Abstract: A method of manufacturing a thin support package structure includes the steps of: preparing a support plate formed with a plurality of grooves adjacent to an outer rim thereof, forming a releasing material layer on the support plate; forming a first circuit layer on the releasing material layer so as to form a thin circuit board; forming a dielectric layer on the releasing material layer; forming a plurality of openings in the dielectric layer; forming a second circuit layer on the dielectric layer; forming connection plugs by filling the openings; forming a solder mask on the dielectric layer; forming a plurality of notches on the lower surface of the support plate to communicate with the grooves, respectively; and removing the central part of the support plate between the notches and the central part of the releasing material on the support plate.

Abstract: A thin package structure with enhanced strength includes a support carrier plate and a thin circuit board. The thin circuit board is formed on the support carrier plate and includes a first circuit layer, a dielectric layer and a second circuit layer. The first circuit layer includes the first circuit patterns and the first connection pads. The dielectric layer covers the first circuit layer. The second circuit layer is formed on or embedded in an upper surface of the dielectric layer and includes the second circuit patterns and the second connection pads. Connection plugs are formed in the dielectric layer to connect the first and second connection pads. The support carrier plate provides mechanical strength to avoid warping or deforming. It is feasible to direct test the package structure without disassembling so as to improve the convenience in testing.

Abstract: A chip board package structure includes a circuit board part, a chip board part and a solder used to solder the circuit board part and the chip board part. A chip on the chip board part is connected to an electrical circuit by wiring or soldering. A surface treatment metal layer includes at least nickel, palladium and gold formed on part of the surface of the circuit layer on the chip board. A copper-tin intermetallic compound is formed on joints of the second solder and the surface treatment metal layer, and the other part of the circuit layer is directly connected to the solder to form the copper-tin intermetallic compound. In addition to the lower package cost, with the shape feature of the copper-tin intermetallic compound, it is possible to increase the contact area with the solder, thereby improving the reliability of the soldering process and the yield.

Abstract: A host apparatus connectable to an image forming apparatus and a method are provided. The host apparatus includes a storage configured to store a portable document format (PDF) file, an object extractor configured to extract at least one object that requires color conversion from among objects included in the stored PDF file, a color conversion processor configured to perform color conversion process for each of the extracted objects by using a color conversion function corresponding to each of the extracted objects, and a communication interface configured to transmit the PDF file where the color conversion process is performed to the image forming apparatus.

Abstract: A circuit board structure for high frequency signals includes a substrate and an electrical conductive circuit layer formed on the substrate. The conductive circuit layer includes circuit patterns and connection pads. The circuit pattern includes a base part with a shape of a rectangular block and a circular top part with a hemispherical shape provided on the base part. The circular top part can be modified by a circular bottom part embedded in the dielectric plastic film. Alternatively, a double layer structure with the circular top and bottom parts is formed such that the surface of the circuit pattern is provided with hemispheres to strengthen the reflection, thereby overcoming the problem of signal concentration due to the rectangular structure or the issue of signal attenuation due to surface roughness.

Abstract: Disclosed is a method of final defect inspection, including preparing a final defect inspection apparatus which includes a host device, a microscope, a bar code scanner, a support tool and a signal transceiver, using the host device to calibrate an original point in an outline of the circuit board based on a plurality of original mark positions generated by an electromagnetic pen, using the electromagnetic pen to mark each defect position on the inspection region on the circuit board where any defect is found through the microscope, using the signal transceiver to receive and transmit each defect position to the host device, and using the host device to calculate the coordinate of a scrap region based on a relative position between the original point and each defect position so as to generate a shipment file.

Abstract: Provided are a display system and a method of outputting an image signal corresponding to a display panel. The display system includes an image processor converting original video data input from a video signal converting unit into converted video data corresponding to a recognized output standard and outputting the converted video data; and a display unit including a memory storing characteristic information and serving to display the converted video data as visual information. Here, the image processor reads out the characteristic information from the memory to recognize the output standard. Accordingly, it is possible to adaptively cope with the case where only the display panel is replaced for the purpose of improvement in resolution, etc.

Abstract: Disclosed is a method of final defect inspection, including preparing a final defect inspection apparatus which includes a host device, a microscope, a bar code scanner, a support tool and a signal transceiver, using the host device to calibrate an original point in an outline of the circuit board based on a plurality of original mark positions generated by an electromagnetic pen, using the electromagnetic pen to mark each defect position on the inspection region on the circuit board where any defect is found through the microscope, using the signal transceiver to receive and transmit each defect position to the host device, and using the host device to calculate the coordinate of a scrap region based on a relative position between the original point and each defect position so as to generate a shipment file.

Abstract: A print controlling apparatus includes a storage to store a plurality of color feature information, an acquirer to acquire color feature information of a second image forming apparatus, a moderator to moderate color converting table of a first image forming apparatus by using the acquired color feature information and the plurality of color feature information stored in the storage, and a controller to perform printing jobs regarding the first image forming apparatus by using the moderated color converting table.

Abstract: A laminate circuit board with a multi-layer circuit structure which includes a substrate, a first circuit metal layer, a second circuit metal layer, a first nanometer plating layer, a second nanometer plating layer and a cover layer is disclosed. The first circuit metal layer is embedded in the substrate or formed on at least one surface of the substrate which is smooth. The first nanometer plating layer with a smooth surface covers the first circuit metal layer. The second nanometer plating layer is formed on the other surface of the substrate and fills up the opening in the cover layer to electrically connect the first circuit metal layer. The junction adhesion is improved by the chemical bonding between the nanometer plating layer and the cover layer/the substrate. Therefore, the circuit metal layer does not need to be roughened and the density of the circuit increases.

Abstract: An image forming apparatus and an image quality calibration method in the image forming apparatus, the image forming apparatus including a printing unit to print a calibration chart in one mode selected from a plurality of resolution modes, a scanning unit to scan the printed calibration chart, and a calibrating unit to calibrate an image using color values of the scanned calibration chart according to the plurality of resolution modes.

Abstract: A laminate circuit board structure from button up including a substrate, a circuit metal layer, a nanometer plating layer and a cover layer is disclosed. The nanometer plating layer is smooth a thickness of 5-40 nm, and can be directly forming on the outer surface of the circuit metal layer or manufactured by firstly forming the nanometer plating layer on a preforming substrate, then pressing the substrate against the nanometer plating layer, and finally removing the preforming substrate. The junction adhesion between the nanometer plating layer and the cover layer or the substrate is improved by chemical bonding. Therefore it does not need to roughen the circuit metal layer or reserve circuit width for compensation such that the density of the circuit increases and much more dense circuit can be implemented in the substrate with the same area.

Abstract: A method of manufacturing a laminate circuit board is disclosed. The method includes forming a metal layer on a substrate, patterning the metal layer to form a circuit metal layer, forming a nanometer plating layer with a thickness of 5 to 40 nm over the circuit metal layer, and forming a cover layer covering the substrate and the nanometer plating layer with improved adhesion by chemical bonding to form the laminate circuit board. Another method includes forming the circuit metal layer and the nanometer plating layer on a preforming substrate, pressing the preforming substrate against a substrate to push the circuit metal layer and the nanometer plating layer into the substrate, and removing the preforming substrate. By the present invention, the density of circuit is increased and much denser circuit can be implemented on the substrate with the same area.

Abstract: Disclosed is a final defect inspection system, which including a host device, a microscope, a bar code scanner, a support tool, a signal transceiver and an electromagnetic pen. The bar code scanner scans a bar code on a circuit board provided on the support plate. The host device selects data and a circuit layout diagram from the database corresponding to the bar code. The signal transceiver and the electromagnetic pen are electrically connected to the host device. The electromagnetic pen is used to make a mark on a scrap region of the circuit board where any defect is visually found through the microscope. The signal transceiver receives and transmits the positions of the mark to the host device such that the host device calculates the coordinate of a scrap region based on a relative position between an original point and the positions of the mark.

Abstract: A drive tool device includes a drive handle having two end portions, and a fitting pivotally attached to one of the end portions of the drive handle with a pivot shaft for allowing the fitting to be pivoted and rotated relative to the drive handle, the fitting includes two drives for selectively and changeably aligning with the longitudinal axis (L) of the drive handle, the drives of the fitting are perpendicular to each other, and include different dimensions for allowing the user to easily conduct various fastener actuating or driving operations. The drive handle includes a spring-biased projection for engaging with the fitting and for positioning the fitting to the drive handle at selected positions.

Abstract: A color correction method includes displaying an expected print image of a test image of the image forming apparatus on a monitor, outputting the test image to the image forming apparatus, performing color matching between the output test image and an expected print image on the monitor, changing an ICC profile of the monitor according to the performed color matching, and generating a print data using the changed ICC profile. Also a print controlling terminal which performs the color correction method.

Abstract: A solder pad structure with a high bondability to a solder ball is provided. The present invention provides a larger contact area with the solder ball so as to increase the bondability according to the principle that the bondability is positive proportional with the contact area therebetween. The solder pad structure includes a circuit board having a solder pad opening defined by a solder resist layer surrounding a circuit layer. The circuit layer within the solder pad opening is defined as a solder pad. In such a way, after filling the solder ball into the solder pad opening, besides walls of the solder pad opening, there is an extra contact area provided by a geometric shape of the solder pad for further improving the bondability of the solder pad and the solder ball.

Abstract: The present invention relates to multi-coated lactic acid bacteria coated with a multi-coating layer forming bacterial clusters and including protein, polysaccharide, and edible oil/fat component, and a preparing method thereof. The multi-coated lactic acid bacteria according to the present invention may achieve an improved acid resistance, a bile resistance, and an accelerated test stability, may have a low moisture content to be particularly stable against a moisture variation, and thus may be appropriately used to prepare various products including lactic acid bacteria.

Abstract: An image processing method and an image processing apparatus converts a binary image into a grayscale image by increasing the size and information quantity of the binary image. The image processing method includes generating a plurality of lookup tables having multiple gray level values assigned to a predetermined pattern of the binary image such that the gray level is retrieved from the plurality of lookup tables depending on the context of the block being processed. The binary image may be converted into the grayscale image by applying the gray value of one of the plurality of lookup tables that corresponds to the context, such as the frequency components of the binary image. With this configuration, since the size and information quantity of an image can be reduced for transmission, it is possible to prevent deterioration of image quality when the image is restored, while also printing at a higher speed.