Patents by Inventor Juan Boon Tan

Juan Boon Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10777519
    Abstract: Device and method for forming a device are presented. A substrate having circuit component and a back-end-of-line (BEOL) dielectric layer with interconnects is provided. A pad dielectric layer is formed over the BEOL dielectric layer. The pad dielectric layer includes a pad via opening which exposes a surface of one of the interconnects in the BEOL dielectric layer. A pad interconnect is formed on the pad dielectric layer and the pad interconnect is coupled to one of the interconnect in the BEOL dielectric by a pad via contact in the pad via opening. The pad interconnect comprises a pad interconnect pattern which is devoid of 90° angles and any angled structures contained in the pad interconnect pattern less than 90°. A passivation layer is formed on the substrate. The passivation layer lines the pad interconnect and covers an exposed surface of the pad dielectric layer.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: September 15, 2020
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Fook Hong Lee, Juan Boon Tan, Ee Jan Khor
  • Patent number: 10734572
    Abstract: A device including a capping layer over a portion of a top electrode, and method of production thereof. Embodiments include an MRAM cell in a first region and a logic area in a second region of a substrate, wherein the MRAM cell includes a MTJ pillar between a top electrode and a bottom electrode; and a capping layer over a portion of the top electrode.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: August 4, 2020
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Yi Jiang, Curtis Chun-I Hsieh, Wanbing Yi, Juan Boon Tan
  • Patent number: 10734444
    Abstract: Integrated circuits with integrated memory devices and high capacitors, and methods for fabricating such integrated circuits are provided. An exemplary method for fabricating an integrated circuit includes forming, from a lower conductive layer, a lower memory interconnect and a lower capacitor interconnects over a substrate. The method further includes forming a conductive memory via coupled to the lower memory interconnect and a conductive capacitor vias coupled to the lower capacitor interconnect. Also, the method includes forming a memory structure over the memory via and forming a capacitor dielectric layer over the memory structure and over the capacitor via. Further, the method includes forming, from an upper conductive layer, an upper memory interconnect coupled to the memory structure and an upper capacitor interconnects over the capacitor dielectric layer over the capacitor via. The capacitor via, capacitor dielectric layer, and upper capacitor interconnects form the high capacitor.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: August 4, 2020
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Yi Jiang, Curtis Chun-I Hsieh, Wanbing Yi, Juan Boon Tan
  • Publication number: 20200243602
    Abstract: Integrated circuits with integrated memory devices and high capacitors, and methods for fabricating such integrated circuits are provided. An exemplary method for fabricating an integrated circuit includes forming, from a lower conductive layer, a lower memory interconnect and a lower capacitor interconnects over a substrate. The method further includes forming a conductive memory via coupled to the lower memory interconnect and a conductive capacitor vias coupled to the lower capacitor interconnect. Also, the method includes forming a memory structure over the memory via and forming a capacitor dielectric layer over the memory structure and over the capacitor via. Further, the method includes forming, from an upper conductive layer, an upper memory interconnect coupled to the memory structure and an upper capacitor interconnects over the capacitor dielectric layer over the capacitor via. The capacitor via, capacitor dielectric layer, and upper capacitor interconnects form the high capacitor.
    Type: Application
    Filed: January 28, 2019
    Publication date: July 30, 2020
    Inventors: Yi Jiang, Curtis Chun-I Hsieh, Wanbing Yi, Juan Boon Tan
  • Patent number: 10720580
    Abstract: A device including a reduced top RRAM electrode structure, and method of production thereof. Embodiments include a bottom resistive random-access memory (RRAM) electrode structure over a plurality of lower metal level contacts formed laterally separated in a substrate; a resistive switching structure over the bottom RRAM electrode structure; a top RRAM electrode structure over the resistive switching structure; a protective structure over the top RRAM electrode structure; an encapsulation structure over the bottom RRAM electrode structure and on sidewalls of the resistive switching structure, the top RRAM electrode structure and the protective structure; and an Nblock layer over the substrate.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: July 21, 2020
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Curtis Chun-I Hsieh, Wei-Hui Hsu, Wanbing Yi, Yi Jiang, Juan Boon Tan
  • Patent number: 10707358
    Abstract: A semiconductor device having a substrate with at least one photo-detecting region and at least one bond pad is provided. A first passivation layer is deposited over the substrate and over step portions at the edges of the bond pad and a trench having sidewalls and a bottom surface is formed in the substrate. A light shielding layer is deposited over the first passivation layer and covering the trench sidewalls. The light shielding layer has end portions at the photo-detecting region, at step portions at the edges of the bond pad and at the bottom surface of the trench. A second passivation layer is deposited over the light shielding layer. A third passivation layer is deposited over the end portions of the light shielding layer at the photo-detecting region and at the step portions at edges of the bond pad.
    Type: Grant
    Filed: July 4, 2018
    Date of Patent: July 7, 2020
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Wanbing Yi, Juan Boon Tan, Kiok Boone Elgin Quek, Khee Yong Lim, Chim Seng Seet, Rajesh Nair
  • Patent number: 10693054
    Abstract: A method of forming a memory cell with a high aspect ratio metal via formed underneath a metal tunnel junction (MTJ) and the resulting device are provided. Embodiments include a device having a metal via formed underneath a metal tunnel junction (MTJ) in a memory cell, and the metal via has an aspect ratio smaller than 2.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: June 23, 2020
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Danny Pak-Chum Shum, Wanbing Yi, Curtis Chun-I Hsieh, Yi Jiang, Juan Boon Tan, Benfu Lin
  • Publication number: 20200194496
    Abstract: Integrated circuits with embedded memory structures, and methods for fabricating integrated circuits are provided. An exemplary method for fabricating an integrated circuit includes forming from a first metallization layer a first lower conductive interconnect in a first region of a dielectric layer and a second lower conductive interconnect in a second region of the dielectric layer. The method includes forming a memory structure in the first region. Further, the method includes depositing an interlayer dielectric over the first region and over the second region. Also, the method includes forming from a second metallization layer a first upper conductive interconnect over the interlayer dielectric, wherein the first upper conductive interconnect is coupled to the memory structure.
    Type: Application
    Filed: December 12, 2018
    Publication date: June 18, 2020
    Inventors: Curtis Chun-I Hsieh, Wanbing Yi, Yi Jiang, Juan Boon Tan
  • Patent number: 10658316
    Abstract: According to an aspect of the present disclosure, a semiconductor device is provided that includes a substrate, at least one bond pad, a passivation layer and a NBLoK layer. The bond pad is formed over the substrate. The passivation layer is deposited over the substrate and has an opening defined by end portions of the passivation layer over the bond pad. The NBLoK layer is covering the end portions of the passivation layer.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: May 19, 2020
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Xiaodong Li, Juan Boon Tan, Ramasamy Chockalingam
  • Patent number: 10651380
    Abstract: In a non-limiting embodiment, a device may be formed having a substrate that has at least a first region. A base dielectric layer is arranged over the substrate. The base dielectric layer includes an interconnect in the first region. A first electrode is arranged over the interconnect in the first region. A mask structure is arranged over the first electrode. At least one spacer stack is arranged at least partially around the mask structure and the first electrode. The spacer stack(s) includes a resistive switching element at least partially lining sidewalls of the mask structure and the first electrode, and a second electrode arranged over the resistive switching element.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: May 12, 2020
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Curtis Chun-I Hsieh, Wei-Hui Hsu, Wanbing Yi, Yi Jiang, Juan Boon Tan
  • Patent number: 10636867
    Abstract: A method of forming an integrated circuit with a metal-insulator-poly (MIP) capacitor formed in a high-k metal gate (HKMG) process and the resulting device are provided. Embodiments include a device including a metal gate; a high-k dielectric layer formed around side walls of the metal gate, and a dummy polysilicon gate adjacent to at least one portion of the high-k dielectric layer. The device also includes a capacitor including the HK layer as an insulator, wherein the insulator is between a dummy as one electrode and the metal gate as another electrode.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: April 28, 2020
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Xinshu Cai, Shyue Seng Tan, Juan Boon Tan, Danny Pak-Chum Shum
  • Publication number: 20200127197
    Abstract: A device including a reduced top RRAM electrode structure, and method of production thereof. Embodiments include a bottom resistive random-access memory (RRAM) electrode structure over a plurality of lower metal level contact formed laterally separated in a substrate; a resistive switching structure over the bottom RRAM electrode structure; a top RRAM electrode structure over the resistive switching structure; a protective structure over the top RRAM electrode structure; an encapsulation structure over the bottom RRAM electrode structure and on sidewalls of the resistive switching structure, the top RRAM electrode structure and the protective structure; and an Nblock layer over the substrate.
    Type: Application
    Filed: October 22, 2018
    Publication date: April 23, 2020
    Inventors: Curtis Chun-I HSIEH, Wei-Hui HSU, Wanbing YI, Yi JIANG, Juan Boon TAN
  • Publication number: 20200105690
    Abstract: According to an aspect of the present disclosure, a semiconductor device is provided that includes a substrate, at least one bond pad, a passivation layer and a NBLoK layer. The bond pad is formed over the substrate. The passivation layer is deposited over the substrate and has an opening defined by end portions of the passivation layer over the bond pad. The NBLoK layer is covering the end portions of the passivation layer.
    Type: Application
    Filed: October 2, 2018
    Publication date: April 2, 2020
    Inventors: XIAODONG LI, JUAN BOON TAN, RAMASAMY CHOCKALINGAM
  • Patent number: 10608046
    Abstract: Devices and methods of forming a device. A two-terminal device element includes a device stack coupled between first and second terminals. The first terminal contacts a metal line in an underlying interconnect level, and the second terminal is formed over the device layer. An encapsulation liner covers exposed side surfaces of the device stack of the two-terminal device element. A dual damascene interconnect is coupled to the two-terminal device element.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: March 31, 2020
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Wanbing Yi, Curtis Chun-I Hsieh, Juan Boon Tan, Soh Yun Siah, Hai Cong, Alex See, Young Seon You, Danny Pak-Chum Shum, Hyunwoo Yang
  • Publication number: 20200091020
    Abstract: A semiconductor interconnect structure including a conductive layer, a plurality of interconnect vias and a pad is presented. The interconnect vias are formed over the conductive layer and the pad having a substantially flat surface is formed over the plurality of interconnect vias. The conductive layer may be a conductive line and/or a conductive plate connected to a conductive line.
    Type: Application
    Filed: September 13, 2018
    Publication date: March 19, 2020
    Inventors: WANBING YI, LAIQIANG LUO, XINGYU CHEN, FAN ZHANG, JUAN BOON TAN
  • Patent number: 10593728
    Abstract: Integrated circuits and methods for fabricating magnetic tunnel junction (MTJ) structures and integrated circuits are provided. An exemplary method for fabricating an integrated circuit including a magnetic tunnel junction (MTJ) structure includes forming magnetic tunnel junction (MTJ) layers over a substrate. Further, the method includes forming a conductive pillar over the MTJ layers, wherein the conductive pillar is formed with an uppermost surface, and wherein the uppermost surface is not planarized. Also, the method includes etching the MTJ layers to form a pillar structure from portions of the MTJ layers underlying the conductive pillar.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: March 17, 2020
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Curtis Chun-I Hsieh, Wanbing Yi, Yi Jiang, Juan Boon Tan
  • Patent number: 10580968
    Abstract: In a non-limiting embodiment, a device may be formed having a substrate that has at least a first region and a second region. The first region includes a memory region having at least one magnetic tunnel junction (MTJ) stack, and the second region includes a logic region. An encapsulation stack is formed in the first and second regions and over the MTJ stack(s). The encapsulation stack includes a first layer, a second layer, and a third layer. A single etch may remove at least a portion of the third layer, the second layer, and the first layer of the encapsulation stack to form a self-aligned MTJ via opening over the at least one MTJ stack to form one or more peaks from the encapsulation stack above or around the MTJ stack.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: March 3, 2020
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Wanbing Yi, Curtis Chun-I Hsieh, Yi Jiang, Juan Boon Tan
  • Patent number: 10566384
    Abstract: Methods of fabricating a flexible dummy fill to increase MTJ density are provided. Embodiments include forming a first oxide layer; forming lower interconnect layers in the first oxide layer; forming a nitride layer over the first oxide layer and the lower interconnect layers; forming a second oxide layer over the nitride layer; forming bottom electrodes through the second oxide layer and the nitride layer contacting a portion of an upper surface of the lower interconnect layers; forming MTJ structures over the bottom electrodes; forming top electrodes over the MTJ structures; and forming upper interconnect layers over one or more of the top electrodes.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: February 18, 2020
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Wanbing Yi, Neha Nayyar, Curtis Chun-I Hsieh, Mahesh Bhatkar, Wenjun Liu, Juan Boon Tan
  • Patent number: 10553488
    Abstract: Devices and methods for forming a device are disclosed. The method includes providing a substrate having first and second surfaces. At least one through silicon via (TSV) opening is formed in the substrate. The TSV opening extends through the first and second surfaces of the substrate. An alignment trench corresponding to an alignment mark is formed in the substrate. The alignment trench extends from the first surface of the substrate to a depth shallower than a depth of the TSV opening. A dielectric liner layer is provided over the substrate. The dielectric liner layer at least lines sidewalls of the TSV opening. A conductive layer is provided over the substrate. The conductive layer fills at least the TSV opening to form TSV contact. A redistribution layer (RDL) is formed over the substrate. The RDL layer is patterned using a reticle to form at least one opening which corresponds to a TSV contact pad. The reticle is aligned using the alignment mark in the substrate.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: February 4, 2020
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Shunqiang Gong, Juan Boon Tan, Shijie Wang, Mahesh Bhatkar, Daxiang Wang
  • Publication number: 20200035906
    Abstract: A method of forming a memory cell with a high aspect ratio metal via formed underneath a metal tunnel junction (MTJ) and the resulting device are provided. Embodiments include a device having a metal via formed underneath a metal tunnel junction (MTJ) in a memory cell, and the metal via has an aspect ratio smaller than 2.
    Type: Application
    Filed: July 26, 2018
    Publication date: January 30, 2020
    Inventors: Danny Pak-Chum SHUM, Wanbing YI, Curtis Chun-I HSIEH, Yi JIANG, Juan Boon TAN, Benfu LIN