Patents by Inventor Jun Young Lim

Jun Young Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11118019
    Abstract: The present invention provides thermoplastic polyurethane particles, which are formed in a continuous matrix phase from a thermoplastic polyurethane resin and have a particle diameter of 200-500 ?m. In a differential scanning calorimetry (DSC) curve of the thermoplastic polyurethane particles, derived from the analysis of a temperature rise of 10° C./min by DSC, a peak of the cold crystallization temperature (Tcc) is shown at a temperature between the glass transition temperature (Tg) and the melting point (Tm). The thermoplastic polyurethane particles have a compression degree of 10-20%.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: September 14, 2021
    Inventors: Min Gyung Kim, Sung Yong Kang, Kyoung Min Kang, Hee-Jung Lee, Chang-Young Park, Jae Ho Lim, Jun Ho Choi, Jae Han Song, Yu Jin Go
  • Patent number: 11041744
    Abstract: A composite sensor package includes: a substrate; a first sensor and a second sensor, which are arranged on the substrate with a predetermined gap therebetween; a signal processing device disposed on the substrate and processing a signal transmitted through the first and second sensors; and a cover disposed on the substrate, and including a package accommodation space enclosing the first sensor, the second sensor and the signal processing device, wherein the first sensor senses a state of air introduced from an outside and transmits the introduced air to the package accommodation space, and the second sensor senses the state of the air, which passes through the first sensor so as to flow into the package accommodation space.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: June 22, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jeong Gi Seo, Ki Chul Chang, Sun Hwa Lee, Jun Young Lim
  • Publication number: 20210163361
    Abstract: The present invention relates to a paste-type composition for a fused deposition modeling (FDM) 3D printer comprising: a ceramic powder including CaO and SiO2; and a binder solution, wherein the composition may be injected into the FDM 3D printer in the form of a paste to rapidly manufacture a molded article without a melting process and may precisely implement a variety of geometries to be utilized as a biological replacement for medical use.
    Type: Application
    Filed: May 24, 2019
    Publication date: June 3, 2021
    Applicant: BIOALPHA CORPORATION
    Inventors: Jun Young LIM, Yong Bok KIM, Jun Hyuk SEO, Hyun Seung RYU
  • Patent number: 10994054
    Abstract: Disclosed is a scaffold for living donor transplantation, which includes sintered bioglass and a biocompatible polymer and has improved properties using a 3D printer through a fused deposition modeling process.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: May 4, 2021
    Assignees: CG BIO CO., LTD., BIOALPHA INC.
    Inventors: Jun Young Lim, Yong Bok Kim, Hyun Seung Ryu
  • Patent number: 10986726
    Abstract: A flexible circuit board for all-in-one chip on film according to an embodiment may include: a substrate; a conductive pattern part disposed on the substrate; and a protective layer partially disposed on the conductive pattern part, wherein the conductive pattern part includes a first conductive pattern part and a second conductive pattern part which are spaced apart from each other, each of the first conductive pattern part and the second conductive pattern part includes a wiring pattern layer, a first plating layer, and a second plating layer that are sequentially placed on the substrate, the first conductive pattern part includes a first open region in which the protective layer is open, the second conductive pattern part includes a second open region in which the protective layer is open, and a content of tin of the second plating layer in the first open region is greater than that of the second plating layer in the second open region.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: April 20, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jun Young Lim, Jong Seok Park, Hyung Kyu Yoon, Seong Hwan Im, Gi Uk Yang, Dae Sung Yoo
  • Publication number: 20210084755
    Abstract: A flexible circuit board includes a substrate a, a wiring pattern layer provided on the first surface of the substrate, a plating layer provided on the wiring pattern layer and including an open area, and a protective layer that contacts parts of the wiring pattern layer, the plating layer, and the substrate. The protective layer has a larger thickness than a thickness of the plating layer. The first protective layer includes a first overlapping region in which the plating layer and protective layer are in contact with each and a second overlapping region in which the plating layer and the protective layer are in contact with each other. A width of the first overlapping region may be different from a width of the second overlapping region, and each of the widths of the first and second overlapping regions is larger than a thickness of the plating layer.
    Type: Application
    Filed: November 27, 2020
    Publication date: March 18, 2021
    Inventors: Jun Young LIM, Woong Sik KIM, Hyung Kyu YOON, Min Hwan KIM
  • Publication number: 20210045229
    Abstract: A flexible circuit board for all-in-one chip on film according to an embodiment may include: a substrate; a conductive pattern part disposed on the substrate; and a protective layer partially disposed on the conductive pattern part, wherein the conductive pattern part includes a first conductive pattern part and a second conductive pattern part which are spaced apart from each other, each of the first conductive pattern part and the second conductive pattern part includes a wiring pattern layer, a first plating layer, and a second plating layer that are sequentially placed on the substrate, the first conductive pattern part includes a first open region in which the protective layer is open, the second conductive pattern part includes a second open region in which the protective layer is open, and a content of tin of the second plating layer in the first open region is greater than that of the second plating layer in the second open region.
    Type: Application
    Filed: May 9, 2018
    Publication date: February 11, 2021
    Inventors: Jun Young LIM, Jong Seok PARK, Hyung Kyu YOON, Seong Hwan IM, Gi Uk YANG, Dae Sung YOO
  • Patent number: 10912192
    Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: February 2, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jun Young Lim, Woong Sik Kim, Hyung Kyu Yoon, Min Hwan Kim
  • Publication number: 20210024420
    Abstract: A composition for a FDM 3D printer is disclosed. The composition contains bioglass and a biocompatible polymer resin. In addition, a FDM 3D printer molded article having a laminated strut structure, in which the composition for the FDM 3D printer is injected into four layers, is disclosed.
    Type: Application
    Filed: December 11, 2019
    Publication date: January 28, 2021
    Applicants: CG Bio Co., Ltd., BIOALPHA CORPORATION
    Inventors: Jun Young LIM, Yong Bok KIM, Hyun Seung RYU
  • Publication number: 20210023275
    Abstract: Disclosed is a scaffold for living donor transplantation, which includes sintered bioglass and a biocompatible polymer and has improved properties using a 3D printer through a fused deposition modeling process.
    Type: Application
    Filed: December 11, 2019
    Publication date: January 28, 2021
    Inventors: Jun Young LIM, Yong Bok KIM, Hyun Seung RYU
  • Publication number: 20200300676
    Abstract: A composite sensor package includes: a substrate; a first sensor and a second sensor, which are arranged on the substrate with a predetermined gap therebetween; a signal processing device disposed on the substrate and processing a signal transmitted through the first and second sensors; and a cover disposed on the substrate, and including a package accommodation space enclosing the first sensor, the second sensor and the signal processing device, wherein the first sensor senses a state of air introduced from an outside and transmits the introduced air to the package accommodation space, and the second sensor senses the state of the air, which passes through the first sensor so as to flow into the package accommodation space.
    Type: Application
    Filed: March 30, 2017
    Publication date: September 24, 2020
    Inventors: Jeong Gi SEO, Ki Chul CHANG, Sun Hwa LEE, Jun Young LIM
  • Publication number: 20200243452
    Abstract: A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.
    Type: Application
    Filed: October 25, 2018
    Publication date: July 30, 2020
    Inventors: Jun Young LIM, Hyung Kyu YOON, Sung Min CHAE
  • Publication number: 20200146140
    Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.
    Type: Application
    Filed: January 3, 2020
    Publication date: May 7, 2020
    Inventors: Jun Young LIM, Woong Sik KIM, Hyung Kyu YOON, Min Hwan KIM
  • Publication number: 20200107440
    Abstract: An embodiment of the present invention relates to a flexible printed circuit board (FPCB), which is applied to various electronic display devices, and may provide the FPCB, including a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.
    Type: Application
    Filed: November 19, 2019
    Publication date: April 2, 2020
    Inventors: Jun Young LIM, Woong Sik KIM, Hyung Kyu YOON
  • Patent number: 10561016
    Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: February 11, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jun Young Lim, Woong Sik Kim, Hyung Kyu Yoon, Min Hwan Kim
  • Patent number: 10517172
    Abstract: An embodiment of the present invention relates to a flexible printed circuit board (FPCB), which is applied to various electronic display devices, and may provide the FPCB, including a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: December 24, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jun Young Lim, Woong Sik Kim, Hyung Kyu Yoon
  • Publication number: 20190239345
    Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.
    Type: Application
    Filed: April 9, 2019
    Publication date: August 1, 2019
    Inventors: Jun Young LIM, Woong Sik KIM, Hyung Kyu YOON, Min Hwan KIM
  • Patent number: 10321562
    Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: June 11, 2019
    Assignee: LG INNOTEK CO., LTD
    Inventors: Jun Young Lim, Woong Sik Kim, Hyung Kyu Yoon, Min Hwan Kim
  • Publication number: 20180310404
    Abstract: An embodiment of the present invention relates to a flexible printed circuit board (FPCB), which is applied to various electronic display devices, and may provide the FPCB, including a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.
    Type: Application
    Filed: September 12, 2016
    Publication date: October 25, 2018
    Inventors: Jun Young LIM, Woong Sik KIM, Hyung Kyu YOON
  • Patent number: 10020248
    Abstract: Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a cutting portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the cutting portion within a resin application portion, the problem of occurrence of cracks along a width of a narrow wiring can be avoided. The tape may include a first lead and a second lead formed on a dielectric substrate and a cutting portion formed on one of the first lead and the second lead wherein the cutting portion is formed within a resin application portion.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: July 10, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Dae Sung Yoo, Han Mo Koo, Ki Tae Park, Jun Young Lim, Tae Ki Hong