Abstract: An electronic device display may have pixels formed from crystalline semiconductor light-emitting diode dies, organic light-emitting diodes, or other pixel structures. The pixels may be formed on a display panel substrate. A display panel may extend continuously across the display or multiple display panels may be tiled in two dimensions to cover a larger display area. Interconnect substrates may have outwardly facing contacts that are electrically shorted to corresponding inwardly facing contacts such as inwardly facing metal pillars associated with the display panels. The interconnect substrates may be supported by glass layers. Integrated circuits may be embedded in the display panels and/or in the interconnect substrates. A display may have an active area with pixels that includes non-spline pixels in a non-spline display portion located above a straight edge of the display and spline pixel in a spline display portion located above a curved edge of the display.

Abstract: A battery module including a battery frame, a plurality of locking structures, a plurality of battery units, and a plurality of lug structures is provided. The battery frame is provided with an accommodating space. The battery frame includes a first portion extending along a first direction and a second portion extending along a second direction. The first direction is different from the second direction. The locking structures are disposed on the battery frame. At least one of the plurality of locking structures is disposed on an outer side of each of the first portion and the second portion. The battery units are disposed in the accommodating space. Each of the lug structures includes a lock portion configured to detachably engage with one of the locking structures.

Abstract: A packaging method and a package structure are provided. The packaging method includes the following steps. Firstly, a plurality of chips are disposed on a carrying surface of a carrying board for chip redistribution. Each of the chips includes a first side connected to the carrying surface and a second side opposite to the first side, and the second side is provided with at least one chip connecting member. Next, a base structure is provided. The base structure has a bonding surface provided with a plurality of predetermined areas for bonding the chips respectively, and each of the predetermined regions has at least one electrically connecting structure formed therein. Lastly, an encapsulating material is applied to integrate the base structure, the chips, and the carrying board into a unitary structure under specific hot pressing conditions.

Abstract: There is provided an electronic device including a battery, a first chip, a second chip and a communication bridge connecting the first chip and the second chip. The first chip is used to detect a voltage of the battery to determine a charging current, and to transmit information associated with the charging current to the second chip to cause a charging curve of the second chip to match that of the first chip.

Abstract: A semiconductor device with high heat dissipation efficiency includes a base structure, a semiconductor chip, a heat dissipating structure, and a package body. The semiconductor chip is disposed on the base structure and has a first surface distant from the base structure. The heat dissipating structure includes a buffer layer and a first heat spreader. The buffer layer is disposed on the first surface of the semiconductor chip and a coverage rate thereof on the first surface is at least 10%. The first heat spreader is disposed on the buffer layer and bonded to the first surface of the semiconductor chip through the buffer layer. The package body encloses the semiconductor chip and the heat dissipating structure, and the package body and the buffer layer have the same heat curing temperature.

Abstract: A vertical type multi-chip device includes a base structure, an intermediate layer, a first functional chip, and a second functional chip. The intermediate layer is disposed on the base structure and has a first signal transmission path and a second signal transmission path. The first functional chip is embedded in the intermediate layer and electrically connected to the base structure. The second functional chip is disposed on the intermediate layer and configured to be electrically connected to the first functional chip via the first signal transmission path and to the base structure via the second signal transmission path.

Abstract: A planar multi-chip device includes a base structure and a plurality of functional chips. The base structure has a central area and a peripheral area outside the central area. The central area includes a first conductive portion arranged therein. The peripheral area includes a plurality of second conductive portions and a plurality of third conductive portions arranged therein and separated from each other. The functional chips are arranged on the base structure, and each of the functional chips has a portion located on and electrically connected to the first conductive portion. At least two of the functional chips are configured to be in signal communication with each other via at least one of the third conductive portions.

Abstract: There is provided an electronic device including a battery, a first chip, a second chip and a communication bridge connecting the first chip and the second chip. The first chip is used to detect a voltage of the battery to determine a charging current, and to transmit information associated with the charging current to the second chip to cause a charging curve of the second chip to match that of the first chip.

Abstract: A semiconductor device with high heat dissipation efficiency includes a base structure, a semiconductor chip, a heat dissipating structure, and a package body. The semiconductor chip is disposed on the base structure and has a first surface distant from the base structure. The heat dissipating structure includes a buffer layer and a first heat spreader. The buffer layer is disposed on the first surface of the semiconductor chip and a coverage rate thereof on the first surface is at least 10%. The first heat spreader is disposed on the buffer layer and bonded to the first surface of the semiconductor chip through the buffer layer. The package body encloses the semiconductor chip and the heat dissipating structure, and the package body and the buffer layer have the same heat curing temperature.

Abstract: A multi-sensing system, a portable electronic device, and a touch-sensing method are provided. The multi-sensing system includes a sensing sheet and a carrier. The sensing sheet includes a substrate, and a touch-sensing circuit and a force-sensing circuit disposed on the substrate, wherein an orthogonal projection of the force-sensing circuit on the substrate and an orthogonal projection of the touch-sensing circuit on the substrate are misaligned from each other. The carrier has a carrying space and a carrying shoulder adjacent to the carrying space, wherein the carrier carries the sensing sheet with the carrying shoulder. The carrying space is used to accommodate a display element. The touch-sensing circuit is located above the display element.

Abstract: A multi-sensing system, a portable electronic device, and a touch-sensing method are provided. The multi-sensing system includes a sensing sheet and a carrier. The sensing sheet includes a substrate, and a touch-sensing circuit and a force-sensing circuit disposed on the substrate, wherein an orthogonal projection of the force-sensing circuit on the substrate and an orthogonal projection of the touch-sensing circuit on the substrate are misaligned from each other. The carrier has a carrying space and a carrying shoulder adjacent to the carrying space, wherein the carrier carries the sensing sheet with the carrying shoulder. The carrying space is used to accommodate a display element. The touch-sensing circuit is located above the display element.

Abstract: A support comprises a base and a support portion. The base includes four sides and each side includes an opening. The support portion is connected to the base and includes four pivoting elements and four bending brackets. Each pivoting element is disposed in each opening, and the bending brackets are connected with each other through the pivoting elements to form an annular bracket. One of the bending brackets is fixed to the base, and the other three bending brackets are detachably disposed on the base.

Abstract: An integrated inductor structure includes a capacitor, a guard ring, a patterned shield, and an inductor. The guard ring is coupled to the capacitor. The patterned shield is coupled to the guard ring through the capacitor, such that the patterned shield is floating. The inductor is disposed above the guard ring and the patterned shield.

Abstract: A touch panel assembly includes a touch panel and a flexible circuit board structure. The touch panel includes a sensing array, pads and connecting traces. The sensing array includes sensing units. The pads are disposed on a bonding region of the touch panel. The bonding region is located at a side of the sensing array. The connecting traces are located outside the sensing array and electrically connect the sensing units to the pads to actuate the sensing array. The flexible circuit board structure includes bonding portions and at least one key portion. Each bonding portion is disposed at the bonding region and includes a plurality of terminals electrically connected to the pads. The key portion includes a key circuit. The key portion is disposed between any two adjacent bonding portions. The bonding portions and the key portion are arranged along a direction substantially parallel to the side.

Abstract: An electronic system, a touch stylus and a data transmission method between an electronic apparatus and a touch stylus are disclosed herein. The data transmission method, utilized between a first electronic device and a touch stylus, includes steps of: generating movement data according to displacement of the touch stylus.

Abstract: A system includes a stylus including a body having an elongated portion, a tapered portion coupled to the elongated portion, and a conductive layer disposed on the elongated portion, an electronic device, a touch controller and a processing unit. The electronic device comprises a touch sensor generating a sensing signal when the touch sensor senses the conductive layer. The touch controller is coupled to the touch sensor, receives the sensing signal and generates a first signal based on the received sensing signal. The processing unit is coupled to the touch controller, receives the first signal and triggers a function of the electronic device based on the first signal.

Abstract: An integrated inductor structure includes a capacitor, a guard ring, a patterned shield, and an inductor. The guard ring is coupled to the capacitor. The patterned shield is coupled to the guard ring through the capacitor, such that the patterned shield is floating. The inductor is disposed above the guard ring and the patterned shield.

Abstract: The semiconductor structure includes a plurality of first insulators in a substrate, a common insulating layer surrounding the sidewall and the bottom of said first insulators in said substrate, and suspended portions of said substrate on said common insulating layer.

Abstract: A semiconductor structure includes a first gate and a second gate, a first spacer and a second spacer, two first epitaxial structures and two second epitaxial structures. The first gate and the second gate are located on a substrate. The first spacer and the second spacer are respectively located on the substrate beside the first gate and the second gate. The first epitaxial structures and the second epitaxial structures are respectively located in the substrate beside the first spacer and the second spacer, wherein the first spacer and the second spacer have different thicknesses, and the spacing between the first epitaxial structures is different from the spacing between the second epitaxial structures. Moreover, the present invention also provides a semiconductor process forming said semiconductor structure.

Abstract: A touch panel including a first substrate, plural first electrode lines and plural second electrode lines is provided. The first electrode lines and the second electrode lines are respectively arranged on the first substrate and extended along two different directions respectively. Each of the first electrode lines includes plural electrode pads and plural first connecting parts connected therebetween, wherein each of the first connecting parts has two end portions and a center portion, a width of each of the first connecting parts is decreased from the two end portions to the center portion, and corners of connections between the end portions and the corresponding electrode pads are smooth curved surfaces. The second electrode lines are electrically insulated with the first electrode lines, and perpendicular projections of each of the second electrode lines and the corresponding first connecting part on the first substrate are intersected to form an overlap region.