Abstract: A fastener structure and an assembling method thereof are introduced, the fastener structure includes a head portion, rod member and fitting member. The head portion has a lateral holding portion and vertical receiving portion. The rod member has a lateral attaching portion and engaging member. The rod member is penetratingly disposed at the receiving portion to allow the attaching portion to correspond in position to the holding portion. The fitting member is penetratingly disposed at the attaching portion and the holding portion to fit the head portion and the rod member together. To couple two objects together, the head portion drives the rod member to fasten or disengage, so as to achieve quick coupling and easy unfastening.

Abstract: A pulling member is introduced, which has flexibility or elasticity, the pulling member includes a corresponding part and a curved part, the curved part is disposed toward the corresponding part, the curved part is used to flexibly or elastically compress or abut against a plate body, in order to have a frictional force with the plate body when the pulling member is moving or staying. Accordingly, the pulling member of the present disclosure has the effects of simplicity of operation, saving labor and convenience.

Abstract: A fastening element includes a body portion and a fastening portion. The body portion is used to assemble a first object. The fastening portion is movably combined in the body portion, the fastening portion is provided with a height limiting portion, and the fastening portion is used to assemble a second object. The height limiting portion is abutted against the second object or limits a fastening stroke of the fastening portion, or the height limiting portion limits a distance between the first object and the second object. Accordingly, the fastening element can quickly combine and separate at least two objects, and achieve the effect of combining and separating repeatedly and quickly.

Abstract: A fastener structure used to arrange a second object on a first object and a method of use of the fastener structure includes an engaging portion, a direction limiting portion, and an assembly portion. The engaging portion is for engaging to a second object. The direction limiting portion is connected to the engaging portion and is for limiting a movement direction of the second object engaged with the engaging portion. The assembly portion is for assembling to the first object.

Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.

Abstract: A dynamic calibration method for heterogeneous sensors includes: sensing dynamic objects by a first sensor to generate first sensing data; sensing the dynamic objects by a second sensor to generate second sensing data; performing feature matching between the first sensing data and the second sensing data to determine first valid data and second valid data, and identifying a tracked object from the dynamic objects based on the first valid data and the second valid data; performing feature comparison between the first valid data and the second valid data corresponding to the tracked object to calculate data errors between the first sensor and the second sensor; and calculating a calibration parameter based on the first valid data and the second valid data when the number of the data errors exceeds an error threshold, and adjusting the first sensing data and the second sensing data based on the calibration parameter.

Abstract: Some embodiments relate to an integrated chip including a substrate having a first side and a second side opposite the first side. The integrated chip further includes a first photodetector positioned in a first pixel region within the substrate. A floating diffusion region with a first doping concentration of a first polarity is positioned on the first side of the substrate in the first pixel region. A first body contact region with a second doping concentration of a second polarity different from the first polarity is positioned on the second side of the substrate in the first pixel region.

Abstract: A power-on control method, a power-on control apparatus and an electronic device are provided in the present disclosure. The power-on control method includes, in response to receiving a power-on command, switching an enable signal of a power control chip from a low level to a high level, and monitoring an output voltage of the power control chip; and performing pulse-width modulation on the enable signal according to an increasing trend of the output voltage to control an increasing rate of the output voltage.

Abstract: Structures with doping free connections and methods of fabrication are provided. An exemplary structure includes a substrate; a first region of a first conductivity type formed in the substrate; an overlying layer located over the substrate; a well region of a second conductivity type formed in the overlying layer; a conductive plug laterally adjacent to the well region and extending through the overlying layer to electrically contact with the first region; and a passivation layer located between the conductive plug and the well region.

Abstract: An assembly module, an assembly apparatus, and a method of operating the assembly module are introduced. The assembly module includes a first assembly die, a second assembly die and at least one engagement die. The first assembly die has a plurality of first fitting portions. The second assembly die has a plurality of second fitting portions and corresponds in position to the first assembly die. The engagement die is removably disposed at a related point of at least one first fitting portion, at a related point of at least one second fitting portion or at related points of at least one first fitting portion and at least one second fitting portion. Therefore, the assembly module is effective in fitting a component and an assembly target together, easy to operate, and conducive to quick assembly.

Abstract: A wafer processing system and a rework method thereof are provided. An image capture device captures an image of a wafer to generate a captured image. A control device detects a defect pattern in the captured image, calculates a target removal thickness according to distribution of contrast values of the defect pattern, and controls a processing device to perform processing on the wafer according to the target removal thickness.

Abstract: A stacked via structure including a first dielectric layer, a first conductive via, a first redistribution wiring, a second dielectric layer and a second conductive via is provided. The first dielectric layer includes a first via opening. The first conductive via is in the first via opening. A first level height offset is between a top surface of the first conductive via and a top surface of the first dielectric layer. The first redistribution wiring covers the top surface of the first conductive via and the top surface of the first dielectric layer. The second dielectric layer is disposed on the first dielectric layer and the first redistribution wiring. The second dielectric layer includes a second via opening. The second conductive via is in the second via opening. The second conductive via is electrically connected to the first redistribution wiring through the second via opening of the second dielectric layer.

Abstract: An imaging optical lens assembly includes four lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element and a fourth lens element. Each of the four lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. At least one of all lens surfaces of the four lens elements is aspheric and has at least one inflection point.

Abstract: A physiological sensing device for sensing physiological signal of an organism is provided. The physiological sensing device includes a sensing chip, a coupling sensing electrode and a coupling dielectric stacked layer. The coupling sensing electrode is electrically connected to the sensing chip. The coupling dielectric stacked layer covers the coupling sensing electrode. The coupling dielectric stacked layer is located between the coupling sensing electrode and the organism. The coupling dielectric stacked layer includes a first dielectric layer and a second dielectric layer. The dielectric constant of the second dielectric layer is greater than that of the first dielectric layer. The second dielectric layer is located between the first dielectric layer and the organism.

Abstract: A method of mounting a connection element structure on a target is introduced and includes providing a lifting-laying tool to lift the connection element structure; moving the connection element structure to a default height above a mounting position of the target with the lifting-laying tool; and releasing or loosening the connection element structure from the lifting-laying tool to lay the connection element structure at the mounting position of the target. Therefore, the method can mount the connection element structure on the target, enhancing the efficiency of subsequent processes.

Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.

Abstract: A transmission device includes a daisy chain structure composed of at least three daisy chain units arranged periodically and continuously. Each of the daisy chain units includes first, second and third conductive lines, and first and second conductive pillars. The first and second conductive lines at a first layer extend along a first direction and are discontinuously arranged. The third conductive line at a second layer extends along the first direction and is substantially parallel to the first and second conductive lines. The first conductive pillar extends in a second direction. The second direction is different from the first direction. A first part of the first conductive pillar is connected to the first and third conductive lines. The second conductive pillar extends in the second direction. A first part of the second conductive pillar is connected to the second and third conductive lines.

Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.

Abstract: A method includes the following steps. A photoresist is exposed to a first light-exposure through a first mask, wherein the first mask includes a first stitching region, and a first portion of the photoresist corresponding to a first opaque portion of the first stitching region is unexposed. The photoresist is exposed to a second light-exposure through a second mask, wherein the second mask includes a second stitching region, and a second portion of the photoresist corresponding to a second opaque portion of the second stitching region is unexposed and is overlapping with the first portion of the photoresist.

Abstract: A fastening structure includes a body section and a fastener. The body section is movably combined with the fastener, and the body section is provided with a limiting segment or an uplift segment. The fastener is provided with a corresponding section. The limiting segment is used to make the corresponding section located at a limiting position, or the uplift segment is used to make the corresponding section located at a lifting position.