Abstract: Disclosed is a structure for cooling a battery of a vehicle. In particular, the structure includes: a battery case configured to accommodate a battery and mounted underneath a vehicle body floor, a longitudinal vehicle body member elongated in a front-rear direction of a vehicle body and configured to form an air passage through which air discharged from the battery case flows into a trunk, and a connection duct installed to supply the air discharged from the battery case to the air passage formed by the longitudinal vehicle body member.

Abstract: A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.

Abstract: A fuel cell electric vehicle includes: a motor, a fuel cell stack and an integrated controller, which are accommodated in a PE room provided in a front of a vehicle body; a battery assembly including a high-voltage battery electrically connected to the motor and the fuel cell stack, and a low-voltage battery for supplying electric power to a vehicle electrical part; an IDC that is mounted between the PE room and the battery assembly, and electrically connects the high-voltage battery to the motor and the fuel cell stack; and a plurality of hydrogen tanks that is mounted at a rear of the battery assembly and below the vehicle body. In particular, the battery assembly is mounted at a rear of the PE room and below the vehicle body, and the IDC converts power of the high-voltage battery to be supplied to the low-voltage battery.

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

Abstract: Proposed is an electric mobility vehicle in which material cost is reduced by simplifying the structure for cooling a battery module and a sealing structure. The electric mobility vehicle is capable of increasing sealing performance since an inflow path of moisture from outside is reduced, and securing desired battery cooling performance.

Abstract: A vehicle battery pack mounting structure includes: a coupling bolt coupled to a vehicle body through a battery pack; a mounting bushing accommodating the coupling bolt therein and coupled to the battery pack; a lower fixation nut fixing a lower portion of the mounting bushing to the lower casing; an upper fixation nut fixing an upper portion of the mounting bushing to the upper cover; and a lower sealing member. The lower sealing member is configured to seal between the mounting bushing and the lower casing in response to fastening of the lower fixation nut. In addition, the vehicle battery pack mounting structure further includes an upper sealing member configured to seal between the mounting bushing and the upper cover in response to fastening of the upper fixation nut. The vehicle battery pack mounting structure also includes a vehicle body side sealing member sealing between the upper fixation nut and the vehicle body in response to the fastening of the coupling bolt.

Abstract: A battery system of a vehicle includes: a housing which is provided between both side members of a vehicle body and arranged in a front portion or a rear portion of the vehicle; and forms an inner space; a battery and a relay provided in the inner space of the housing; and a power connector and a communication connector electrically connected to the battery and the relay and provided in a front surface portion or a rear surface portion of side surfaces of the housing.

Abstract: The present disclosure relates to a chalcogenide material including germanium (Ge) with a first atomic percent, selenium (Se) with a second atomic percent that is at least twice the first atomic percent of the germanium, and indium (In) with a third atomic percent less the first atomic percent of the germanium.

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

Abstract: The present embodiment relates to a lens driving device comprising: a lens barrel; a lens disposed in the lens barrel; and a driving unit disposed in the lens barrel, wherein: the driving unit includes a piezoelectric element expanding or contracting in a direction perpendicular to an optical axis direction of the lens when a voltage is applied thereto, a first member disposed on the piezoelectric element, and a second member coupled to the first member and disposed in the lens barrel; the lens barrel moves in the optical axis direction of the lens when the voltage is applied to the piezoelectric element; and a first length in the lengthwise direction of the first member is shorter than a second length in the lengthwise direction of the second member.

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

Abstract: A flexible circuit board includes a substrate a, a wiring pattern layer provided on the first surface of the substrate, a plating layer provided on the wiring pattern layer and including an open area, and a protective layer that contacts parts of the wiring pattern layer, the plating layer, and the substrate. The protective layer has a larger thickness than a thickness of the plating layer. The first protective layer includes a first overlapping region in which the plating layer and protective layer are in contact with each and a second overlapping region in which the plating layer and the protective layer are in contact with each other. A width of the first overlapping region may be different from a width of the second overlapping region, and each of the widths of the first and second overlapping regions is larger than a thickness of the plating layer.

Abstract: A semiconductor device includes a stack structure including first electrodes and insulating layers alternately stacked on each other, a second electrode passing through the stack structure, and variable resistance patterns each interposed between the second electrode and a corresponding one of the first electrodes. Each of the first electrodes includes a first sidewall facing the second electrode, and each of the insulating layers includes a second sidewall facing the second electrode. At least a part of each of the variable resistance patterns protrudes farther towards the second electrode than the second sidewall.

Abstract: A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.

Abstract: A flexible printed circuit board according to an embodiment includes: a substrate; and a circuit pattern disposed on the substrate, wherein the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of third circuit patterns, wherein the third circuit pattern includes a third-first pad portion, a third-second pad portion, and a third wiring portion connecting the third-first pad portion and the third-second pad portion, a plurality of fourth wiring portions are disposed between a plurality of third wiring portions, a line width of the third wiring portion is greater than a line width of the fourth wiring portion, and a distance between the third wiring portion and the fourth wiring portion adjacent to the third wiring portion is greater than a distance between the fourth wiring portions.

Abstract: A battery case mounting structure for an electric vehicle includes: a vehicle body floor in which a plurality of seats are installed; a battery case provided below the vehicle body floor, having a battery module therein, and including an air inlet, through which air is suctioned, disposed on a rear side of the battery case, and an air outlet, through which air is discharged, disposed on a front side of the battery case; an intake duct configured to communicate with the air inlet at an upper portion of the vehicle body floor and guide interior air to an interior of the battery case; and a discharge duct configured to communicate with the air outlet at the upper portion of the vehicle body floor, extending from the upper portion of the vehicle floor to a rear side of the vehicle body floor, and configured to discharge air to outside.

Abstract: A smart IC substrate according to an embodiment includes: a substrate including one surface and the other surface; a circuit pattern and a connection circuit pattern disposed on the one surface; and a coil pattern disposed on the other surface, wherein a chip mounting region is formed on the other surface, the coil pattern is electrically connected to a first terminal and a second terminal, the substrate includes a first region disposed inside the coil pattern and a second region disposed outside the coil pattern, the first terminal is disposed in the first region, the second terminal is disposed in the second region, a first via is formed in the first region corresponding to the circuit pattern of the substrate, a second via is formed in the second region of the substrate, a third via is formed in the first region corresponding to the connection circuit pattern of the substrate, and a connection member is disposed inside the second via.

Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

Abstract: A flexible circuit board for a chip on film according to an embodiment includes: a substrate including a first surface and a second surface opposite to the first surface and including a chip mounting region; a circuit pattern layer disposed on the first surface; and a heat dissipation part disposed in the chip mounting region, wherein the substrate is formed with at least two or more holes that are formed in a region overlapping the heat dissipation part, and the heat dissipation part includes: a heat dissipation pattern layer disposed on the first surface; a connection layer disposed inside the hole; and a heat dissipation layer disposed on the second surface.

Abstract: A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.