadcaster configured to receive command, address and data signals over separate interfaces from a conventional tester, format the signals into a packet and broadcast the signals to a plurality of vaults.

Abstract: A sequence state matrix has a plurality of time slots for storing a plurality of memory device signals. The memory device signals are loaded into the matrix by a sequencer load unit, which loads the memory device signals at locations in the matrix corresponding to the times that the signals will be coupled to a memory device. The sequencer load unit loads the signals into the matrix at a rate corresponding to a frequency of a system clock signal controlling the operation of the electronic system. A first in, first out (“FIFO”) buffer receives the memory device signals from the sequence state matrix at a rate corresponding to the frequency of the system clock signal. A command selector transfers the memory device signals from the FIFO buffer to the memory device at a rate corresponding to the frequency of a memory clock signal controlling the operation of the memory device.

Abstract: Memory access requests are successively received in a memory request queue of a memory controller. Any conflicts or potential delays between temporally proximate requests that would occur if the memory access requests were to be executed in the received order are detected, and the received order of the memory access requests is rearranged to avoid or minimize the conflicts or delays and to optimize the flow of data to and from the memory data bus. The memory access requests are executed in the reordered sequence, while the originally received order of the requests is tracked. After execution, data read from the memory device by the execution of the read-type memory access requests are transferred to the respective requesters in the order in which the read requests were originally received.

Abstract: A processor-based electronic system includes several memory modules arranged in first and second ranks. The memory modules in the first rank are directly accessed by any of several processors, and the memory modules in the second rank are accessed by the processors through the memory modules in the first rank. The data bandwidth between the processors and the memory modules in the second rank is varied by varying the number of memory modules in the first rank that are used to access the memory module in the second set. Each of the memory modules includes several memory devices coupled to a memory hub. The memory hub includes a memory controller coupled to each memory device, a link interface coupled to a respective processor or memory module, and a cross bar switch coupling any of the memory controllers to any of the link interfaces.

Abstract: A system memory includes a memory hub controller, a memory module accessible by the memory hub controller, and an expansion module having a processor circuit coupled to the memory module and also having access to the memory module. The memory hub controller is coupled to the memory hub through a first portion of a memory bus on which the memory requests from the memory hub controller and memory responses from the memory hub are coupled. A second portion of the memory bus couples the memory hub to the processor circuit and is used to couple memory requests from the processor circuit and memory responses provided by the memory hub to the processor circuit.

Abstract: A processor-based electronic system includes several memory modules arranged in first and second ranks. The memory modules in the first rank are directly accessed by any of several processors, and the memory modules in the second rank are accessed by the processors through the memory modules in the first rank. The data bandwidth between the processors and the memory modules in the second rank is varied by varying the number of memory modules in the first rank that are used to access the memory module in the second set. Each of the memory modules includes several memory devices coupled to a memory hub. The memory hub includes a memory controller coupled to each memory device, a link interface coupled to a respective processor or memory module, and a cross bar switch coupling any of the memory controllers to any of the link interfaces.

Abstract: A memory module includes a memory hub coupled to several memory devices. The memory hub includes at least one performance counter that tracks one or more system metrics—for example, page hit rate, prefetch hits, and/or cache hit rate. The performance counter communicates with a memory sequencer that adjusts its operation based on the system metrics tracked by the performance counter.

Abstract: Integrated circuits, load boards and methods are disclosed, such as those associated with a memory testing system that includes an algorithmic pattern generator generating a pattern of command, address or write data digits according to an algorithm. In one such embodiment, the pattern of digits are applied to a frame generator that arranges the pattern of digits into a packet. The packet is then applied to a plurality of parallel-to-serial converters that convert the packet into a plurality of serial digits of a command/address packet or a write data packet, which are output through a plurality of bit lanes. The system might also include a plurality of serial-to-parallel converters receiving respective sets of digits of a read data packet through respective bit lanes. The read data packet is applied to a frame decomposer that extracts a pattern of read data digits from the packet. An error detecting circuit then determines if any of the received read data digits are erroneous.

Abstract: A computer system includes a memory hub for coupling a processor to a plurality of synchronous dynamic random access memory (“SDRAM”) devices. The memory hub includes a processor interface coupled to the processor and a plurality of memory interfaces coupled to respective SDRAM devices. The processor interface is coupled to the memory interfaces by a switch. Each of the memory interfaces includes a memory controller, a cache memory, and a prediction unit. The cache memory stores data recently read from or written to the respective SDRAM device so that it can be subsequently read by processor with relatively little latency. The prediction unit prefetches data from an address from which a read access is likely based on a previously accessed address.

Abstract: A memory module includes a memory hub coupled to several memory devices. The memory hub includes at least one performance counter that tracks one or more system metrics—for example, page hit rate, number or percentage of prefetch hits, cache hit rate or percentage, read rate, number of read requests, write rate, number of write requests, rate or percentage of memory bus utilization, local hub request rate or number, and/or remote hub request rate or number.

Abstract: A memory module includes a memory hub coupled to several memory devices. The memory hub includes a posted write buffer that stores write requests so that subsequently issued read requests can first be coupled to the memory devices. The write request addresses are also posted in the buffer and compared to subsequent read request addresses. In the event of a positive comparison indicating that a read request is directed to an address to which an earlier write request was directed, the read data are provided from the buffer. When the memory devices are not busy servicing read request, the write requests can be transferred from the posted write buffer to the memory devices. The write requests may also be accumulated in the posted write buffer until either a predetermined number of write requests have been accumulated or the write requests have been posted for a predetermined duration.

Abstract: A memory hub includes an on-board diagnostic engine through which diagnostic testing and evaluation of the memory system can be performed. The memory hub includes a link interface for receiving memory requests for access to memory devices of the memory system and a memory device interface coupled to the memory devices for coupling memory requests to the memory devices. A memory hub diagnostic engine is coupled through a switch to the link interface and the memory device interface to perform diagnostic testing of the memory system. The diagnostic engine includes a maintenance port that provides access to results of the diagnostic testing and through which diagnostic testing commands can be received.

Abstract: An integrated circuit load board includes a substrate on which a plurality of integrated circuit sockets and an integrated test circuit are mounted. The integrated test circuit generates test signals that are applied to the integrated circuit sockets. The integrated test circuit also receives response signals from the integrated circuit sockets indicative of the manner in which integrated circuits in the sockets responded to the test signals. Several of the load boards may be placed on a test head that may be coupled to a host. The integrated test circuit may also be used with an integrated circuit probe card, where the test signals are applied to an integrated circuit coupled to the probe card.