Patents by Inventor Juan Herbsommer

Juan Herbsommer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11119038
    Abstract: A millimeter wave molecular sensor system is provided. The system includes a physics cell configured to contain a sample, a directional coupler configured to receive input millimeter waves, partition the input millimeter waves into a pump signal and a probe signal for transfer to the physics cell, a receiver configured to receive millimeter waves exiting the physics cell, a Faraday rotator coupled between a pump transmitter and the physics cell, and a coupling iris coupled between the Faraday rotator and the physics cell, configured to pass millimeter waves having a first polarization into the physics cell. The Faraday rotator includes a Faraday material, and an electronic device configured to apply a magnetic field to the Faraday material parallel to a propagation direction of the millimeter waves such that when the electronic device is activated, the Faraday material rotates a polarization of the millimeter waves passing through the Faraday rotator.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: September 14, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Argyrios Dellis, Adam Joseph Fruehling, Bichoy Bahr, Juan Herbsommer
  • Publication number: 20210199702
    Abstract: A system includes first and second gas cells, each comprising a respective sealed interior waveguide. The first gas cell contains a dipolar gas and the second gas cell does not contain a dipolar gas. The system includes first and second transmit antennas coupled to the first and second gas cells, respectively, to provide first and second electromagnetic waves to the interior of the first and second gas cells, respectively; first receive antenna coupled to the first gas cell to generate a first signal indicative of an amount of energy in the first electromagnetic wave after travel through the first gas cell; second receive antenna coupled to the second gas cell to generate a second signal indicative of an amount of energy in the second electromagnetic wave after travel through the second gas cell; processor configured to calculate a background-free signal based on a difference between the first and second signals.
    Type: Application
    Filed: December 30, 2019
    Publication date: July 1, 2021
    Inventors: Argyrios DELLIS, Juan HERBSOMMER, Adam Joseph FRUEHLING
  • Publication number: 20210199598
    Abstract: A system includes first and second gas cells each comprising a respective sealed interior waveguide; first transmit antenna coupled to the first gas cell to provide a first electromagnetic wave to the first gas cell along a first direction; second transmit antenna coupled to the first gas cell to provide a second electromagnetic wave to the first gas cell along a second direction opposite the first direction; third transmit antenna coupled to the second gas cell to provide a third electromagnetic wave to the second gas cell; first receive antenna coupled to the first gas cell to generate a first signal indicative of an amount of energy in first electromagnetic wave; second receive antenna coupled to the second gas cell to generate a second signal indicative of an amount of energy in second electromagnetic wave; and processor to calculate a background-free signal based on a difference between first and second signals.
    Type: Application
    Filed: December 30, 2019
    Publication date: July 1, 2021
    Inventors: Argyrios DELLIS, Juan HERBSOMMER, Adam Joseph FRUEHLING
  • Patent number: 10634738
    Abstract: A magnetometer for measuring an external magnetic influence proximate the magnetometer. The magnetometer has: (i) a volumetric enclosure for storing an alkali metal; (2) a laser proximate the volumetric enclosure and having an axis in a first dimension and along which photons are directed toward a first surface of the volumetric enclosure; (3) a photodetector proximate a second surface of the volumetric enclosure and for receiving light emanating from the laser and passing through the volumetric enclosure, wherein the photodetector is for providing a photodetector signal in response to an intensity of light emanating from the laser and passing through the volumetric enclosure; and (4) at least one magnetic field reducer for providing a magnetic field in a second dimension orthogonal to the first dimension.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: April 28, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Cook, Juan Herbsommer
  • Patent number: 10539630
    Abstract: A package for a chip scale atomic clock or magnetometer is disclosed. The package includes a vapor cell using an alkali metal vapor, first and second photodetectors, and a laser operable at a frequency that excites an electron transition in the alkali metal vapor. The laser is positioned to provide an optical signal directed through the vapor cell and towards the first photodetector. The package further contains a polarizing beam splitter, the polarizing beam splitter positioned between the vapor cell and the first photodetector to receive the optical signal and to split the optical signal into a first signal directed toward the first photodetector and a second signal directed toward the second photodetector, the first signal being orthogonal to the second signal.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: January 21, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Juan Herbsommer, Benjamin Cook
  • Patent number: 10374621
    Abstract: A chip scale vapor cell and millimeter wave atomic clock apparatus are disclosed. The chip scale vapor cell includes a first substrate and a second substrate bonded to the first substrate with a bonding material. A primary hermetic cavity includes a first bottom wall and first sidewalls formed in the first substrate and a first top wall formed by the lower surface of the second substrate. A secondary hermetic cavity includes a second bottom wall and second sidewalls formed in the first substrate and a second top wall formed by the lower surface of the second substrate. The secondary hermetic cavity is separate from the primary hermetic cavity and surrounds the perimeter of the primary hermetic cavity. A gas, which can be a dipolar molecular gas, is sealed in the primary hermetic cavity and the secondary hermetic cavity at a given initial pressure.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: August 6, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Juan Herbsommer, Benjamin Cook, S. Josh Jacobs
  • Patent number: 10251258
    Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: April 2, 2019
    Assignee: Texas Instruments Incorporated
    Inventors: Juan A. Herbsommer, Robert F. Payne, Marco Corsi, Baher S. Haroun, Hassan Ali
  • Publication number: 20190033400
    Abstract: A magnetometer for measuring an external magnetic influence proximate the magnetometer. The magnetometer has: (i) a volumetric enclosure for storing an alkali metal; (2) a laser proximate the volumetric enclosure and having an axis in a first dimension and along which photons are directed toward a first surface of the volumetric enclosure; (3) a photodetector proximate a second surface of the volumetric enclosure and for receiving light emanating from the laser and passing through the volumetric enclosure, wherein the photodetector is for providing a photodetector signal in response to an intensity of light emanating from the laser and passing through the volumetric enclosure; and (4) at least one magnetic field reducer for providing a magnetic field in a second dimension orthogonal to the first dimension.
    Type: Application
    Filed: July 31, 2017
    Publication date: January 31, 2019
    Inventors: Benjamin Cook, Juan Herbsommer
  • Publication number: 20180159547
    Abstract: A chip scale vapor cell and millimeter wave atomic clock apparatus are disclosed. The chip scale vapor cell includes a first substrate and a second substrate bonded to the first substrate with a bonding material. A primary hermetic cavity includes a first bottom wall and first sidewalls formed in the first substrate and a first top wall formed by the lower surface of the second substrate. A secondary hermetic cavity includes a second bottom wall and second sidewalls formed in the first substrate and a second top wall formed by the lower surface of the second substrate. The secondary hermetic cavity is separate from the primary hermetic cavity and surrounds the perimeter of the primary hermetic cavity. A gas, which can be a dipolar molecular gas, is sealed in the primary hermetic cavity and the secondary hermetic cavity at a given initial pressure.
    Type: Application
    Filed: December 1, 2016
    Publication date: June 7, 2018
    Inventors: Juan Herbsommer, Benjamin Cook, S. Josh Jacobs
  • Publication number: 20180156875
    Abstract: A package for a chip scale atomic clock or magnetometer is disclosed. The package includes a vapor cell using an alkali metal vapor, first and second photodetectors, and a laser operable at a frequency that excites an electron transition in the alkali metal vapor. The laser is positioned to provide an optical signal directed through the vapor cell and towards the first photodetector. The package further contains a polarizing beam splitter, the polarizing beam splitter positioned between the vapor cell and the first photodetector to receive the optical signal and to split the optical signal into a first signal directed toward the first photodetector and a second signal directed toward the second photodetector, the first signal being orthogonal to the second signal.
    Type: Application
    Filed: December 2, 2016
    Publication date: June 7, 2018
    Inventors: Juan Herbsommer, Benjamin Cook
  • Patent number: 9779967
    Abstract: A power field-effect transistor package is fabricated. A leadframe including a flat plate and a coplanar flat strip spaced from the plate is provided. The plate has a first thickness and the strip has a second thickness smaller than the first thickness. A field-effect power transistor chip having a third thickness is provided. A first and second contact pad on one chip side and a third contact pad on the opposite chip side are created. The first pad is attached to the plate and the second pad to the strip. Terminals are concurrently attached to the plate and the strip so that the terminals are coplanar with the third contact pad. The thickness difference between plate and strip and spaces between chip and terminals is filled with an encapsulation compound having a surface coplanar with the plate and the opposite surface coplanar with the third pad and terminals. The chip, leadframe and terminals are integrated into a package having a thickness equal to the sum of the first and third thicknesses.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: October 3, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Juan A Herbsommer, Osvaldo J Lopez, Jonathan A Noquil
  • Patent number: 9553068
    Abstract: An integrated circuit (“IC”) assembly includes an IC die with a metallization layer on a top surface thereof. A plurality of lead wires are bonded at first end portions thereof to the metallization layer. A conductive layer is attached to the metallization layer and covers the first ends of the lead wires.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: January 24, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Osvaldo Jorge Lopez, Jonathan Almeria Noquil, Juan Herbsommer
  • Patent number: 9508633
    Abstract: A field-effect transistor package includes a leadframe with a first linear thickness (150a) and a leadframe pad (151) of a reduced thickness; a first terminal of a field-effect transistor chip (140) attached to the pad and a second and a third terminal remote from the pad; a metal sheet (110) of a second linear thickness (110a) connecting the second transistor terminal to a package terminal; a metal sheet (112) of a third linear thickness (112a) connecting the third transistor terminal to a package terminal; the sum of the first linear thickness (about 0.125 mm) and the second linear thickness (about 0.125 mm) plus attach material (about 0.05 mm) comprising the package thickness (about 0.3 mm).
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: November 29, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Juan A. Herbsommer, Osvaldo J. Lopez, Jonathan A. Noquil
  • Publication number: 20160309581
    Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.
    Type: Application
    Filed: June 28, 2016
    Publication date: October 20, 2016
    Inventors: Juan A. Herbsommer, Robert F. Payne, Marco Corsi, Baher S. Haroun, Hassan Ali
  • Patent number: 9405064
    Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: August 2, 2016
    Assignee: Texas Instruments Incorporated
    Inventors: Juan A. Herbsommer, Robert F. Payne, Marco Corsi, Baher S. Haroun, Hassan Ali
  • Publication number: 20160005627
    Abstract: A power field-effect transistor package is fabricated. A leadframe including a flat plate and a coplanar flat strip spaced from the plate is provided. The plate has a first thickness and the strip has a second thickness smaller than the first thickness. A field-effect power transistor chip having a third thickness is provided. A first and second contact pad on one chip side and a third contact pad on the opposite chip side are created. The first pad is attached to the plate and the second pad to the strip. Terminals are concurrently attached to the plate and the strip so that the terminals are coplanar with the third contact pad. The thickness difference between plate and strip and spaces between chip and terminals is filled with an encapsulation compound having a surface coplanar with the plate and the opposite surface coplanar with the third pad and terminals. The chip, leadframe and terminals are integrated into a package having a thickness equal to the sum of the first and third thicknesses.
    Type: Application
    Filed: September 15, 2015
    Publication date: January 7, 2016
    Inventors: Juan A HERBSOMMER, Osvaldo J LOPEZ, Jonathan A NOQUIL
  • Patent number: 9165865
    Abstract: A packaged power transistor device (100) having a leadframe including a flat plate (110) and a coplanar flat strip (120) spaced from the plate, the plate having a first thickness (110a) and the strip having a second thickness (120a) smaller than the first thickness, the plate and the strip having terminals (212; 121a). A field-effect power transistor chip (210) having a third thickness (210a), a first and a second contact pad on one chip side, and a third contact pad (211) on the opposite chip side, the first pad being attached to the plate, the second pad being attached to the strip, and the third pad being coplanar with the terminals.
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: October 20, 2015
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Juan A Herbsommer, Osvaldo J Lopez, Jonathan A Noquil
  • Publication number: 20150262965
    Abstract: An integrated circuit (“IC”) assembly includes an IC die with a metallization layer on a top surface thereof. A plurality of lead wires are bonded at first end portions thereof to the metallization layer. A conductive layer is attached to the metallization layer and covers the first ends of the lead wires.
    Type: Application
    Filed: May 29, 2015
    Publication date: September 17, 2015
    Inventors: Osvaldo Jorge Lopez, Jonathan Almeria Noquil, Juan Herbsommer
  • Patent number: 9076891
    Abstract: An integrated circuit (“IC”) assembly includes an IC die with a metallization layer on a top surface thereof. A plurality of lead wires are bonded at first end portions thereof to the metallization layer. A conductive layer is attached to the metallization layer and covers the first ends of the lead wires.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: July 7, 2015
    Assignee: TEXAS INSTRUMENTS INCORPORATION
    Inventors: Osvaldo Jorge Lopez, Jonathan Almeria Noquil, Juan Herbsommer
  • Patent number: 8910369
    Abstract: A method for fabricating a power supply converter comprises a load inductor wrapped by a metal sleeve structured to transform the inductor into a heat sink positioned to deposit layers of solder paste on a sleeve surface and on the inductor leads. A metal carrier having a portion of a first thickness and portions of a greater second thickness is placed on the solder layers of the inductor. The carrier portion of first thickness is aligned with the inductor sleeve. The carrier portions of second thickness are aligned with the inductor leads. A sync and a control FET are placed side-by-side on solder layers deposited on the carrier portion of first thickness opposite the inductor sleeve. Reflowing is preformed and the solder layers are solidified. The FETs, the carrier and the inductor become integrated and the un-soldered surfaces of the FETs and the carrier portions of second thickness become coplanar.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: December 16, 2014
    Assignee: Texas Instruments Incorporated
    Inventors: Juan A Herbsommer, Osvaldo J Lopez, Jonathan A Noquil, David Jauregui, Lucian Hriscu