Abstract: Isolated dark features, e.g. contact holes or lines, are exposed in a double exposure, using different illumination settings in the two exposures.

Abstract: A method of optimizing adjustable settings of adjustable elements of a projection system in a lithographic apparatus is disclosed that includes determining an object spectrum for a pattern and an illumination arrangement, determining a symmetry of the object spectrum, constructing a merit function for a wave-front in a pupil plane of the projection system with the settings of the adjustable elements as variables with reference to the symmetry, and optimizing the merit function.

Abstract: A system and method for enhancing the image resolution in a lithographic system, is presented herein. The invention comprises decomposing a reticle pattern into at least two constituent sub-patterns that are capable of being optically resolved by the lithographic system, coating a substrate with a pre-specified photoresist layer, and exposing a first of the at least two constituent sub-patterns by directing a projection beam through the first sub-pattern such that the lithographic system produces a first sub-pattern image onto the pre-specified photoresist layer of the substrate. The invention further comprises processing the exposed substrate, exposing a second of the at least two constituent sub-patterns by directing the projection beam through the second sub-pattern such that the lithographic system produces a second sub-pattern image onto the pre-specified photoresist layer of the substrate, and then combining the first and second sub-pattern images to produce a desired pattern on the substrate.

Abstract: The present invention relates to a lithographic apparatus and a method of using the apparatus in the manufacture of a device such as an integrated circuit (IC). In particular, the present invention relates to a lithographic apparatus wherein iso-dense bias in a printed pattern on a substrate is capable of being controlled by using radiation with a spectral distribution comprising two or more spectral peaks.

Abstract: A lithographic manufacturing process is disclosed in which first information of a lithographic transfer function of a first lithographic projection apparatus is obtained. The information is compared with second information of a reference lithographic transfer function (e.g. of a second lithographic projection apparatus). The difference between the first and second information is calculated. Then, the change of machine settings for the first lithographic projection apparatus, needed to minimize the difference, is calculated and applied to the first lithographic projection apparatus. In an exemplary application, a match between the first and second lithographic projection apparatus of any pitch-dependency of feature errors is improved.

Abstract: A device manufacturing method is disclosed in which the aberration of the projection system of a lithographic projection apparatus is obtained in terms of the Zernike expansion. The field distribution of displacement error and focal plane distortion of the projected image are calculated on the basis of the Zernike aberration and sensitivity coefficients which quantify the relationship between Zernike aberration components and the error in the image. A calculation is then performed to determine the compensation to apply to the apparatus in order to minimize the error in the image. The compensation is then applied to the apparatus. The compensation may comprise increasing one component of aberration of the apparatus in order to decrease the effect of another aberration, such that, on balance, the image quality as a whole is improved.

Abstract: A lithographic manufacturing process is disclosed in which a first information on a first lithographic transfer function of a first lithographic projection apparatus is obtained. The information is compared with a second information on a second lithographic transfer function of a second lithographic projection apparatus, for reference. The difference between the first and second information is calculated. Then, the change of machine settings for the first lithographic projection apparatus, needed to minimize the difference, is calculated and applied to the first lithographic projection apparatus such that the match between the first and second lithographic projection apparatus of any pitch-dependency of feature errors is improved.

Abstract: A lithographic manufacturing process is disclosed in which a first information on a first lithographic transfer function of a first lithographic projection apparatus is obtained. The information is compared with a second information on a second lithographic transfer function of a second lithographic projection apparatus, for reference. The difference between the first and second information is calculated. Then, the change of machine settings for the first lithographic projection apparatus, needed to minimize the difference, is calculated and applied to the first lithographic projection apparatus such that the match between the first and second lithographic projection apparatus of any pitch-dependency of feature errors is improved.