Abstract: A fastener structure used to arrange a second object on a first object and a method of use of the fastener structure includes an engaging portion, a direction limiting portion, and an assembly portion. The engaging portion is for engaging to a second object. The direction limiting portion is connected to the engaging portion and is for limiting a movement direction of the second object engaged with the engaging portion. The assembly portion is for assembling to the first object.

Abstract: An assembly module, an assembly apparatus, and a method of operating the assembly module are introduced. The assembly module includes a first assembly die, a second assembly die and at least one engagement die. The first assembly die has a plurality of first fitting portions. The second assembly die has a plurality of second fitting portions and corresponds in position to the first assembly die. The engagement die is removably disposed at a related point of at least one first fitting portion, at a related point of at least one second fitting portion or at related points of at least one first fitting portion and at least one second fitting portion. Therefore, the assembly module is effective in fitting a component and an assembly target together, easy to operate, and conducive to quick assembly.

Abstract: A physiological sensing device for sensing physiological signal of an organism is provided. The physiological sensing device includes a sensing chip, a coupling sensing electrode and a coupling dielectric stacked layer. The coupling sensing electrode is electrically connected to the sensing chip. The coupling dielectric stacked layer covers the coupling sensing electrode. The coupling dielectric stacked layer is located between the coupling sensing electrode and the organism. The coupling dielectric stacked layer includes a first dielectric layer and a second dielectric layer. The dielectric constant of the second dielectric layer is greater than that of the first dielectric layer. The second dielectric layer is located between the first dielectric layer and the organism.

Abstract: A method of mounting a connection element structure on a target is introduced and includes providing a lifting-laying tool to lift the connection element structure; moving the connection element structure to a default height above a mounting position of the target with the lifting-laying tool; and releasing or loosening the connection element structure from the lifting-laying tool to lay the connection element structure at the mounting position of the target. Therefore, the method can mount the connection element structure on the target, enhancing the efficiency of subsequent processes.

Abstract: An imaging optical lens assembly includes four lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element and a fourth lens element. Each of the four lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. At least one of all lens surfaces of the four lens elements is aspheric and has at least one inflection point.

Abstract: A fastening structure includes a body section and a fastener. The body section is movably combined with the fastener, and the body section is provided with a limiting segment or an uplift segment. The fastener is provided with a corresponding section. The limiting segment is used to make the corresponding section located at a limiting position, or the uplift segment is used to make the corresponding section located at a lifting position.

Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.

Abstract: A structure and method for retaining fastening element solder are introduced. The structure includes a fastening element which has a solderable surface and a fastening portion or a hole portion. One end of the hole portion or the fastening portion has a retaining portion. During a soldering heating process, solder flows into or enters the retaining portion to cool down and solidify. The solidified solder is retained in the retaining portion. The fastening element is firmly coupled to a first object because of coordination between the solderable surface and the retaining portion, and the second object is coupled to or removed from the fastening element because of coordination between the fastening portion and the hole portion, so as to couple together and separate the first and second objects repeatedly and quickly.

Abstract: A fastener structure includes a fastener having a stem portion and at least one movement portion. The stem portion has a fastening section. The movement portion is formed on the stem portion and has a retaining section. With these arrangements, the retaining section of the movement portion can be detachably assembled to a first object and the fastening section can be then detachably assembled or fastened to a second object. In this way, at least two objects can be connected to and disconnected from one another in a quick and repeatable manner.

Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.

Abstract: A device structure according to the present disclosure may include a first die having a first substrate and a first interconnect structure, a second die having a second substrate and a second interconnect structure, and a third die having a third interconnect structure and a third substrate. The first interconnect structure is bonded to the second substrate via a first plurality of bonding layers. The second interconnect structure is bonded to the third interconnect structure via a second plurality of bonding layers. The third substrate includes a plurality of photodiodes and a first transistor. The second die includes a second transistor having a source connected to a drain of the first transistor, a third transistor having a gate connected to drain of the first transistor and the source of the second transistor, and a fourth transistor having a drain connected to the source of the third transistor.

Abstract: A fastening body and an application method thereof include a locking part, an elastic element and a blocking section. The blocking section is movably disposed at the locking part. The elastic element is disposed between the locking part and the blocking section, and the blocking section cooperates with the elastic element to apply an elastic pressure to an engaged object. Accordingly, the fastening body and the application method thereof can provide the required object and the engaged object to achieve a stable combination and have the effect of being shockproof.

Abstract: A pull handle structure includes a carrier mounted on a first object, a pull handle movably assembled to the carrier, and a limiting section located on the pull handle for connecting to, interfering with or engaging with a second object. By operating the pull handle to move the carrier, the first object can be engaged with or separated from the second object. Therefore, the pull handle structure has the advantages of being securely lockable in place and operable in an easy, convenient, effortless and quick manner.

Abstract: A stacked wiring structure includes a first wiring substrate and a second wiring substrate. The first wiring substrate includes a first glass substrate, multiple first conductive through vias penetrating through the first glass substrate, and a first multi-layered redistribution wiring structure disposed on the first glass substrate. The second wiring substrate includes a second glass substrate, multiple second conductive through vias penetrating through the second glass substrate, and a second multi-layered redistribution wiring structure disposed on the second glass substrate. The first conductive through vias are electrically connected to the second conductive through vias. The first glass substrate is spaced apart from the second glass substrate. The first multi-layered redistribution wiring structure is spaced apart from the second multi-layered redistribution wiring structure by the first glass substrate and the second glass substrate.

Abstract: A handle with an engaging portion is introduced. The handle includes a body portion and a second engaging portion. The second engaging portion is disposed at one end of the body portion. The second engaging portion has a neck portion adapted to be inserted into, fitted to or snap-engaged with an object. Thus, the handle is mounted on the object in order to be in use and dismounted from the object when not in use. Therefore, the handle is not only easy to operate and use but is also not susceptible to collisions.

Abstract: A handle with an engaging portion is introduced. The handle includes a body portion and a second engaging portion. The second engaging portion is disposed at one end of the body portion. The second engaging portion has a neck portion adapted to be inserted into, fitted to or snap-engaged with an object. Thus, the handle is mounted on the object in order to be in use and dismounted from the object when not in use. Therefore, the handle is not only easy to operate and use but is also not susceptible to collisions.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor including first chip and a second chip. The first chip includes a first substrate, a plurality of photodetectors disposed in the first substrate, a first interconnect structure disposed on a front side of the first substrate, and a first bond structure disposed on the first interconnect structure. The second chip underlies the first chip. The second chip includes a second substrate, a plurality of semiconductor devices disposed on the second substrate, a second interconnect structure disposed on a front side of the second substrate, and a second bond structure disposed on the second interconnect structure. A first bonding interface is disposed between the second bond structure and the first bond structure. The second interconnect structure is electrically coupled to the first interconnect structure by way of the first and second bond structures.

Abstract: Various embodiments of the present disclosure are directed towards a stacked complementary metal-oxide semiconductor (CMOS) image sensor in which a pixel sensor spans multiple integrated circuit (IC) chips and is devoid of a shallow trench isolation (STI) structure at a photodetector of the pixel sensor. The photodetector and a first transistor form a first portion of the pixel sensor at a first IC chip. A plurality of second transistors forms a second portion of the pixel sensor at a second IC chip. By omitting the STI structure at the photodetector, a doped well surrounding and demarcating the pixel sensor may have a lesser width than it would otherwise have. Hence, the doped well may consume less area of the photodetector. This, in turn, allows enhanced scaling down of the pixel sensor.

Abstract: A boron (B) layer may be formed as a passivation layer in a recess in which a vertical transfer gate is to be formed. The recess may then be filled with a gate electrode of the vertical transfer gate over the passivation layer (and/or one or more intervening layers) to form the vertical transfer gate. The passivation layer may be formed in the recess by epitaxial growth. The use of epitaxy to grow the passivation layer enables precise control over the profile, uniformity, and boron concentration in the passivation layer. Moreover, the use of epitaxy to grow the passivation layer may reduce the diffusion length of the passivation layer into the substrate of the pixel sensor, which provides increased area in the pixel sensor for the photodiode.

Abstract: A photographing optical lens assembly includes seven lens elements, which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The first lens element has negative refractive power. The third lens element with positive refractive power has an image-side surface being convex in a paraxial region thereof. The fifth lens element has an object-side surface being concave in a paraxial region thereof. The sixth lens element has an object-side surface being convex in a paraxial region thereof. The seventh lens element has an image-side surface being concave in a paraxial region thereof and having at least one convex critical point in an off-axis region thereof.