Patents by Inventor Jun-Xiu Liu
Jun-Xiu Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11935722Abstract: This disclosure is directed to solutions of detecting and classifying wafer defects using machine learning techniques. The solutions take only one coarse resolution digital microscope image of a target wafer, and use machine learning techniques to process the coarse SEM image to review and classify a defect on the target wafer. Because only one coarse SEM image of the wafer is needed, the defect review and classification throughput and efficiency are improved. Further, the techniques are not distractive and may be integrated with other defect detecting and classification techniques.Type: GrantFiled: July 21, 2022Date of Patent: March 19, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chung-Pin Chou, Sheng-Wen Huang, Jun-Xiu Liu
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Publication number: 20230385502Abstract: A semiconductor wafer defect detection system captures test images of a semiconductor wafer. The system analyzes the test images with an analysis model trained with a machine learning process. The analysis model generates simulated integrated circuit layouts based on the test images. The system detects defects in the semiconductor wafer by comparing the simulated integrated circuit layouts to reference integrated circuit layouts.Type: ApplicationFiled: August 9, 2023Publication date: November 30, 2023Inventors: Chung-Pin CHOU, Chun-Wen WANG, Meng Ku CHI, Yan-Cheng CHEN, Jun-Xiu LIU
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Publication number: 20230384211Abstract: A process tube device can detect the presence of any external materials that may reside within a fluid flowing in the tube. The process tube device detects the external materials in-situ which obviates the need for a separate inspection device to inspect the surface of a wafer after applying fluid on the surface of the wafer. The process tube device utilizes at least two methods of detecting the presence of external materials. The first is the direct measurement method in which a light detecting sensor is used. The second is the indirect measurement method in which a sensor utilizing the principles of Doppler shift is used. Here, contrary to the first method that at least partially used reflected or refracted light, the second method uses a Doppler shift sensor to detect the presence of the external material by measuring the velocity of the fluid flowing in the tube.Type: ApplicationFiled: July 28, 2023Publication date: November 30, 2023Inventors: Yu-Jen YANG, Chung-Pin CHOU, Yan-Cheng CHEN, Kai-Lin Chuang, Jun-Xiu Liu, Sheng-Ching Kao
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Publication number: 20230369092Abstract: Some implementations described herein provide techniques and apparatuses for a semiconductor processing tool including an electrostatic chuck having a voltage-regulation system to regulate an electrical potential throughout regions of a semiconductor substrate positioned above the electrostatic chuck. The voltage-regulation system may determine that an electrical potential within a region of the semiconductor substrate does not satisfy a threshold. The voltage-regulation system may, based on determining that the electrical potential throughout the region does not satisfy the threshold, position one or more electrically-conductive pins within the region. While positioned within the region, the one or more electrically-conductive pins may change the electrical potential of the region.Type: ApplicationFiled: July 26, 2023Publication date: November 16, 2023Inventors: Chung-Pin CHOU, Kai-Lin CHUANG, Sheng-Wen HUANG, Yan-Cheng CHEN, Jun Xiu LIU
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Patent number: 11816411Abstract: A semiconductor wafer defect detection system captures test images of a semiconductor wafer. The system analyzes the test images with an analysis model trained with a machine learning process. The analysis model generates simulated integrated circuit layouts based on the test images. The system detects defects in the semiconductor wafer by comparing the simulated integrated circuit layouts to reference integrated circuit layouts.Type: GrantFiled: November 24, 2020Date of Patent: November 14, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chung-Pin Chou, Chun-Wen Wang, Meng Ku Chi, Yan-Cheng Chen, Jun-Xiu Liu
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Publication number: 20230360975Abstract: In a method of inspection of a semiconductor substrate a first beam of light is split into two or more second beams of light. The two or more second beams of light are respectively transmitted onto a first set of two or more first locations on top of the semiconductor substrate. In response to the transmitted two or more second beams of light, two or more reflected beams of light from the first set of two or more first locations are received. The received two or more reflected beams of light are detected to generate two or more detected signals. The two or more detected signals are analyzed to determine whether a defect exists at the set of the two or more first locations.Type: ApplicationFiled: July 18, 2023Publication date: November 9, 2023Inventors: Sheng He HUANG, Chung-Pin CHOU, Shiue-Ming GUO, Hsuan-Chia KAO, Yan-Cheng CHEN, Sheng-Ching KAO, Jun Xiu LIU
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Patent number: 11764094Abstract: Some implementations described herein provide techniques and apparatuses for a semiconductor processing tool including an electrostatic chuck having a voltage-regulation system to regulate an electrical potential throughout regions of a semiconductor substrate positioned above the electrostatic chuck. The voltage-regulation system may determine that an electrical potential within a region of the semiconductor substrate does not satisfy a threshold. The voltage-regulation system may, based on determining that the electrical potential throughout the region does not satisfy the threshold, position one or more electrically-conductive pins within the region. While positioned within the region, the one or more electrically-conductive pins may change the electrical potential of the region.Type: GrantFiled: February 18, 2022Date of Patent: September 19, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Pin Chou, Kai-Lin Chuang, Sheng-Wen Huang, Yan-Cheng Chen, Jun Xiu Liu
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Patent number: 11749571Abstract: In a method of inspection of a semiconductor substrate a first beam of light is split into two or more second beams of light. The two or more second beams of light are respectively transmitted onto a first set of two or more first locations on top of the semiconductor substrate. In response to the transmitted two or more second beams of light, two or more reflected beams of light from the first set of two or more first locations are received. The received two or more reflected beams of light are detected to generate two or more detected signals. The two or more detected signals are analyzed to determine whether a defect exists at the set of the two or more first locations.Type: GrantFiled: August 31, 2021Date of Patent: September 5, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Sheng He Huang, Chung-Pin Chou, Shiue-Ming Guo, Hsuan-Chia Kao, Yan-Cheng Chen, Sheng-Ching Kao, Jun Xiu Liu
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Publication number: 20230268215Abstract: Some implementations described herein provide techniques and apparatuses for a semiconductor processing tool including an electrostatic chuck having a voltage-regulation system to regulate an electrical potential throughout regions of a semiconductor substrate positioned above the electrostatic chuck. The voltage-regulation system may determine that an electrical potential within a region of the semiconductor substrate does not satisfy a threshold. The voltage-regulation system may, based on determining that the electrical potential throughout the region does not satisfy the threshold, position one or more electrically-conductive pins within the region. While positioned within the region, the one or more electrically-conductive pins may change the electrical potential of the region.Type: ApplicationFiled: February 18, 2022Publication date: August 24, 2023Inventors: Chung-Pin CHOU, Kai-Lin CHUANG, Sheng-Wen HUANG, Yan-Cheng CHEN, Jun Xiu LIU
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Publication number: 20230060183Abstract: A process tube device can detect the presence of any external materials that may reside within a fluid flowing in the tube. The process tube device detects the external materials in-situ which obviates the need for a separate inspection device to inspect the surface of a wafer after applying fluid on the surface of the wafer. The process tube device utilizes at least two methods of detecting the presence of external materials. The first is the direct measurement method in which a light detecting sensor is used. The second is the indirect measurement method in which a sensor utilizing the principles of Doppler shift is used. Here, contrary to the first method that at least partially used reflected or refracted light, the second method uses a Doppler shift sensor to detect the presence of the external material by measuring the velocity of the fluid flowing in the tube.Type: ApplicationFiled: August 30, 2021Publication date: March 2, 2023Inventors: Yu-Jen YANG, Chung-Pin CHOU, Kai-Lin CHUANG, Yan-Cheng CHEN, Sheng-Ching KAO, Jun-Xiu LIU
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Publication number: 20230068133Abstract: In a method of inspection of a semiconductor substrate a first beam of light is split into two or more second beams of light. The two or more second beams of light are respectively transmitted onto a first set of two or more first locations on top of the semiconductor substrate. In response to the transmitted two or more second beams of light, two or more reflected beams of light from the first set of two or more first locations are received. The received two or more reflected beams of light are detected to generate two or more detected signals. The two or more detected signals are analyzed to determine whether a defect exists at the set of the two or more first locations.Type: ApplicationFiled: August 31, 2021Publication date: March 2, 2023Inventors: Sheng He HUANG, Chung-Pin CHOU, Shiue-Ming GUO, Hsuan-Chia KAO, Yan-Cheng CHEN, Sheng-Ching KAO, Jun Xiu LIU
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Publication number: 20220406632Abstract: An apparatus for inspecting a semiconductor substrate includes a rotatable base configured to support a substrate, and a nozzle arm includes a nozzle and a light monitoring device. The light monitoring device includes a laser transmitter and an array of light sensors arranged in the nozzle arm and facing the substrate. The light monitoring device is configured to transmit a laser pulse towards the substrate, wherein the laser pulse impinges on the substrate, receive a reflected laser pulse from the substrate, calculate whether one or more light sensors received the laser pulse, and calculate a distance between the light monitoring device and the substrate using the turnaround time for determining a process quality on the substrate.Type: ApplicationFiled: June 18, 2021Publication date: December 22, 2022Inventors: Chung-Pin CHOU, Kai-Lin CHUANG, Yan-Cheng CHEN, Jui Kuo LAI, Jun Xiu LIU
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Publication number: 20220383473Abstract: Methods and systems for diagnosing a semiconductor wafer are provided. A plurality of raw images are captured with a tilt angle from the semiconductor wafer according to graphic data system (GDS) information regarding a layout of a target die, by an inspection apparatus. A first image-based comparison is performed on the plurality of raw images, by a determining circuitry, to obtain a defect image in the plurality of raw images. A second image-based comparison is performed on a reference image and the defect image, so as to classify a defect type of an image difference in the defect image, by the determining circuitry. The number of the plurality of raw images is greater than 2.Type: ApplicationFiled: July 28, 2022Publication date: December 1, 2022Inventors: Yen-Liang CHEN, Jun-Xiu LIU
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Publication number: 20220359154Abstract: This disclosure is directed to solutions of detecting and classifying wafer defects using machine learning techniques. The solutions take only one coarse resolution digital microscope image of a target wafer, and use machine learning techniques to process the coarse SEM image to review and classify a defect on the target wafer. Because only one coarse SEM image of the wafer is needed, the defect review and classification throughput and efficiency are improved. Further, the techniques are not distractive and may be integrated with other defect detecting and classification techniques.Type: ApplicationFiled: July 21, 2022Publication date: November 10, 2022Inventors: Chung-Pin CHOU, Sheng-Wen HUANG, Jun-Xiu LIU
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Patent number: 11449984Abstract: Methods and systems for diagnosing a semiconductor wafer are provided. A plurality of raw images of the semiconductor wafer are obtained according to GDS information regarding a layout of a target die, by an inspection apparatus. A first image-based comparison is performed on the raw images, so as to provide a comparison result, by a determining circuitry. The comparison result indicates whether an image difference is present between the images. One of the raw images having the image difference is assigned as a defect image. A second image-based comparison is performed on a reference image and the defect image, so as to classify a defect type of the image difference, by the determining circuitry. The layout of the target die includes a circuit with a duplicate layout formed by a plurality of same cells. The number of the plurality of raw images is greater than 2.Type: GrantFiled: August 24, 2020Date of Patent: September 20, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yen-Liang Chen, Jun-Xiu Liu
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Publication number: 20220293443Abstract: A method of manufacturing a semiconductor device includes: receiving a workpiece on which the semiconductor device is manufactured; causing a nozzle to dispense a fluid toward a surface of the workpiece external to the nozzle, wherein the nozzle includes a first channel and a second channel that allow the fluid to flow through; emitting light, by a light source, from within the nozzle toward the surface while the nozzle is dispensing the fluid; receiving light reflected from the surface by a light sensor, the light source and the light sensor being disposed within the nozzle and opposite to each other, and the emitted light and the reflected light adapted to be contained within the fluid; and examining a status of the reflected light. The emitted light and the reflected light propagate in a direction parallel to a longitudinal axis of each of the first channel and the second channel.Type: ApplicationFiled: June 2, 2022Publication date: September 15, 2022Inventors: KAI-LIN CHUANG, TSUNG-CHI CHEN, PEI-JUNG CHANG, CHUN-WEI HUANG, JUN XIU LIU
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Patent number: 11424101Abstract: This disclosure is directed to solutions of detecting and classifying wafer defects using machine learning techniques. The solutions take only one coarse resolution digital microscope image of a target wafer, and use machine learning techniques to process the coarse SEM image to review and classify a defect on the target wafer. Because only one coarse SEM image of the wafer is needed, the defect review and classification throughput and efficiency are improved. Further, the techniques are not distractive and may be integrated with other defect detecting and classification techniques.Type: GrantFiled: October 13, 2020Date of Patent: August 23, 2022Assignee: Taiwan Semiconductor Manufacturing Co., LtdInventors: Chung-Pin Chou, Sheng-Wen Huang, Jun-Xiu Liu
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Patent number: 11355370Abstract: A method of monitoring a fluid includes: applying the fluid from within a nozzle to a surface of a wafer outside of the nozzle; emitting light, by a light source, from the nozzle to the surface; receiving light reflected from the surface by a light sensor and causing the reflected light to propagate into the nozzle; and determining whether a variation of the fluid occurs according to the reflected light.Type: GrantFiled: December 10, 2019Date of Patent: June 7, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Kai-Lin Chuang, Tsung-Chi Chen, Pei-Jung Chang, Chun-Wei Huang, Jun Xiu Liu
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Patent number: 11222788Abstract: Methods for enhancing a surface topography of a structure formed on a substrate are provided. In one example, the method includes performing a polishing process on a substrate having a shallow trench isolation structure and a diffusion region, performing a surface topography enhancing process to enlarge a defect in at least one of the shallow trench isolation structure and the diffusion region, inspecting at least one of the shallow trench isolation structure and the diffusion region to detect the enlarged defect, and adjusting a parameter of the polishing process in response to detecting the enlarged defect.Type: GrantFiled: August 21, 2020Date of Patent: January 11, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Han-Wen Liao, Jun-Xiu Liu, Chun-Chih Lin
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Patent number: 11107671Abstract: A method includes disposing a semiconductor substrate over a chuck. The chuck has a plurality of holes therein. The semiconductor substrate has a first surface facing the chuck and a second surface opposite thereto. A liquid layer is formed flowing over a top surface of the chuck by supplying liquid to the top surface of the chuck through the holes of the chuck. The semiconductor substrate is moved toward the chuck such that the first surface of the semiconductor substrate is in contact with the liquid layer and the liquid layer flows between the first surface of the semiconductor substrate and the top surface of the chuck.Type: GrantFiled: April 22, 2019Date of Patent: August 31, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wei-Chih Hsu, Kai-Lin Chuang, Yuan-Chi Chien, Jeng-Huei Yang, Jun-Xiu Liu