Abstract: In some examples, a semiconductor package includes a semiconductor die; a conductive member coupled to the semiconductor die; and a multi-layer package substrate. The multi-layer package substrate includes a first horizontal metal layer to provide a ground connection; a second horizontal metal layer above the first horizontal metal layer; vertical members coupling to the first and second horizontal metal layers; and a mold compound covering the first and second horizontal metal layers and the vertical members. The first horizontal metal layer, the second horizontal metal layer, and the vertical members together form a structure including a conductive strip coupled to the conductive member, a transition member coupled to the conductive strip, a waveguide coupled to the transition member, and a horn antenna coupled to the waveguide.

Abstract: A quantum-based sensor includes a hollow electromagnetic (EM) waveguide having non-metallic layers and external metallic layers. The hollow EM waveguide encloses a gas having a pressure that is less than a threshold pressure, and all interior surfaces of the hollow EM waveguide in contact with the gas are non-metallic.

Abstract: An example microelectronic device package includes: a multilayer package substrate including a slotted waveguide antenna and having routing conductors, the multilayer package substrate having a device side surface and an opposing board side surface; a semiconductor die mounted to the device side surface of the multilayer package substrate and coupled to slotted waveguide antenna by the routing conductors; and mold compound covering the semiconductor die, and a portion of the multilayer package substrate.

Abstract: An integrated circuit package includes a first die attach pad (DAP) having a first bottom surface, a first semiconductor die attached to the first DAP, a second DAP having a second bottom surface, wherein the first bottom surface and the second bottom surface are coplanar, and a second semiconductor die attached to the second DAP. A nonlinear DAP linking structure couples the first DAP to the second DAP, wherein the DAP linking structure does not include any direct linear connections between the first DAP and the second DAP. The nonlinear DAP linking structure is configured to deform without causing the first DAP and the second DAP to become non-coplanar. A mold compound covers the first and second DAPs, the first and second semiconductor dies, and the nonlinear DAP linking structure.

Abstract: In a described example, an apparatus includes: a patch antenna formed in a first conductor layer on a device side surface of a multilayer package substrate, the multilayer package substrate including conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers, the multilayer package substrate having a board side surface opposite the device side surface; and a semiconductor die mounted to the device side surface of the multilayer package substrate spaced from and coupled to the patch antenna.

Abstract: A system includes first and second gas cells each comprising a respective sealed interior waveguide; first transmit antenna coupled to the first gas cell to provide a first electromagnetic wave to the first gas cell along a first direction; second transmit antenna coupled to the first gas cell to provide a second electromagnetic wave to the first gas cell along a second direction opposite the first direction; third transmit antenna coupled to the second gas cell to provide a third electromagnetic wave to the second gas cell; first receive antenna coupled to the first gas cell to generate a first signal indicative of an amount of energy in first electromagnetic wave; second receive antenna coupled to the second gas cell to generate a second signal indicative of an amount of energy in second electromagnetic wave; and processor to calculate a background-free signal based on a difference between first and second signals.

Abstract: A system includes first and second gas cells, each comprising a respective sealed interior waveguide. The first gas cell contains a dipolar gas and the second gas cell does not contain a dipolar gas. The system includes first and second transmit antennas coupled to the first and second gas cells, respectively, to provide first and second electromagnetic waves to the interior of the first and second gas cells, respectively; first receive antenna coupled to the first gas cell to generate a first signal indicative of an amount of energy in the first electromagnetic wave after travel through the first gas cell; second receive antenna coupled to the second gas cell to generate a second signal indicative of an amount of energy in the second electromagnetic wave after travel through the second gas cell; processor configured to calculate a background-free signal based on a difference between the first and second signals.

Abstract: A millimeter wave molecular sensor system is provided. The system includes a physics cell configured to contain a sample, a directional coupler configured to receive input millimeter waves, partition the input millimeter waves into a pump signal and a probe signal for transfer to the physics cell, a receiver configured to receive millimeter waves exiting the physics cell, a Faraday rotator coupled between a pump transmitter and the physics cell, and a coupling iris coupled between the Faraday rotator and the physics cell, configured to pass millimeter waves having a first polarization into the physics cell. The Faraday rotator includes a Faraday material, and an electronic device configured to apply a magnetic field to the Faraday material parallel to a propagation direction of the millimeter waves such that when the electronic device is activated, the Faraday material rotates a polarization of the millimeter waves passing through the Faraday rotator.

Abstract: A system includes first and second gas cells, each comprising a respective sealed interior waveguide. The first gas cell contains a dipolar gas and the second gas cell does not contain a dipolar gas. The system includes first and second transmit antennas coupled to the first and second gas cells, respectively, to provide first and second electromagnetic waves to the interior of the first and second gas cells, respectively; first receive antenna coupled to the first gas cell to generate a first signal indicative of an amount of energy in the first electromagnetic wave after travel through the first gas cell; second receive antenna coupled to the second gas cell to generate a second signal indicative of an amount of energy in the second electromagnetic wave after travel through the second gas cell; processor configured to calculate a background-free signal based on a difference between the first and second signals.

Abstract: A system includes first and second gas cells each comprising a respective sealed interior waveguide; first transmit antenna coupled to the first gas cell to provide a first electromagnetic wave to the first gas cell along a first direction; second transmit antenna coupled to the first gas cell to provide a second electromagnetic wave to the first gas cell along a second direction opposite the first direction; third transmit antenna coupled to the second gas cell to provide a third electromagnetic wave to the second gas cell; first receive antenna coupled to the first gas cell to generate a first signal indicative of an amount of energy in first electromagnetic wave; second receive antenna coupled to the second gas cell to generate a second signal indicative of an amount of energy in second electromagnetic wave; and processor to calculate a background-free signal based on a difference between first and second signals.

Abstract: A magnetometer for measuring an external magnetic influence proximate the magnetometer. The magnetometer has: (i) a volumetric enclosure for storing an alkali metal; (2) a laser proximate the volumetric enclosure and having an axis in a first dimension and along which photons are directed toward a first surface of the volumetric enclosure; (3) a photodetector proximate a second surface of the volumetric enclosure and for receiving light emanating from the laser and passing through the volumetric enclosure, wherein the photodetector is for providing a photodetector signal in response to an intensity of light emanating from the laser and passing through the volumetric enclosure; and (4) at least one magnetic field reducer for providing a magnetic field in a second dimension orthogonal to the first dimension.

Abstract: A package for a chip scale atomic clock or magnetometer is disclosed. The package includes a vapor cell using an alkali metal vapor, first and second photodetectors, and a laser operable at a frequency that excites an electron transition in the alkali metal vapor. The laser is positioned to provide an optical signal directed through the vapor cell and towards the first photodetector. The package further contains a polarizing beam splitter, the polarizing beam splitter positioned between the vapor cell and the first photodetector to receive the optical signal and to split the optical signal into a first signal directed toward the first photodetector and a second signal directed toward the second photodetector, the first signal being orthogonal to the second signal.

Abstract: A chip scale vapor cell and millimeter wave atomic clock apparatus are disclosed. The chip scale vapor cell includes a first substrate and a second substrate bonded to the first substrate with a bonding material. A primary hermetic cavity includes a first bottom wall and first sidewalls formed in the first substrate and a first top wall formed by the lower surface of the second substrate. A secondary hermetic cavity includes a second bottom wall and second sidewalls formed in the first substrate and a second top wall formed by the lower surface of the second substrate. The secondary hermetic cavity is separate from the primary hermetic cavity and surrounds the perimeter of the primary hermetic cavity. A gas, which can be a dipolar molecular gas, is sealed in the primary hermetic cavity and the secondary hermetic cavity at a given initial pressure.

Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Abstract: A magnetometer for measuring an external magnetic influence proximate the magnetometer. The magnetometer has: (i) a volumetric enclosure for storing an alkali metal; (2) a laser proximate the volumetric enclosure and having an axis in a first dimension and along which photons are directed toward a first surface of the volumetric enclosure; (3) a photodetector proximate a second surface of the volumetric enclosure and for receiving light emanating from the laser and passing through the volumetric enclosure, wherein the photodetector is for providing a photodetector signal in response to an intensity of light emanating from the laser and passing through the volumetric enclosure; and (4) at least one magnetic field reducer for providing a magnetic field in a second dimension orthogonal to the first dimension.

Abstract: A package for a chip scale atomic clock or magnetometer is disclosed. The package includes a vapor cell using an alkali metal vapor, first and second photodetectors, and a laser operable at a frequency that excites an electron transition in the alkali metal vapor. The laser is positioned to provide an optical signal directed through the vapor cell and towards the first photodetector. The package further contains a polarizing beam splitter, the polarizing beam splitter positioned between the vapor cell and the first photodetector to receive the optical signal and to split the optical signal into a first signal directed toward the first photodetector and a second signal directed toward the second photodetector, the first signal being orthogonal to the second signal.

Abstract: A chip scale vapor cell and millimeter wave atomic clock apparatus are disclosed. The chip scale vapor cell includes a first substrate and a second substrate bonded to the first substrate with a bonding material. A primary hermetic cavity includes a first bottom wall and first sidewalls formed in the first substrate and a first top wall formed by the lower surface of the second substrate. A secondary hermetic cavity includes a second bottom wall and second sidewalls formed in the first substrate and a second top wall formed by the lower surface of the second substrate. The secondary hermetic cavity is separate from the primary hermetic cavity and surrounds the perimeter of the primary hermetic cavity. A gas, which can be a dipolar molecular gas, is sealed in the primary hermetic cavity and the secondary hermetic cavity at a given initial pressure.

Abstract: A power field-effect transistor package is fabricated. A leadframe including a flat plate and a coplanar flat strip spaced from the plate is provided. The plate has a first thickness and the strip has a second thickness smaller than the first thickness. A field-effect power transistor chip having a third thickness is provided. A first and second contact pad on one chip side and a third contact pad on the opposite chip side are created. The first pad is attached to the plate and the second pad to the strip. Terminals are concurrently attached to the plate and the strip so that the terminals are coplanar with the third contact pad. The thickness difference between plate and strip and spaces between chip and terminals is filled with an encapsulation compound having a surface coplanar with the plate and the opposite surface coplanar with the third pad and terminals. The chip, leadframe and terminals are integrated into a package having a thickness equal to the sum of the first and third thicknesses.

Abstract: An integrated circuit (“IC”) assembly includes an IC die with a metallization layer on a top surface thereof. A plurality of lead wires are bonded at first end portions thereof to the metallization layer. A conductive layer is attached to the metallization layer and covers the first ends of the lead wires.

Abstract: A field-effect transistor package includes a leadframe with a first linear thickness (150a) and a leadframe pad (151) of a reduced thickness; a first terminal of a field-effect transistor chip (140) attached to the pad and a second and a third terminal remote from the pad; a metal sheet (110) of a second linear thickness (110a) connecting the second transistor terminal to a package terminal; a metal sheet (112) of a third linear thickness (112a) connecting the third transistor terminal to a package terminal; the sum of the first linear thickness (about 0.125 mm) and the second linear thickness (about 0.125 mm) plus attach material (about 0.05 mm) comprising the package thickness (about 0.3 mm).