Abstract: A described example includes: a semiconductor die mounted to a die pad of a package substrate, the semiconductor die having bond pads on a device side surface facing away from the die pad; bond wires coupling the bond pads of the semiconductor die to leads of the package substrate, the leads spaced from the die pad; an antenna positioned over the device side surface of the semiconductor die and having a feed line coupled between the antenna and a device side surface of the semiconductor die; and mold compound covering the semiconductor die, the bond wires, a portion of the leads, and the die side surface of the die pad, a portion of the antenna exposed from the mold compound.

Abstract: A described example includes an antenna formed in a first conductor layer on a device side surface of a multilayer package substrate, the multilayer package substrate including conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers, the multilayer package substrate having a board side surface opposite the device side surface; and a semiconductor die mounted to the device side surface of the multilayer package substrate spaced from and coupled to the antenna.

Abstract: In an example, an apparatus comprises a sealed container containing a dipolar gas. The apparatus also comprises a first transmit antenna, a second transmit antenna, and a receive antenna each communicatively coupled to the sealed container. The apparatus also comprises a control circuit including a transceiver, the control circuit having a first transmit output, a second transmit output, and a receive input, the first transmit output coupled to the first transmit antenna, the second transmit output coupled to the second transmit antenna, and the receive input coupled to the receive antenna.

Abstract: A described example includes: an antenna formed in a first conductor layer on a device side surface of a multilayer package substrate, the multilayer package substrate including conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers, the multilayer package substrate having a board side surface opposite the device side surface; and a semiconductor die mounted to the device side surface of the multilayer package substrate spaced from and coupled to the antenna.

Abstract: One example includes a method for fabricating a substrate-integrated waveguide (SIW). The method includes forming a first metal layer on a carrier surface. The first metal layer can extend along an axis. The method also includes forming a first metal sidewall extending from a first edge of the first metal layer along the axis and forming a second metal sidewall extending from a second edge of the first metal layer opposite the first edge along the axis to form a trough extending along the axis. The method also includes providing a dielectric material over the first metal layer and over the first and second metal sidewalls. The method further includes forming a second metal layer over the dielectric material and over the first and second metal sidewalls. The second metal layer can extend along the axis to enclose the SIW in all radial directions along the axis.

Abstract: An interposer acts as a buffer zone between a transceiver IC and a dielectric waveguide interconnect and establishes two well-defined reference planes that can be optimized independently. The interposer includes a block of material having: a first interface region to interface with an antenna coupled to an integrated circuit (IC); and a second interface region to interface to the dielectric waveguide. An interface waveguide is formed by a defined region positioned within the block of material between the first interface region and the second interface region.

Abstract: In a clock apparatus, a signal waveguide includes: a gas cell having a sealed interior; and a dipolar gas inside the sealed interior. A first apparatus is configured to provide a first electromagnetic wave through the sealed interior along a first direction. A second apparatus is configured to provide a second electromagnetic wave through the sealed interior along a second direction, in which the second direction is opposite the first direction. Also, the clock apparatus includes receiving apparatus coupled to the signal waveguide and configured to detect an amount of energy in the second electromagnetic wave passing through the dipolar gas.

Abstract: In some examples, an apparatus comprises a substrate, an interposer mechanically coupled to the substrate, a gas cell on at least part of the interposer, and a plate on the gas cell and mechanically coupled to the interposer. Some examples of the apparatus are configured to be millimeter wave devices.

Abstract: In a described example, an apparatus includes: a package substrate having a device side surface and a board side surface opposite the device side surface; a physics cell mounted on the device side surface having a first end and a second end; a first opening extending through the package substrate and lined with a conductor, aligned with the first end; a second opening extending through the package substrate and lined with the conductor, aligned with the second end; a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening; and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

Abstract: A physics cell includes a sealed glass vial that contains a high-purity dipolar gas (e.g., OCS) at a low pressure (e.g., between about 0.01 millibar and 0.2 millibar). The vial can be sealed using a laser cutting process that involves only local heating of the vial that does not denature the bulk of the contained gas. One or more electromagnetically translucent windows or vial-end access points provide access to electromagnetic waves launched or received by one or more electromagnetic antennas at a frequency that is adjusted to match the quantum transition frequency of the gas based on a detected maximum absorption frequency. The glass-vial physics cell can be fabricated at lower cost than physics cells fabricated from bonded wafers. Multiple vials can be joined by a waveguide in an enclosure so that launch and receive antennas can be provided at a single end of the vials.

Abstract: Described examples include an apparatus having a first antenna and a second antenna formed in a first layer on a first surface of a multilayer package substrate, the multilayer package substrate having layers including patterned conductive portions and dielectric portions, the multilayer package substrate having a second surface opposite the first surface. The apparatus also has an isolation wall formed in the multilayer package substrate formed in at least a second and a third layer in the multilayer package substrate and a semiconductor die mounted to the first surface of the multilayer package substrate spaced from and coupled to the first antenna and the second antenna.

Abstract: A compact mmW spectroscopy cell system for detecting volatile organic compounds (compounds) in a gas. The system includes a gas collection chamber, an input buffer cavity for receiving the gas from the gas collection chamber, pumping devices to pass the gas from the buffer cavity to an absorption cell and maintain pressure, and a transceiver connected to the cell. The transceiver interrogates the absorption cell filled with the gas by passing a high frequency electromagnetic signal and sweeping the signal to generate an absorption spectra which is compared to a spectroscopy database for detecting the compounds in the gas. The absorption cell, collection chambers, and pumping devices are fabricated with standard CMOS processing techniques at chip and wafer scale. The transceiver bonded to the absorption cell with chip scale integration.

Abstract: In a described example, an apparatus includes a first substrate having a first side, a second side, and a coupling interface across a portion of the first side. The coupling interface including an arrangement of subwavelength periodic structures formed in the first substrate. A second substrate is coupled to a portion of the second side of the first substrate to form a sealed cavity aligned with the coupling interface.

Abstract: A millimeter wave apparatus, with a substrate, a transceiver in a first fixed position relative to the substrate, and a gas cell in a second fixed position relative to the substrate. The clock apparatus also comprises at least four waveguides.

Abstract: In a described example, an apparatus includes a package substrate having a device side surface and a board side surface opposite the device side surface, a physics cell mounted on the device side surface having a first end and a second end, a first opening extending through the package substrate and lined with a conductor, aligned with the first end, a second opening extending through the package substrate and lined with the conductor, aligned with the second end, a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening, and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

Abstract: A described example includes: a semiconductor die mounted to a die pad of a package substrate, the semiconductor die having bond pads on a device side surface facing away from the die pad; bond wires coupling the bond pads of the semiconductor die to leads of the package substrate, the leads spaced from the die pad; an antenna positioned over the device side surface of the semiconductor die and having a feed line coupled between the antenna and a device side surface of the semiconductor die; and mold compound covering the semiconductor die, the bond wires, a portion of the leads, and the die side surface of the die pad, a portion of the antenna exposed from the mold compound.

Abstract: A packaged electronic device includes a multilayer lead frame having first and second trace levels, a via level therebetween, a conductive feed structure, and a conductive reflector wall. The first trace level includes a conductive coupler antenna and a conductive ground structure that extends in a plane of orthogonal first and second directions, and a portion of the conductive coupler antenna faces outward along a third direction orthogonal to the first and second directions. The conductive reflector wall has an opening and extends along the third direction between the first and second trace levels around a portion of the conductive coupler antenna. The conductive feed structure is coupled to the conductive coupler antenna and extends along the first direction through the opening of the conductive reflector wall.

Abstract: A described example includes: an antenna formed in a first conductor layer on a device side surface of a multilayer package substrate, the multilayer package substrate including conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers, the multilayer package substrate having a board side surface opposite the device side surface; and a semiconductor die mounted to the device side surface of the multilayer package substrate spaced from and coupled to the antenna.

Abstract: A packaged electronic device includes a multilayer lead frame having first and second trace levels, a via level therebetween, a conductive feed structure, and a conductive reflector wall. The first trace level includes a conductive coupler antenna and a conductive ground structure that extends in a plane of orthogonal first and second directions, and a portion of the conductive coupler antenna faces outward along a third direction orthogonal to the first and second directions. The conductive reflector wall has an opening and extends along the third direction between the first and second trace levels around a portion of the conductive coupler antenna. The conductive feed structure is coupled to the conductive coupler antenna and extends along the first direction through the opening of the conductive reflector wall.

Abstract: In described examples, a magnetic sensor includes a waveguide that encapsulates dipolar molecules. A mm-wave electromagnetic field is launched into the waveguide, travels through the dipolar molecules, and is then received after passing through the dipolar molecules. The frequency of the mm-wave electromagnetic signal is swept across a range that includes an intrinsic quantum rotational state transition frequency (Fr) for the dipolar molecules. Absorption peaks in accordance with the Zeeman effect are determined. A strength of a magnetic field affecting the magnetic sensor is proportional to a difference in the frequencies of the absorption peaks.