Abstract: To provide production methods for a 3-D mold, a finely processed product, and a fine pattern molded product in which the depth and the line width can be formed with high precision, a 3-D mold, a finely processed product, a fine-pattern molded product, and an optical element formed with high precision.

Abstract: Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.

Abstract: To realize a flat heat exchanger with superior stability of the flow path, a heat exchanger for liquid cooling in which a cooling liquid flows inside the heat exchanger includes a pouch made of a water-resistant sheet having an inflow port and an outflow port for the cooling liquid; a heat exchange plate overlapping with the pouch; a presser plate pressing the pouch against the heat exchange plate; wherein protrusions and depressions delimiting a flow path linking the inflow port and the outflow port are formed on the inner side of at least one of the heat exchange plate and the presser plate.

Abstract: A heat receiving member of a heat receiving device includes a coolant passage comprising a bag formed of a flexible sheet made up of a thermally stable, flexible plastic material and a metal film having high heat conductivity. In the coolant passage flows a coolant having an anti-corrosion property. A heat generating member including a main body and a terminal portion is supported by an adapter fitted in an opening formed in the flexible sheet. The main body of the heat generating member comes into direct contact with the coolant flowing in the coolant passage. Since the heat from the heat generating member is directly transferred to the coolant, the heat transfer path between the heat generating member and the coolant becomes shorter. Therefore, the heat resistance is reduced, so that the heat receiving efficiency is extremely high.

Abstract: This invention relates to an efficient surface processing method. In one embodiment of the invention, a laminated body 4 comprising a sample material 1, an intermediate layer 2 formed on a surface of the sample material 1, and an SOG layer 3 formed on the surface of the intermediate layer 2 is used. First, the surface of the SOG layer 3 is irradiated with an electron beam so as to expose part of the SOG layer. Next, exposed parts 31 of the SOG layer 3 are eliminated by etching. As a result, finely detailed unevenness can be formed at the surface of the SOG layer 3. The depth of the exposed parts 31 can be controlled by changing the acceleration voltage of the electron beam. It is therefore possible to form three-dimensional shapes of different depths. After forming unevenness at the surface of the SOG layer 3, the intermediate layer 2 and the sample material 1 can be eliminated in order using, for example, an oxygen ion beam.

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract: A plurality of carbon fibers having a surface having a metal-plated layer (Cu-plated layer) are stood vertically on a flat plate-like provisional substrate by electrostatic flocking, and one end of the carbon fibers is provisionally adhered to the provisional substrate with an adhesive. The other end of the carbon fibers which is not provisionally adhered is contacted with a substrate (Cu plate) having a surface coated with a solder paste and, in this state, a brazing material (solder) is melted and cooled, and carbon fibers and a substrate are brazed (soldered). After completion of mechanical and thermal connection between the substrate and the carbon fibers, this is immersed in an organic solvent, and the provisionally adhered provisional substrate is peeled from the carbon fibers to manufacture a radiating fin.

Abstract: A sealing process in a manufacturing method for semiconductor devices improves product reliability. A die pad 14 with a semiconductor chip 32 mounted thereon is placed between first and second molding dies 40, 42 such that the die pad 14 is supported above the second molding die 42. A sealant 30 is then injected between the first and second molding dies 40, 42 to seal the semiconductor chip 32. Part of the die pad 14 has one or more protrusions 16 projecting in the direction of the second molding die 42. Injecting the sealant 30 presses the protrusions 16 against the second molding die 42 and seals the semiconductor chip 32.

Abstract: A method of manufacturing a semiconductor device including: mounting a semiconductor chip in which an integrated circuit is formed on a wiring board having an interconnecting pattern; mounting a board for electrical connection having a plurality of penetrating conductive sections on the wiring board; disposing a first end surface of each of the penetrating conductive sections to face the interconnecting pattern; electrically connecting the first end surface and the interconnecting pattern; and forming a sealing section which seals the semiconductor chip and the board for electrical connection such that a second end surface of each of the penetrating conductive sections is exposed from the sealing section.

Abstract: A semiconductor device includes a semiconductor element including an electrode; a substrate on which an interconnect pattern is formed; a protective film formed to cover the interconnect pattern in a second region other than a first region in which the semiconductor element is mounted; and an adhesive sheet which bonds the semiconductor element to the substrate. The protective film includes an end portion which is formed to become thinner toward the first region. The adhesive sheet is formed to extend from at least the first region of the substrate and to cover the end portion of the protective film.

Abstract: A raised portion 12 is formed on a substrate 10. The raised portion consists of a raised support pattern that preferably includes a wiring pattern. A sheet 30 is supported by the top surfaces of the raised support pattern such that the sheet is maintained apart from the base surface of the substrate 10. A semiconductor die 40 is adhered onto the sheet 30 using an adhesive agent 42. A sealant is used to create a sealed portion 50 that seals the semiconductor die 40 on the sheet 30. The sheet 30 has gas permeable region at least at a location accessible by the adhesive agent.

Abstract: A raised portion 12 is formed on a substrate 10. The raised portion consists of a raised support pattern that preferably includes a wiring pattern. A sheet 30 is supported by the top surfaces of the raised support pattern such that the sheet is maintained apart from the base surface of the substrate 10. A semiconductor die 40 is adhered onto the sheet 30 using an adhesive agent 42. A sealant is used to create a sealed portion 50 that seals the semiconductor die 40 on the sheet 30. The sheet 30 has gas permeable region at least at a location accessible by the adhesive agent.

Abstract: A semiconductor device features excellent mountability without limiting the arrangement of external contacts, a manufacturing method for such a semiconductor device, a circuit board, and an electronic device. The semiconductor device includes a substrate having first wiring pattern, external contacts formed on the substrate, a first semiconductor chip with second wiring pattern that is bonded face-down to the substrate, and a second semiconductor chip bonded face-down to the first semiconductor chip.

Abstract: A first semiconductor chip is mounted on a substrate on which an interconnect pattern is formed, and a surface of the first semiconductor chip having electrodes faces the substrate. A second semiconductor chip is mounted on the first semiconductor chip. Electrodes of the second semiconductor chip are electrically connected to the interconnect pattern by wires. A first resin is provided between the first semiconductor chip and the substrate, and a second resin which differs from the first resin seals the first and second semiconductor chips.

Abstract: A sealing process in a manufacturing method for semiconductor devices improves product reliability. A die pad 14 with a semiconductor chip 32 mounted thereon is placed between first and second molding dies 40, 42 such that the die pad 14 is supported above the second molding die 42. A sealant 30 is then injected between the first and second molding dies 40, 42 to seal the semiconductor chip 32. Part of the die pad 14 has one or more protrusions 16 projecting in the direction of the second molding die 42. Injecting the sealant 30 presses the protrusions 16 against the second molding die 42 and seals the semiconductor chip 32.

Abstract: A first semiconductor chip is mounted on a substrate on which an interconnect pattern is formed, and a surface of the first semiconductor chip having electrodes faces the substrate. A second semiconductor chip is mounted on the first semiconductor chip. Electrodes of the second semiconductor chip are electrically connected to the interconnect pattern by wires. A first resin is provided between the first semiconductor chip and the substrate, and a second resin which differs from the first resin seals the first and second semiconductor chips.

Abstract: A head up-down mechanism in a printer is to be provided wherein, by a simple construction, a carriage is returned up to a printing start position while a thermal head is spaced apart from a platen and at the same time there is performed a paper feed operation and which can thereby improve an effective printing speed. To this end the head up-down mechanism includes a head up-down lever with a thermal head mounted thereon at a position opposed to a platen, the head up-down lever being supported pivotably by a carriage which reciprocates along the platen between both side plates spaced a predetermined distance from each other, an urging member for urging the head up-down lever in a direction in which the thermal head comes into abutment against the platen, and a head up-down cam which is moved by abutment thereof against each of the side plates and which causes the head up-down lever to turn so that the thermal head comes into or out of contact with the platen.

Abstract: A thermal printer is provided which is capable of easily controlling the operations of a carriage and conveyance rollers by only one drive motor thereof and which enables the size and cost to be reduced.

Abstract: A thermal printer which is designed to reduce costs by reducing the number of parts, and which can easily drive a carriage using an inexpensive low-power drive motor by reducing a load acting on the part of the carriage which carries a thermal head. The carriage is provided so as to travel reciprocatively along a platen. A thermal head is directly attached to the opposite side of the carriage to the platen without any intervening member. A biasing member is disposed for urging the carriage toward the platen.

Abstract: A tape cassette winding apparatus that can accept either an audio compact cassette (ACC) or a digital compact cassette (DCC) that has a revolving drive arrangement for rotating the hub or reel of the cassette to load tape into the cassette. The winding apparatus has first and second winding shafts constructed to fit into an ACC hub or DCC hub. A moving assembly selectively moves the correct winding shaft into position to engage either an ACC hub or DCC hub. The revolving drive rotates the cassette hub to load tape into the cassette when the correct winding shaft has been selected and engaged in the cassette hub. A lid opening assembly is provided to open and close the hub protective lid on DCC's.