Abstract: A dump truck includes a vehicle body portion that includes an upper deck on which a cab is disposed and a frame which is disposed in a longitudinal direction, a vessel that is disposed above the frame, and a sixth imaging device that is disposed below the vessel at a rear end of the frame and can image the rear side of the vehicle body portion. The sixth imaging device is a wide dynamic range camera.

Abstract: Disclosed is fabrication of a resin compact using a mold. The mold includes a resin mold body satisfies any one of conditions which are: a width of a protrusion is 5 nm or greater and less than 50 nm, an aspect ratio of the protrusion is 2 or greater, and Martens hardness is 200 or greater; the width of the protrusion is 50 nm or greater and less than 100 nm, the aspect ratio of the protrusion is 3 or greater, and Martens hardness is 200 or greater; and the width of the protrusion is 100 nm or greater and less than 1 ?m, the aspect ratio of the protrusion is 4 or greater, and Martens hardness is 150 or greater. The inversion pattern has a space between the adjacent protrusions less than twice a height of the protrusion. The mold further includes an adhesion layer and a release layer.

Abstract: There are provided a method for producing a transfer structure, in which detachment between a transfer-receiving material and a matrix can be easily achieved without destroying the fine pattern, the transfer pattern of the matrix is satisfactorily transferred to the transfer-receiving material, and the durability of the matrix is maintained for a long time during repeated transfer; and a matrix for use in the method. A film of a silane coupling agent represented by the following formula (I) is formed on a surface of a matrix having a transfer pattern formed on the surface thereof, a transfer-receiving material is applied thereon to transfer the pattern on the surface of the matrix, and the transfer-receiving material is detached from the matrix to obtain a transfer structure formed of the transfer-receiving material.

Abstract: DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.

Abstract: A loop heat pipe includes: an evaporator to convert liquid phase working fluid into vapor phase working fluid; a condenser to convert vapor phase working fluid into liquid phase working fluid; a first vapor line and a first liquid line to allow the evaporator to communicate with the condenser and form a circular main loop; and a second vapor line and a second liquid line to allow the evaporator to communicate with the condenser and form a circular auxiliary loop; wherein the evaporator includes a reservoir that temporarily stores the liquid phase working fluid, a first vapor collector that communicates with the first vapor line, a second vapor collector that communicates with the second vapor line, first wick disposed between the reservoir and the first vapor collector, and second wick disposed between the reservoir and the second vapor collector.

Abstract: A user request to select a rival to play against asynchronously for an event is received. In response to the user request, a rival selector user interface is displayed. The rival selector UI includes an identification of one or more users that can be selected and one or more filter criteria that can be selected to change which users are identified in the rival selector UI. The user selects one of the identified users that is used as the rival to play against asynchronously for the event. Game data for the rival for the event is obtained, the game data including both a performance of the rival in the event and data indicating a manner in which an object of the rival is customized by the rival. While the user is playing the event, the object as customized by the rival is played back based on the performance data.

Abstract: A loop heat pipe includes: an evaporator to convert liquid phase working fluid into vapor phase working fluid; a condenser to convert vapor phase working fluid into liquid phase working fluid; a first vapor line and a first liquid line to allow the evaporator to communicate with the condenser and form a circular main loop; and a second vapor line and a second liquid line to allow the evaporator to communicate with the condenser and form a circular auxiliary loop; wherein the evaporator includes a reservoir that temporarily stores the liquid phase working fluid, a first vapor collector that communicates with the first vapor line, a second vapor collector that communicates with the second vapor line, first wick disposed between the reservoir and the first vapor collector, and second wick disposed between the reservoir and the second vapor collector.

Abstract: An anti-reflection structure body comprises a base member which is made of glassy carbon and at a surface of which is formed an anti-reflection structure including a cluster of minute projections each having a diameter that contracts towards a tip thereof. The minute projections preferably have an average height of from 200 nm to 3000 nm and an average maximum diameter of from 50 nm to 300 nm, and an average pitch of from 50 nm to 300 nm. An anti-reflection structure body which is easily produced, capable of achieving an anti-reflection effect near to non-reflection, and capable of providing the minute structure even to a member having a high melting point such as quartz glass or the like by transfer or the like can be provided.

Abstract: A server device includes: electronic devices; a housing that houses the electronic devices; at least one fan; air volume control units configured to adjust a volume of cooling airflow which is generated by rotation of the at least one fan and is ventilated through the electronic devices by opening and closing of respective valves; a valve opening control unit configured to control valve opening degrees of the air volume control units so that temperatures inside the electronic devices become a given target temperature; a fan control unit configured to run the at least one fan at a fan rotating speed that achieves a volume of cooling airflow to make temperatures inside the electronic devices become the given target temperature at a valve opening degree higher than the valve opening degrees that the valve opening control unit controls.

Abstract: DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract: There are provided a method for producing a transfer structure, in which detachment between a transfer-receiving material and a matrix can be easily achieved without destroying the fine pattern, the transfer pattern of the matrix is satisfactorily transferred to the transfer-receiving material, and the durability of the matrix is maintained for a long time during repeated transfer; and a matrix for use in the method. A film of a silane coupling agent represented by the following formula (I) is formed on a surface of a matrix having a transfer pattern formed on the surface thereof, a transfer-receiving material is applied thereon to transfer the pattern on the surface of the matrix, and the transfer-receiving material is detached from the matrix to obtain a transfer structure formed of the transfer-receiving material.

Abstract: The invention provides is a process for producing a structure (22) with a metal film, including the steps of preparing a mother die (10) in which a first metal film (16) is formed on the surface of a base (12) on which a concave and convex pattern (14) is formed, forming a second metal film (18) on the first metal film (16), adhering a support member (20) to the second metal film (18), and separating the second metal film (18) to which the concave and convex pattern has been transferred to the second metal film (18) together with the support member from the first metal film (16). Preferably, the first metal film (16) is a film containing Cr and Al, and the second metal film (18) is a film containing at least one metal selected from the group consisting of Au, Ag, Cu, Al, and Pt.

Abstract: An anti-reflection structure body comprises a base member which is made of glassy carbon and at a surface of which is formed an anti-reflection structure including a cluster of minute projections each having a diameter that contracts towards a tip thereof. The minute projections preferably have an average height of from 200 nm to 3000 nm and an average maximum diameter of from 50 nm to 300 nm, and an average pitch of from 50 nm to 300 nm. An anti-reflection structure body which is easily produced, capable of achieving an anti-reflection effect near to non-reflection, and capable of providing the minute structure even to a member having a high melting point such as quartz glass or the like by transfer or the like can be provided.

Abstract: To provide production methods for a 3-D mold, a finely processed product, and a fine pattern molded product in which the depth and the line width can be formed with high precision, a 3-D mold, a finely processed product, a fine-pattern molded product, and an optical element formed with high precision.

Abstract: There is provided a thermal conductivity sheet capable of lowering the thermal resistance value of the joint surface more than before in addition to easiness to use, and an electronic device to which the thermal conductivity sheet is applied. Load is applied to the thermal conductivity sheet having a prescribed thickness placed between CPU 10 that is the heat generation parts and the heat sink 11 that is the heat radiation parts. The thermal conductivity sheet has hardness wherein intervals between CPU 10 that is the heat generation parts and the heat sink 11 that is the heat radiation parts narrow more than the prescribed thickness by either of load within the range from 0.01 kgf/cm2 to 5.0 kgf/cm2 with tightening of screw.

Abstract: A process for producing a 3-dimensional mold, including irradiating a resist layer of a processing object having the resist layer made of an organopolysiloxane on a substrate with an electron beam, and developing, by thermal desorption treatment, the resist layer after the irradiation with an electron beam to form protrusions and depressions in the resist layer; a process for producing a microfabrication product by using the 3-dimensional mold; a process for producing a micropattern molding by using the 3-dimensional mold or the microfabrication product; and a 3-dimensional mold, a microfabrication product and a micropattern molding which are finely formed by these production processes, as well as an optical device.

Abstract: Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU 2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.