Abstract: A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

Abstract: A fastening device includes at least one base portion and at least one fastener portion. The base portion is connected to a first object and the fastener portion is slidably assembled to the base portion. The fastener portion cooperates with the base portion to provide a locking and an unlocking function for connecting or disconnecting a second object to or from the base portion. With these arrangements, two objects can be repeatedly and quickly connected to or disconnected from each other.

Abstract: A quick release connecting device includes an actuating retainer and a fixing member movably assembled to the actuating retainer. The fixing member includes a pivot portion and a pivot member movably mounted to the pivot portion; and the pivot member is coupled with a second object. The fixing member includes a limiting section and the pivot member includes a corresponding limiting section, such that the limiting section and the corresponding limiting section limit or stop each other at a specific location when the fixing member is moved or rotated. With these arrangements, the quick release connecting device can be applied to conveniently and repeatedly connect and separate a circuit board, a drawer, or a window to and from a corresponding rack, chassis, cabinet or window frame.

Abstract: A buoyant fastener structure includes a body portion and a fastening element. The body portion has a rotation-preventing portion and a position-limiting portion. The fastening element has a position-corresponding rotation-preventing portion, a position-corresponding position-limiting portion and a fastening portion. The rotation-preventing portion and the position-corresponding rotation-preventing portion prevent each other from rotating. A rotation-preventing buoyancy level exists between the rotation-preventing portion and the position-corresponding rotation-preventing portion. The position-limiting portion corresponds in position to and limits the position of the position-corresponding position-limiting portion. Therefore, the body portion is coupled to a first object, whereas the fastening portion is coupled to or removed from a second object, so as for the first and second objects to be coupled together and separated, repeatedly and quickly.

Abstract: An imaging lens assembly includes seven lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. Each of the seven lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The second lens element has positive refractive power. The sixth lens element has positive refractive power, and the image-side surface of the sixth lens element is convex in a paraxial region thereof. The seventh lens element has negative refractive power. At least one of the object-side surface and the image-side surface of at least one lens element of the imaging lens assembly is aspheric and has at least one inflection point.

Abstract: An electrically driven fastener structure includes a body, a fastening unit and a wire. The body has a first assembly portion. The fastening unit has a second assembly portion corresponding to the first assembly portion. The wire is adapted to pass a current and to pass through the first assembly portion or the second portion to form a magnetic switch using the first assembly portion or the second assembly portion, so as to drive the magnetic switch based on on or off or strong or weak of the current, or to drive the magnetic switch based on on or off or strong or weak of a magnetic force.

Abstract: A fastener structure includes a body portion and a fastening body. The body portion has a solderable layer, and the solderable layer is soldered to a plate body. The fastening body combines movably with the body portion. The fastening body has a head and a fastening portion. The body portion or the fastening body, or both the body portion and the fastening body is provided on the plate body for soldering after it is picked up by a tool so that the body portion can combine with the plate body. Also, the body portion or the fastening body, or both the body portion and the fastening body combines with a assisting pickup unit, and the fastener structure is provided on the plate body for soldering after it is picked up by a tool through the assisting pickup unit so that the body portion can combine with the plate body.

Abstract: A positioning device includes a body. The body is adapted to be disposed on a first object. The first positioning member is movably connected to the body or a second positioning member. The second positioning member is movably connected to the body or the first positioning member, and the first positioning member is located between the second positioning member and the first object. The present disclosure further provides a method of use of a positioning device.

Abstract: A photographing optical lens assembly includes seven lens elements, which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The first lens element has negative refractive power. The third lens element with positive refractive power has an image-side surface being convex in a paraxial region thereof. The fifth lens element has an object-side surface being concave in a paraxial region thereof. The sixth lens element has an object-side surface being convex in a paraxial region thereof. The seventh lens element has an image-side surface being concave in a paraxial region thereof and having at least one convex critical point in an off-axis region thereof.

Abstract: In some embodiments, the present disclosure relates to an image sensor. The image sensor comprises a substrate. A photodetector is in the substrate and includes a semiconductor guard ring extending into a first side of the substrate. A shallow trench isolation (STI) structure extends into the first side of the substrate. An outer isolation structure extends into a second side of the substrate, opposite the first side of the substrate, to the STI structure. The STI structure and the outer isolation structure laterally surround the photodetector. An inner isolation structure extends into the second side of the substrate and overlies the photodetector. The inner isolation structure is vertically separated from the photodetector by the substrate. Further, the outer isolation structure laterally surrounds the inner isolation structure.

Abstract: A method of assembling a fastener structure on a plate body is introduced. The fastener structure includes a body portion and a fastening body. The body portion has a solderable layer, and the solderable layer is soldered to a plate body. The fastening body combines movably with the body portion. The fastening body has a head and a fastening portion. The body portion or the fastening body is provided on the plate body for soldering after it is picked up by a tool so that the body portion can combine with the plate body. Also, the body portion or the fastening body combines with an assisting pickup unit, and the fastener structure is provided on the plate body for soldering after it is picked up by a tool through the assisting pickup unit so that the body portion can combine with the plate body.

Abstract: A polarizer substrate includes a substrate, a reflective layer, and a metal pattern layer. The reflective layer is located on the substrate and has a transmission area and a reflective area. The metal pattern layer is located on the reflective layer and the substrate. The metal pattern layer includes a polarizer structure and a microstructure. The polarizer structure includes a plurality of grid lines overlapping the transmission area. A thickness of each of the grid lines is 200 nm to 500 nm, a width of each of the grid lines is 30 nm to 70 nm, and a distance between each adjacent two of the grid lines is 30 nm to 70 nm. The microstructure overlaps the reflective area, and a thickness of the microstructure is 20 nm to 500 nm.

Abstract: The present disclosure describes a semiconductor device that includes a first die bonded to a second die with interconnect structures in the first die. The first die includes a photodiode having first and second electrodes on a first side of a first dielectric layer, and first, second, and third interconnect structures in the first dielectric layer. The first and second interconnect structures are connected to the first and second electrodes, respectively. The second electrode has a polarity opposite to the first electrode. The second and third interconnect structures extend to a second side opposite to the first side of the first dielectric layer. The second die includes a second dielectric layer and a fourth interconnect structure in the second dielectric layer. The second dielectric layer is bonded to the second side of the first dielectric layer. The fourth interconnect structure connects the second and third interconnect structures.

Abstract: A method of assembling a fastener structure on a plate body is introduced. The fastener structure includes a body portion and a fastening body. The body portion has a solderable layer, and the solderable layer is soldered to a plate body. The fastening body combines movably with the body portion. The fastening body has a head and a fastening portion. The body portion or the fastening body is provided on the plate body for soldering after it is picked up by a tool so that the body portion can combine with the plate body. Also, the body portion or the fastening body combines with an assisting pickup unit, and the fastener structure is provided on the plate body for soldering after it is picked up by a tool through the assisting pickup unit so that the body portion can combine with the plate body.

Abstract: A structure and method for retaining fastening element solder are introduced. The structure includes a fastening element which has a solderable surface and a fastening portion or a hole portion. One end of the hole portion or the fastening portion has a retaining portion. During a soldering heating process, solder flows into or enters the retaining portion to cool down and solidify. The solidified solder is retained in the retaining portion. The fastening element is firmly coupled to a first object because of coordination between the solderable surface and the retaining portion, and the second object is coupled to or removed from the fastening element because of coordination between the fastening portion and the hole portion, so as to couple together and separate the first and second objects repeatedly and quickly.

Abstract: A rolling structure and a method of mounting the same on an object are introduced. The rolling structure includes a body portion, a first rolling member and at least one second rolling member. The body portion is disposed at an object. The first rolling member is movably disposed at the body portion and adapted to roll in the first direction. The second rolling member is movably disposed at the body portion and adapted to roll in the second direction. Therefore, the rolling structure is structurally simple, easy to use, and mechanically strong so as to cut cost.

Abstract: A fastener structure and an assembly method thereof are introduced. The fastener structure includes a body and a fastener. The body has a limiting structure and is for assembling at a first object. The fastener and the body are movably assembled. The fastener has a limiting portion, which coordinates with the limiting structure to limit a movement stroke of the fastener, so as to engage or disengage the fastener with or from a second object. Thus, the body can be assembled with the first object and the fastener can be engaged with or disengaged from the second object so as to complete quick coupling and separation of two objects, further achieving effects of repeated quick coupling and separation.

Abstract: A coating system applied for coating a target coating area with a coating material is disclosed. The coating system includes a carrier device, a coating structure and a control device. The coating structure is movably arranged on the carrier device. The control device controls the coating structure and has information corresponding to the target coating area, and the control device drives the coating structure according to the information to coat the target coating area with the coating material. The present invention further provides a method of use of a coating system.

Abstract: A fastener structure includes a body portion and a fastening body. The body portion has a solderable layer, and the solderable layer is soldered to a plate body. The fastening body combines movably with the body portion. The fastening body has a head and a fastening portion. The body portion or the fastening body, or both the body portion and the fastening body is provided on the plate body for soldering after it is picked up by a tool so that the body portion can combine with the plate body. Also, the body portion or the fastening body, or both the body portion and the fastening body combines with a assisting pickup unit, and the fastener structure is provided on the plate body for soldering after it is picked up by a tool through the assisting pickup unit so that the body portion can combine with the plate body.

Abstract: An active device substrate including a substrate, first metal grid wires, a first transparent conductive layer, a gate insulating layer, a semiconductor layer, a source, and a drain is provided. The first metal grid wires are located on the substrate. The first transparent conductive layer includes a scan line and a gate connected to the scan line. The scan line and/or the gate is directly connected to at least a part of the first metal grid wires. The gate insulating layer is located on the first transparent conductive layer. The semiconductor layer is located on the gate insulating layer and overlapped with the gate. The source and the drain are electrically connected to the semiconductor layer.