Patents by Inventor Jun Chung

Jun Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160172261
    Abstract: A bottom package for a PoP (package-on-package) may be formed with a reinforcement layer supporting a thin or coreless substrate. The reinforcement layer may provide stiffness and rigidity to the substrate to increase the stiffness and rigidity of the bottom package and provide better handling of the substrate. The reinforcement layer may be formed using core material, a laminate layer, and a metal layer. The substrate may be formed on the reinforcement layer. The reinforcement layer may include an opening sized to accommodate a die. The die may be coupled to an exposed surface of the substrate in the opening. Metal filled vias through the reinforcement layer may be used to couple the substrate to a top package.
    Type: Application
    Filed: February 22, 2016
    Publication date: June 16, 2016
    Inventors: Jun Chung Hsu, Jun Zhai
  • Publication number: 20160147386
    Abstract: An image scanning apparatus includes a storage configured to store an image file, a user interface unit configured to receive selection of the image file stored in the storage and to display a thumbnail image corresponding to each of a plurality of pages contained in the selected image file, and a controller, in response to any one of the displayed thumbnail image being selected for a predetermined time period or more, to perform at least one of order change, delete, and partition of a page corresponding to the thumbnail image selected for the predetermined time period or more to edit the selected image file.
    Type: Application
    Filed: November 19, 2015
    Publication date: May 26, 2016
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dong-hyeop HAN, Hyung-soo OHK, Elena lgorevna PATANA, In-ho PARK, Ho-keun LEE, Kyeong-man KIM, Hyun-soo OH, Chang-hyung LEE, Eul-hwan LEE, Woo-jun CHUNG
  • Patent number: 9351409
    Abstract: A method of manufacturing a thin support package structure includes the steps of: preparing a support plate formed with a plurality of grooves adjacent to an outer rim thereof, forming a releasing material layer on the support plate; forming a first circuit layer on the releasing material layer so as to form a thin circuit board; forming a dielectric layer on the releasing material layer; forming a plurality of openings in the dielectric layer; forming a second circuit layer on the dielectric layer; forming connection plugs by filling the openings; forming a solder mask on the dielectric layer; forming a plurality of notches on the lower surface of the support plate to communicate with the grooves, respectively; and removing the central part of the support plate between the notches and the central part of the releasing material layer on the support plate.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: May 24, 2016
    Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Hsueh-Ping Chien, Jun-Chung Hsu
  • Patent number: 9305853
    Abstract: A bottom package for a PoP (package-on-package) may be formed with a reinforcement layer supporting a thin or coreless substrate. The reinforcement layer may provide stiffness and rigidity to the substrate to increase the stiffness and rigidity of the bottom package and provide better handling of the substrate. The reinforcement layer may be formed using core material, a laminate layer, and a metal layer. The substrate may be formed on the reinforcement layer. The reinforcement layer may include an opening sized to accommodate a die. The die may be coupled to an exposed surface of the substrate in the opening. Metal filled vias through the reinforcement layer may be used to couple the substrate to a top package.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: April 5, 2016
    Assignee: Apple Inc.
    Inventors: Jun Chung Hsu, Jun Zhai
  • Patent number: 9296987
    Abstract: The present invention relates to multi-coated lactic acid bacteria coated with a multi-coating layer forming bacterial clusters and including protein, polysaccharide, and edible oil/fat component, and a preparing method thereof. The multi-coated lactic acid bacteria according to the present invention may achieve an improved acid resistance, a bile resistance, and an accelerated test stability, may have a low moisture content to be particularly stable against a moisture variation, and thus may be appropriately used to prepare various products including lactic acid bacteria.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: March 29, 2016
    Assignee: Cell Biotech Co., Ltd.
    Inventor: Myung Jun Chung
  • Publication number: 20160071807
    Abstract: A methodology for addressing package warpage is described. In an embodiment a package includes a die mounted on a wiring board. Portion of a metal plane within the wiring board includes a reduced portion, characterized by a reduced thickness that is less than a baseline thickness.
    Type: Application
    Filed: October 20, 2014
    Publication date: March 10, 2016
    Inventors: Jun Chung Hsu, Jie-Hua Zhao
  • Publication number: 20160033419
    Abstract: The following description relates to a composite for a harmful material-detecting sensor, which includes a dye having a color-change function by reaction with acid or base and a polymer material, a method for producing the composite for the harmful material-detecting sensor, and a low-cost film-type color change harmful material sensor, which includes the composite for the harmful material-detecting sensor so as to quickly detect a harmful material and can be carried by an individual.
    Type: Application
    Filed: July 31, 2015
    Publication date: February 4, 2016
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Jeong Ho AN, Dong Jun CHUNG
  • Patent number: 9163210
    Abstract: The present disclosure relates to production of double-coated lactic acid bacteria using peptides and polysaccharide. Double-coated lactic acid bacteria show improved heat-resistance, acid-resistance, bile-resistance, storage stability and excellent survival rate when reaching intestine.
    Type: Grant
    Filed: February 12, 2015
    Date of Patent: October 20, 2015
    Inventor: Myung-Jun Chung
  • Publication number: 20150271915
    Abstract: An enhanced chip board package structure includes a chip board and a plurality of enhanced structures, which are formed in the blind openings of the non-effective region of the chip board. Each enhanced structure has an opening. The mechanical strength is reinforced by the enhanced structures without changing the whole thickness so as to overcome the problem of warping. Meanwhile, the three-dimensional stability is thus enhanced. The opening of the enhanced structure can be selectively filled with the filler such that the mechanical strength is further reinforced and the thermally conductive effect is greatly improved.
    Type: Application
    Filed: March 24, 2014
    Publication date: September 24, 2015
    Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Jun-Chung Hsu, Bo-Yu Tseng, Yu-Hsiang Sun
  • Publication number: 20150230342
    Abstract: In some embodiments, a carrier substrate for an integrated circuit may include a core, a first plurality of openings, and a first insulating material. The core may include a first surface and a second surface substantially opposing the first surface. The first plurality of openings may extend from the first surface to the second surface of the core. In some embodiments, the first insulating material may be applied to a surface of the first plurality of openings. In some embodiments, the first plurality of openings may include a first conductor extending through each of the first plurality of openings from the first surface to the second surface. In some embodiments, at least a first subset of the first plurality of openings may include a first charge and at least a second subset of the first plurality of openings may include a second charge. The first charge and the second charge may be different.
    Type: Application
    Filed: April 3, 2014
    Publication date: August 13, 2015
    Applicant: Apple Inc.
    Inventors: Jun Chung Hsu, Jun Zhai
  • Patent number: 9098792
    Abstract: A print controlling apparatus includes a storage to store a plurality of color feature information, an acquirer to acquire color feature information of a second image forming apparatus, a moderator to moderate color converting table of a first image forming apparatus by using the acquired color feature information and the plurality of color feature information stored in the storage, and a controller to perform printing jobs regarding the first image forming apparatus by using the moderated color converting table.
    Type: Grant
    Filed: December 9, 2013
    Date of Patent: August 4, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-min Shin, Nam-ju Shin, Hyun-soo Oh, Woo-jun Chung, Kyeong-man Kim, Eun-ah Song
  • Publication number: 20150187494
    Abstract: Disclosed is a method of producing a rare earth permanent magnet, comprising: obtaining a NdFeB sintered magnet; applying a mixed powder including a Zn-containing metal and a metal compound containing Tb or Dy onto a surface of the sintered magnet; and heat-treating the sintered magnet having the mixed powder applied on its surface.
    Type: Application
    Filed: October 14, 2014
    Publication date: July 2, 2015
    Inventors: Jae Ryung Lee, Kun Min Park, Yen Jun Chung
  • Publication number: 20150152378
    Abstract: The present disclosure relates to production of double-coated lactic acid bacteria using peptides and polysaccharide. Double-coated lactic acid bacteria show improved heat-resistance, acid-resistance, bile-resistance, storage stability and excellent survival rate when reaching intestine.
    Type: Application
    Filed: February 12, 2015
    Publication date: June 4, 2015
    Inventor: Myung-Jun Chung
  • Publication number: 20150140262
    Abstract: An insulation layer structure includes an insulation layer, at least one glass fiber embedded in the insulation layer and at least one opening penetrating through the insulation layer and cutting off the glass fiber. The glass fiber projects from a sidewall of the opening such that the ratio of the length of the glass fiber projecting from the sidewall to the width of the opening is 0.2˜33%. With the glass fiber projecting from the sidewall of the opening, the sidewall of the opening has large surface roughness and the surface area to contact with the electrolyte. As a result, the crystal growth rate for the electrolyte onto the sidewall is accelerated. Therefore, the adhesion between the electroplating layer and the sidewall of the opening is increased, thereby improving the reliability and the yield rate of the product.
    Type: Application
    Filed: November 20, 2013
    Publication date: May 21, 2015
    Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Yu-Hsiang SUN, Jun-Chung HSU
  • Publication number: 20150111247
    Abstract: The present disclosure relates to production of double-coated lactic acid bacteria using peptides and polysaccharide. Double-coated lactic acid bacteria show improved heat-resistance, acid-resistance, bile-resistance, storage stability and excellent survival rate when reaching intestine.
    Type: Application
    Filed: October 2, 2014
    Publication date: April 23, 2015
    Inventor: Myung-Jun Chung
  • Patent number: 9001380
    Abstract: A present color compensating method includes receiving selection of an input ICC profile and an output ICC profile, receiving selection of a plurality of color rendering intents to be applied to an ICC profile, generating a color conversion table using the selected input ICC profile, the selected output profile, and the selected plurality of color rendering intents, and generating print data using the generated color conversion table.
    Type: Grant
    Filed: January 26, 2011
    Date of Patent: April 7, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-soo Oh, Kyeong-man Kim, Woo-jun Chung
  • Publication number: 20150061142
    Abstract: A bottom package for a PoP (package-on-package) may be formed with a reinforcement layer supporting a thin or coreless substrate. The reinforcement layer may provide stiffness and rigidity to the substrate to increase the stiffness and rigidity of the bottom package and provide better handling of the substrate. The reinforcement layer may be formed using core material, a laminate layer, and a metal layer. The substrate may be formed on the reinforcement layer. The reinforcement layer may include an opening sized to accommodate a die. The die may be coupled to an exposed surface of the substrate in the opening. Metal filled vias through the reinforcement layer may be used to couple the substrate to a top package.
    Type: Application
    Filed: November 25, 2013
    Publication date: March 5, 2015
    Applicant: Apple Inc.
    Inventors: Jun Chung Hsu, Jun Zhai
  • Publication number: 20150048322
    Abstract: OLED display that includes: a substrate; a plurality of thin film transistors formed on the substrate; a plurality of first electrodes respectively connected to the thin film transistors; a pixel definition layer formed on the substrate and having a first opening, a second opening, and a third opening respectively exposing first, second, and third first electrodes of the plurality of first electrodes; an emission layer formed at the first opening, the second opening, and the third opening; and a second electrode formed on the emission layer, wherein the first opening has a first pair of boundary lines facing each other and a second pair of boundary lines facing each other, and the first pair of boundary lines overlap boundary lines of a pair of boundary lines of the first first electrode or are positioned outside the boundary lines of the pair of boundary lines of the first first electrode.
    Type: Application
    Filed: April 21, 2014
    Publication date: February 19, 2015
    Applicant: SAMSUNG DISPLAY CO., LTD.
    Inventors: Dong-Yoon So, Ji-Eun Kim, Han-Soo Kim, Young-Jun Chung
  • Patent number: D733371
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: June 30, 2015
    Assignee: LG ELECTRONICS INC.
    Inventors: Wook Jun Chung, Yoon Sang Kim, Kyung Ah Lee, Jong Hee Han
  • Patent number: D756181
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: May 17, 2016
    Inventor: Jun Chung Lee