Abstract: In an imaging apparatus system, a first imaging apparatus includes a first front casing, a common rear casing, a first lens mount attached to the first front casing, and a common monitor attached to the common rear casing. A second imaging apparatus includes a second front casing, a common rear casing, a second lens mount attached to the second front casing and different from the first lens mount, and a common monitor. When the first and second front casings are respectively attached to the common rear casings and, the center of the first lens mount and the center of the second lens mount are identical, regarding the relative positions in the left-right direction with respect to the common rear casings and.

Abstract: An imaging apparatus system includes a first imaging apparatus, and a second imaging apparatus. The first imaging apparatus includes a first top casing including a casing top surface, and a common rear casing including a casing rear surface. The second imaging apparatus includes a second top casing including a casing top surface, and the common rear casing. The first top casing has a shape in which a vent hole is formed in the second top casing.

Abstract: Provided are a spinel-type lithium manganese oxide excellent in terms of charge-discharge performance at high temperatures and a lithium secondary battery excellent in terms of charge-discharge performance at high temperatures. A spinel-type lithium manganese oxide comprising a phosphate, the spinel-type lithium manganese oxide being represented by chemical formula: Li1+xMn2?X?YMYO4 (where 0.02?X?0.20, 0.05?Y?0.30, and M represents Al or Mg), wherein the phosphate has an average particle size of 0.1 ?m or more and 2.0 ?m or less, and primary particles of the spinel-type lithium manganese oxide have an average size of 1.5 ?m or more and 5.0 ?m or less, a method for producing the spinel-type lithium manganese oxide, and applications of the spinel-type lithium manganese oxide.

Abstract: A non-transitory computer-readable storage medium storing an arrangement specifying program that causes at least one computer to execute a process, the process includes acquiring a shape of a container that has a first surface and a second surface orthogonal to the first surface; acquiring a shape of a plurality of articles; and specifying an arrangement position and an arrangement posture of each of the plurality of articles when the plurality of articles is arranged in the container in an arrangement order, by using a bottom left algorithm.

Abstract: A storage medium storing a work plan specifying program that causes a computer to execute a process that includes specifying a certain order under conditions that, in a work line that generates a plurality of objects in the certain order, a certain amount of a material is partially cut from a raw material for each of the plurality of objects, the cut material is processed, the raw material is switched to a next raw material when the raw material lacks, and a changeover is performed to change the settings of the cutting device and the proceeding; and optimizing an objective function that reflects the changeover and an excess amount of each raw material that are determined according to an input order of the plurality of objects to the work line.

Abstract: An information processing device includes one or more processors configured to: by executing single-objective optimization on a first objective function among a plurality of objective functions defined according to feeding orders of a plurality of objects into a work line, specify first feeding orders in which values of the first objective function are better than an initial feeding order, by executing the single-objective optimization on a second objective function, specify second feeding orders in which the values of the second objective function are better than the initial feeding order, and executing multi-objective optimization on the plurality of objective functions by using the first feeding orders and the second feeding orders.

Abstract: A method of producing a molded product, the method including: pressing a mold having a surface including at least one of a concave part or a convex part against a photocurable positive electron beam resist; obtaining a molded product of the positive electron beam resist having a surface including a concave part and a convex part by irradiating the photocurable positive electron beam resist pressed against the resist with light to cure the resist; and partially decomposing the molded product of the positive electron beam resist in a region subjected to irradiation with an electron beam by irradiating the surface of the molded product of the positive electron beam resist with the electron beam.

Abstract: A quality determination method includes: in a quality determination space, mapping a quality of a package product in which a plurality of devices are assembled in accordance with a predetermined design condition, with use of each test result of each of the plurality of devices; and determining a quality of the package product, on a basis of mapping result of the mapping.

Abstract: To provide a moth-eye transfer mold and a method of manufacturing a moth-eye transfer mold that provide a simple and inexpensive manufacturing process. A moth-eye transfer mold 1 is characterized by including a base 10, an underlayer 20 formed on the base 10, and a glassy carbon layer 30 formed on the underlayer 20, the glassy carbon layer 30 has an inverted moth-eye structure RM over a surface 30a, and the inverted moth-eye structure RM is randomly arranged cone-shaped pores.

Abstract: To provide a moth-eye transfer mold and a method of manufacturing a moth-eye transfer mold that provide a simple and inexpensive manufacturing process. A moth-eye transfer mold 1 is characterized by including a base 10, an underlayer 20 formed on the base 10, and a glassy carbon layer 30 formed on the underlayer 20, the glassy carbon layer 30 has an inverted moth-eye structure RM over a surface 30a, and the inverted moth-eye structure RM is randomly arranged cone-shaped pores.

Abstract: A method of diagnosing a pipe includes diagnosing, by a computer, a state of a pipe from an updated model based on change in temperature of the pipe calculated from the model in a case where the pipe is heated in the model obtained by modeling a heat transfer behavior of an inside of the pipe containing deposition by using an equivalent circuit and change in temperature of the pipe measured in a case where the pipe is heated.

Abstract: A thermal analysis device includes a memory and a processor configured to perform estimation of whether a pair of components included in a target product has contact with each other by referring to first information obtained from design information of a product, the first information indicating whether two components have contact with each other, perform determination of a division number of the pair of components in a thermal network model by referring to second information indicating a relationship between a parameter regarding thermal transfer of components and a division number of the components in the thermal network model, perform generation of the thermal network model of the target product on the basis of a result of the estimation and another result of the determination, and perform thermal analysis based on the generated thermal network model of the target product.

Abstract: A quality determination method includes: in a quality determination space, mapping a quality of a package product in which a plurality of devices are assembled in accordance with a predetermined design condition, with use of each test result of each of the plurality of devices; and determining a quality of the package product, on a basis of mapping result of the mapping.

Abstract: An undulator magnet having favorable transportation workability is provided. Specifically, an undulator permanent magnet used for an undulator is provided that generates radiation light by meandering electrons that travel in a first direction, wherein, in the undulator permanent magnet, one end surface in the first direction forms a first connecting surface connected to another undulator permanent magnet, N poles and S poles are alternately arranged in the first direction on one magnetic pole surface in a second direction orthogonal to the first direction, and thus a magnetic flux density distribution having a plurality of peaks is generated, and when the plurality of peaks are represented as the first to m-th peaks Pm (m is an integer of 1 or more) in order from the side of the first connecting surface, a magnitude of the first peak P1 is larger than a magnitude of the third peak P3.

Abstract: An undulator magnet having favorable transportation workability is provided. Specifically, an undulator permanent magnet used for an undulator is provided that generates radiation light by meandering electrons that travel in a first direction, wherein, in the undulator permanent magnet, one end surface in the first direction forms a first connecting surface connected to another undulator permanent magnet, N poles and S poles are alternately arranged in the first direction on one magnetic pole surface in a second direction orthogonal to the first direction, and thus a magnetic flux density distribution having a plurality of peaks is generated, and when the plurality of peaks are represented as the first to m-th peaks Pm (m is an integer of 1 or more) in order from the side of the first connecting surface, a magnitude of the first peak P1 is larger than a magnitude of the third peak P3.

Abstract: A semiconductor device includes: a first semiconductor element; a first substrate provided on the first semiconductor element and including a cavity with reduced pressure; coolant held inside the cavity; a second semiconductor element provided on the first substrate; and a heat spreading member thermally connected to the first substrate and provided with a hole communicated with the cavity.

Abstract: When an operation body is urged upward by a flat spring and is in a return position, a projection disposed on the operation body is held between opposing positioning portions and the position of the operation body in an X-direction is set. When the operation body is pressed at a position away from a central portion of the operation body in the X-direction, the operation body pivots on one of retaining structures downward. At this time, the projection moves away from the opposing positioning portions, and resistance against a pressing operation can thereby be reduced.

Abstract: When an operation body is urged upward by a flat spring and is in a return position, a projection disposed on the operation body is held between opposing positioning portions and the position of the operation body in an X-direction is set. When the operation body is pressed at a position away from a central portion of the operation body in the X-direction, the operation body pivots on one of retaining structures downward. At this time, the projection moves away from the opposing positioning portions, and resistance against a pressing operation can thereby be reduced.

Abstract: The invention provides is a process for producing a structure (22) with a metal film, including the steps of preparing a mother die (10) in which a first metal film (16) is formed on the surface of a base (12) on which a concave and convex pattern (14) is formed, forming a second metal film (18) on the first metal film (16), adhering a support member (20) to the second metal film (18), and separating the second metal film (18) to which the concave and convex pattern has been transferred to the second metal film (18) together with the support member from the first metal film (16). Preferably, the first metal film (16) is a film containing Cr and Al, and the second metal film (18) is a film containing at least one metal selected from the group consisting of Au, Ag, Cu, Al, and Pt.

Abstract: A semiconductor device includes: a first semiconductor element; a first substrate provided on the first semiconductor element and including a cavity with reduced pressure; coolant held inside the cavity; a second semiconductor element provided on the first substrate; and a heat spreading member thermally connected to the first substrate and provided with a hole communicated with the cavity.