Abstract: There is provided a bump structure for a semiconductor device, comprising a metal post formed on and electrically connected to an electrode pad on a substrate, a solder post formed on the top surface of the metal post, said solder post having the same horizontal width as the metal post and the top surface of the solder post being substantially rounded, and an intermetallic compound layer disposed at the interface between the metal post and the solder post. An oxide layer formed on the solder post prevents solder post under reflow from being changed into a spherical shape. An intermetallic compound layer may be formed by an aging process at the interface between the metal post and the solder post. The bump structure can realize fine pitch semiconductor package without a short between neighboring bumps.

Abstract: There is provided a bump structure for a semiconductor device, comprising a metal post formed on and electrically connected to an electrode pad on a substrate, a solder post formed on the top surface of the metal post, said solder post having the same horizontal width as the metal post and the top surface of the solder post being substantially rounded, and an intermetallic compound layer disposed at the interface between the metal post and the solder post. An oxide layer formed on the solder post prevents solder post under reflow from being changed into a spherical shape. An intermetallic compound layer may be formed by an aging process at the interface between the metal post and the solder post. The bump structure can realize fine pitch semiconductor package without a short between neighboring bumps.

Abstract: Provided is a back light unit. The back light unit includes a light guide plate having a light guide pattern part; at least one light emitting unit provided at a sidewall of the light guide plate, and irradiating light to the light guide plate; a keypad positioned over the light guide plate, and comprising a resin layer, a base resin layer, a character opening part having a character shape, a key assembly provided at one side, and a key adherence film provided on an upper surface of the base resin layer; and a printed circuit board comprising a metal dome switch positioned under a lower surface of the light guide plate.

Abstract: A slit coater including buffer members having elasticity and installed at both sides of a slit nozzle unit, compensating for a height difference between both sides, preventing breakdown due to excessive stress generated by the height, and reducing set-up time. The slit coater includes: a table on which an object to be processed is mounted; a slit nozzle unit formed above the table for applying coating solution onto the object; a driving unit moving the slit nozzle unit in a predetermined direction; and buffer members having elasticity installed at both sides of the slit nozzle unit.

Abstract: Provided is a back light unit. The back light unit includes a light guide plate having a light guide pattern part; at least one light emitting unit provided at a sidewall of the light guide plate, and irradiating light to the light guide plate; a keypad positioned over the light guide plate, and comprising a resin layer, a base resin layer, a character opening part having a character shape, a key assembly provided at one side, and a key adherence film provided on an upper surface of the base resin layer; and a printed circuit board comprising a metal dome switch positioned under a lower surface of the light guide plate.

Abstract: Yogurt containing encapsulated lactic acid bacteria wherein the lactic acid bacteria 1 is encapsulated within acid resistant and intestine-soluble capsules, and wherein the specific gravity of the liquid yogurt is the same or substantially the same as the specific gravity of the lactic acid bacteria containing capsules whereby the capsules are uniformly distributed in the liquid yogurt.

Abstract: A wafer cleaning apparatus includes at least one nozzle fixing tube disposed in a wall of a cleaning bath. A plurality of injection nozzles are arranged on the nozzle fixing tube for spraying a compressed cleaning solution toward the wafer. A rotating device rotates the at least one nozzle fixing tube and the plurality of injection nozzles within a predetermined angle.