Abstract: In one example embodiment, an angular seam includes a first complementary structure defined in a first shell of an optoelectronic transceiver module, and a second complementary structure defined in a second shell of the optoelectronic transceiver module. The second complementary structure is configured to receive the first complementary structure so that an angular seam is defined that is substantially non-transmissive to electromagnetic radiation.

Abstract: In one example embodiment, a printed circuit board positioning mechanism includes a solderable plate and a compressible structure attached to the solderable plate.

Abstract: In one example embodiment, an optical subassembly (OSA) positioning device includes a front piece, a top back piece, and a top connector piece connecting the front piece and the top back piece, a bottom back piece, and a bottom connector piece connecting the from piece ad the bottom back piece. The front piece defines a first port. The first port is configured to receive and substantially secure a first OSA in an x-axis position and a y-axis position when the OSA positioning device is positioned within an optoelectronic module. The top and bottom connector pieces are deformable in response to an exerted force so as to bias a flange of the first OSA against a shell of the optoelectronic module such that the first OSA is secured in a z-axis position when the OSA positioning device is positioned within the optoelectronic module.

Abstract: In one example, an optical subassembly positioning plate is provided that includes a substantially flat body that defines at least one edge. A port is defined in the body. The port is configured to receive and secure an optical subassembly in an x-direction and a y-direction when said optical subassembly positioning plate is positioned within an optoelectronic transceiver module. A plurality of fingers is defined along at least one edge of the body. Each of the plurality of fingers is configured to contact a shell of the optoelectronic transceiver module so as to bias a flange of the optical subassembly against a portion of the shell of the optoelectronic transceiver module such that the optical subassembly is substantially retained in a z-direction when the optical subassembly positioning plate is positioned within the optoelectronic transceiver module.

Abstract: In one example embodiment, a collar clip includes a body that is sized and configured to partially encircle a shell of an optoelectronic transceiver module. Each extended element in a pair of the extended elements is separated from the other extended element in the pair by a cavity. Each cavity is configured to receive a portion of a corresponding structure of the shell.

Abstract: In one example, a rotatable top shell is provided for an example optoelectronic device. The rotatable top shell includes a body defining a curved tongue on one end. The tongue is configured to rotate about a complimenting curved mating surface of a bottom shell of the optoelectronic device to allow the body to rotate between an open position and a closed position. The rotatable top shell further includes means for securing the rotatable top shell relative to the bottom shell. The means for securing the rotatable top shell may include one or more of: a plurality of nubs defined along at least one edge of the body, a hole defined in the body for receiving a retention pin of the bottom shell, two sides for being received within a main cavity of the bottom shell, or the like.

Abstract: A latching mechanism for use in selectively securing a module within a receptacle of a host device. In one example embodiment, a latching mechanism includes a bail and a latch attached to the bail. The bail is configured to be attached to a shell of a module and to rotate about a first axis between a latched position and an unlatched position. The first axis is in a fixed position relative to the shell. The latch is attached to the bail at a second axis that is offset from the first axis. The latch is configured to rotate about the second axis. The second axis is movable relative to the shell.

Abstract: A classification clip for an electronic or optoelectronic module. In one example embodiment, an optoelectronic module classification clip includes a body, a complementary structure attached to the body and configured to engage a complementary structure of a shell of an optoelectronic module, and a visible indicator included on at least a portion of the body or the complementary structure. The visible indicator indicates information concerning a characteristic of the optoelectronic module.

Abstract: Compositions and methods to reduce the oxidation of an oxidizable material are disclosed herein. The invention provides a microcapsule comprising a core material, which is the phospholipid-stabilized oxidizable material, and a shell wall that encapsulates the core material. Food products comprising an edible material and a microcapsule of phospholipid-stabilized oxidizable material are also disclosed.

Abstract: Compositions and methods to reduce the oxidation of an oxidizable material are disclosed herein. A composition comprising a phospholipid-stabilized oxidizable material is disclosed. The composition comprises an oxidizable material, a phospholipid, and an optional protein. The phospholipid reduces the oxidation of the oxidizable material in the absence of water.