Patents by Inventor Jun Zeng

Jun Zeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210291456
    Abstract: A control and feedback technique to determine the proper location of powder control temperature regions includes detecting solid parts having specified shape and thermal characteristics. The solid parts are generated by a 3D printer. The solid parts include powder material fused on a layer by layer basis. A powder control temperature region is selected in each layer of powder material, wherein the region is located in unfused powder material adjacent to the solid parts, and wherein the region is selected based on characteristics of the shape of a build area and thermal imaging associated with any of a structural formation of the solid parts adjacent to the region, and an amount of thermal energy radiated by the solid parts adjacent to the region. The amount of thermal energy to cause fusing of the powder material on each subsequent layer is modified based on location of the powder control temperature region.
    Type: Application
    Filed: April 19, 2017
    Publication date: September 23, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Sunil Kothari, Tod Heiles, Juan Carlos Salazar, Goffril Obegi, Jun Zeng, Gary J. Dispoto
  • Publication number: 20210283850
    Abstract: In an example of a method for parts packing, at least one part to be printed is identified. A placement and an orientation of the at least one identified part in a build volume of a three-dimensional (3D) printer is determined that optimizes a thermal uniformity inside the build volume.
    Type: Application
    Filed: December 15, 2017
    Publication date: September 16, 2021
    Inventors: Jun Zeng, David James Tucker
  • Publication number: 20210276270
    Abstract: Examples of methods for monitoring additive manufacturing by an electronic device are described herein. In some examples, a predicted thermal image is calculated for a layer. In some examples, a captured thermal image is obtained for the layer. In some examples, a risk score is calculated for the layer based on the predicted thermal image and the captured thermal image. In some examples, a mitigation operation is performed in response to determining that the risk score is outside of a threshold range.
    Type: Application
    Filed: October 29, 2018
    Publication date: September 9, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Jun Zeng
  • Patent number: 11091466
    Abstract: This application relates to chemical compounds which may act as inhibitors of, or which may otherwise modulate the activity of, PCSK9, or a pharmaceutically acceptable salt, solvate, prodrug or polymorph thereof, and to compositions and formulations comprising such compounds, and methods of using and making such compounds. Compounds include comprising of Formula (I): (I) wherein A, D and Q are described herein.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: August 17, 2021
    Assignee: CARDIO THERAPEUTICS PTY LTD
    Inventors: Herbert Treutlein, Jun Zeng, Ian Dixon, Ian James, James T. Palmer
  • Publication number: 20210247735
    Abstract: Examples of methods for thermal mapping by an electronic device are described herein. In some examples, a map is obtained. In some examples, a first thermal image at a first resolution is obtained. In some examples, a neural network is used to determine a second thermal image at a second resolution based on the map and the first thermal image. The second resolution is greater than the first resolution in some examples.
    Type: Application
    Filed: October 29, 2018
    Publication date: August 12, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Jun Zeng
  • Patent number: 11059229
    Abstract: In some examples, a request to print a first three-dimensional (3D) part is received. In response to determining that the first 3D part is not similar to any 3D part referred to by an information base, a representation of the first 3D part is extracted, an indication to conduct an operation to produce a design rule for the first 3D part is sent. In response to determining that the first 3D part is similar to a matching 3D part referred to by the information base, a design rule for the matching 3D part is retrieved to print the first 3D part, where the design rule for the matching 3D part specifies a dependency of a property of the matching 3D part on an aspect associated with printing the matching 3D part.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: July 13, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sunil Kothari, Jun Zeng, Kristopher Li, Goffril Obegi, Lihua Zhao, Gary J. Dispoto, Viseth Sean, Tod Heiles
  • Publication number: 20210197479
    Abstract: In an example, a method includes receiving, at a processor, object model data representing at least a portion of an object to be generated by an additive manufacturing apparatus by fusing build material. Using a processor and from the object model data, a property diffusion model for the object in object generation may be determined. Using a processor and based on the property diffusion model, a manufacturing boundary object shell around the object and encompassing an external volume may be determined. The shell may have a variable thickness determined so as to include build material for which, in generation of the object, the property modelled in the property diffusion model has a value which is predicted to conform to a predetermined parameter.
    Type: Application
    Filed: March 29, 2017
    Publication date: July 1, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Pol FORNOS, Luis GARCIA, Jun ZENG
  • Publication number: 20210197489
    Abstract: According to examples, a three-dimensional (3D) fabrication system may include fabrication components and a controller. The controller may control the fabrication components to fabricate parts of a 3D object in a build envelope, the parts to be assembled together to form the object, and in which the parts are fabricated at locations corresponding to relative positions of the parts with respect to each other in the assembled object. The controller may also control the fabrication components to fabricate a cage around the parts in the build envelope.
    Type: Application
    Filed: October 31, 2017
    Publication date: July 1, 2021
    Applicants: Hewlett-Packard Development Company, L.P., Instituto AtlÄntico
    Inventors: Marcelo Aita Riss, Alyne Gomes Soares Cantal, Thiago Barbosa Lima De Moura, Ana Patricia Del Angel, Jun Zeng, Scott White, Sebastia Cortes I Herms
  • Publication number: 20210200187
    Abstract: Examples of a thermal behavior prediction method are described herein. In some examples of the thermal behavior prediction method, a predicted heat map of a layer corresponding to a three-dimensional (3D) model is computed using at least one neural network. The predicted heat map is computed based on a contone map corresponding to the 3D model.
    Type: Application
    Filed: December 13, 2017
    Publication date: July 1, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, He Luan
  • Patent number: 11050655
    Abstract: A provider edge device and a cloud controller are provided. The provider edge device receives route information associated with a virtual private cloud, and sends the route information to the cloud controller. In response to receiving the route information from the provider edge device, the cloud controller distributes the route information to one or more other provider edge devices of the cloud network of the service provider that includes the provider edge device.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: June 29, 2021
    Assignee: Alibaba Group Holding Limited
    Inventors: Jun Zeng, Li Han, Gang Cheng
  • Patent number: 11043042
    Abstract: According to an example, a processing device may slice a 3D model along a first direction to generate a plurality of layers in parallel planes defined across a second direction and a third direction, in which each of the plurality of layers is composed of respective polygons representing portions of the 3D model. The plurality of layers may be partitioned into a plurality of stacked boxes containing the respective polygons and for each stacked box of the plurality of stacked boxes, the polygons in the stacked box may be assembled into a superset polygon and the superset polygon may be partitioned into bounding shapes. A shape profile of the 3D object may be generated using the bounding shapes.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: June 22, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ana Patricia Del Angel, Jun Zeng, Sebastia Cortes i Herms, Scott White
  • Publication number: 20210175348
    Abstract: Methods and systems for power semiconductor devices integrating multiple quasi-vertical transistors on a single chip. Multiple power transistors (or active regions) are paralleled, but one transistor has a lower threshold voltage. This reduces the voltage drop when the transistor is forward-biased. In an alternative embodiment, the power device with lower threshold voltage is simply connected as a depletion diode, to thereby shunt the body diodes of the active transistors, without affecting turn-on and ON-state behavior.
    Type: Application
    Filed: July 20, 2020
    Publication date: June 10, 2021
    Applicant: MaxPower Semiconductor Inc.
    Inventors: Mohamed N. Darwish, Jun Zeng, Richard A. Blanchard
  • Patent number: 11032258
    Abstract: In one example, a resource system includes a local compute resource, an authorization engine to authorize a resource request to the local compute resource from a source, an interface engine to assign a data property to the local compute resource in response to a determination that the resource request is authorized to access the local compute resource, and a manager engine to assign access of the local compute resource to the resource request based on a comparison of the data property and an access term associated with an authorization level of the resource request.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: June 8, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Patrick O Sandfort, Holt Mebane, Jun Zeng
  • Publication number: 20210162659
    Abstract: A method of packing a three-dimensional (3D) build bed includes, with a shape-based packing module, and for a number of iterations, selecting two parts from a plurality of parts within a parts list, and minimizing a volume of a composite bounding box that encloses both parts. The method may also include determining abounding box reduction ratio (BBRR) by computing the volume of the composite bounding box divided by a sum of the volumes of a first bounding box enclosing a first part of the two parts and a second bonding box enclosing a second part of the two parts, and, in response to a determination that the BBRR is lower than a threshold value, combining the two parts to form a composite part.
    Type: Application
    Filed: August 17, 2018
    Publication date: June 3, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: David Woodlock, David Tucker, Jun Zeng
  • Publication number: 20210150343
    Abstract: A system includes a machine readable storage medium storing instructions and a processor. The processor is to execute instructions to receive contone agent maps of a three-dimensional (3D) part and sensed thermal maps from the 3D printing of the 3D part on a 3D printer. The processor is to execute instructions to generate layer sequences including the contone agent maps and the sensed thermal map for each layer of the 3D part. The processor is to execute instructions to select training samples from the layer sequences having temperature intensity variations within each layer or between neighboring layers. The processor is to execute instructions to train a neural network using the training samples to generate a model to predict thermal behavior in the 3D printer.
    Type: Application
    Filed: August 10, 2018
    Publication date: May 20, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: HE LUAN, Jun Zeng
  • Patent number: 11010635
    Abstract: A method for processing electronic data includes the steps of transforming the electronic data to a matrix representation including a plurality of matrices; decomposing the matrix representation into a series of matrix approximations; and processing, with an approximation process, the plurality of matrices thereby obtaining a low-rank approximation of the plurality of matrices.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: May 18, 2021
    Assignee: City University of Hong Kong
    Inventors: Hing Cheung So, Wen-Jun Zeng, Jiayi Chen, Abdelhak M. Zoubir
  • Publication number: 20210141936
    Abstract: In an example, a collection of compute resources corresponding to a class of devices is identified with a request and a synthesis routine is performed via a number of destinations corresponding to the class of devices. In an example, a type of compute resource to use with an operation of a request is determined, a device with the type of compute resource determined for the operation of the request is identified; the identified device performs the operation of the request within a bounds of a policy, and a result of the operation is communicated to a remote storage location.
    Type: Application
    Filed: January 11, 2021
    Publication date: May 13, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Patrick O. Sandfort, Holt Mebane, Jun Zeng
  • Publication number: 20210083061
    Abstract: A vertical transistor structure in which a recessed field plate trench surrounds multiple adjacent gate electrodes. Thus the specific on-state conductance is increased, since the ratio of recessed field plate area to channel area is reduced. Various versions use two, three, or more distinct gate electrodes within the interior of a single RFP or RSFP trench's layout.
    Type: Application
    Filed: August 12, 2020
    Publication date: March 18, 2021
    Applicant: MaxPower Semiconductor Inc.
    Inventors: Mohamed N. Darwish, Jun Zeng, Richard A. Blanchard
  • Publication number: 20210056426
    Abstract: An example system includes a kernel generation engine. The kernel generation engine is to generate a plurality of kernels based on a description of a physical state. The plurality of kernels are generated based on applying a neural network to the description of the physical state. The system includes a calculation engine to apply the plurality of kernels to the description of the physical state to produce a plurality of intermediate descriptions. The system includes a weighting engine to determine a plurality of weight maps based on the plurality of kernels. The system includes a compositing engine to apply the plurality of weight maps to the plurality of intermediate descriptions to produce weighted intermediate descriptions and to combine the weighted intermediate descriptions to produce an updated description of the physical state.
    Type: Application
    Filed: March 26, 2018
    Publication date: February 25, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Jun Zeng
  • Patent number: 10922379
    Abstract: A method for processing electronic data includes the steps of transforming the electronic data to a matrix representation including a plurality of matrices; decomposing the matrix representation into a series of matrix approximations; and processing, with an approximation process, the plurality of matrices thereby obtaining a low-rank approximation of the plurality of matrices.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: February 16, 2021
    Assignee: City University of Hong Kong
    Inventors: Hing Cheung So, Wen-Jun Zeng, Jiayi Chen, Abdelhak M. Zoubir