Patents by Inventor Jun Zeng

Jun Zeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210402696
    Abstract: According to an example, an apparatus may include a printhead to deliver a printing liquid from firing chambers through a plurality of bores arranged along a surface of the printhead. The apparatus may also include a cleaning system to apply a pressurized cleaning fluid onto the surface of the printhead while preventing application of the pressurized cleaning fluid into the firing chambers through the plurality of bores.
    Type: Application
    Filed: September 10, 2021
    Publication date: December 30, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Ning Ge, Steven J. Simske, Jun Zeng
  • Publication number: 20210387419
    Abstract: In one example in accordance with the present disclosure, a method is described. According to the method, profile information is acquired for a layer of a volume of build material in an additive manufacturing system. From the profile information, a per thermal voxel attribute of build material particles is approximated. An operation of the additive manufacturing system is adjusted based on an approximated per thermal voxel attribute.
    Type: Application
    Filed: August 9, 2018
    Publication date: December 16, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chandrakant Patel, Jun Zeng
  • Publication number: 20210387262
    Abstract: Examples of methods for part packing based on agent usage are described herein. In some examples, a method includes or methods include determining an agent usage for each of a plurality of packings. In some examples, the method includes or methods include selecting a packing from the plurality of packings based on the agent usages.
    Type: Application
    Filed: December 11, 2018
    Publication date: December 16, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Juan Carlos Catana Salazar, Ismael Femandez Aymerich, David Ramirez Muela, Jun Zeng
  • Publication number: 20210365017
    Abstract: 3-D printing batch analysis is disclosed. A disclosed example apparatus includes a processor to generate a plurality of batches, wherein each of the batches represent an arrangement of a plurality of parts to be printed in a volume, discretize the batches into slices, and determine risk values of the slices based on the respective geometric primitives. The processor is to also determine aggregate risk values corresponding to the batches based on the risk values of the slices of the respective batches, and select a batch of the plurality of batches based on the aggregate risk values. The example apparatus also includes a printer to print the selected batch in the volume.
    Type: Application
    Filed: April 27, 2018
    Publication date: November 25, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Juan Carlos Catana, Sam A. Stodder
  • Publication number: 20210349428
    Abstract: Examples of methods for object manufacturing visualization by an electronic device are described herein. In some examples, a predicted thermal image of additive manufacturing is determined using a machine learning model. In some examples, a captured thermal image is obtained. In some examples, a graphical overlay of the predicted thermal image with the captured thermal image is presented.
    Type: Application
    Filed: December 12, 2018
    Publication date: November 11, 2021
    Applicants: Hewlett-Packard Development Company, L.P., INSTITUTO ATLANTICO
    Inventors: Marcelo Aita Riss, Alyne Gomes Soares Cantal, He Luan, Jun Zeng, Scott Alan White, Sebastia Cortes i Herms, Nailson Boaz Costa Leite, Brian Schmitz Tani
  • Publication number: 20210331406
    Abstract: A printing device for adapting a printing parameter in relation to the height of a layer of material deposited during an additive manufacturing process is disclosed. The printing device comprises a printing component to deposit a layer of material that is to be solidified so as to form at least a portion of an object, a controller to determine the height of the layer of material at various positions across the layer and to select voxels of a data model of the object, the selected voxels correspond to the height of the layer of material at said various positions, and the controller is further to use the selected voxels as input for calculating a printing parameter.
    Type: Application
    Filed: July 23, 2018
    Publication date: October 28, 2021
    Inventors: Jordi Roca Vila, Sergio Gonzalez Martin, Daniel Mosher, David A. Champion, Jun Zeng
  • Patent number: 11147797
    Abstract: The invention provides photodynamic therapeutic compounds and photodynamic methods of treatment. The photodynamic therapeutic compounds may be activated by long wavelength light. The photo-activation by long wavelength light may allow improved tissue penetration. The compounds are selected from the group consisting of compounds of formula (i), or a pharmaceutically acceptable salt thereof: formula (i) wherein PDC is a photodynamic core and wherein R1; R2; R3; and R4 are H, phenyl, pyridine-4-yl, methylpyridinium, N-methylpyridinium-3-yl; 2-phenyl-N-methylpyridinium-4-yl, 3-phenyl-N-methylpyridinium-4-yl, 4-phenyl-N-methylpyridinium-4-yl, 2-phenyl-N-methylpyridinium-3-yl, 3-phenyl-N-methylpyridinium-3-yl or 4-phenyl-N-methylpyridinium-3-yl; and wherein any one or more of R1, R2, R3 and R4 may be optionally substituted.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: October 19, 2021
    Assignee: SALT AND LIGHT PHARMACEUTICALS PTY. LTD.
    Inventors: Jun Zeng, Xinyu Tang, James T Palmer
  • Publication number: 20210309615
    Abstract: The present invention relates to phenyl amino pyrimidine compounds which are inhibitors of protein kinases including JAK kinases. In particular the compounds are selective for JAK2 kinases. The kinase inhibitors can be used in the treatment of kinase associated diseases such as immunological and inflammatory diseases including organ transplants; hyperproliferative diseases including cancer and myeloproliferative diseases; viral diseases; metabolic diseases; and vascular diseases.
    Type: Application
    Filed: December 7, 2015
    Publication date: October 7, 2021
    Inventors: Christopher John Burns, Andrew Craig Donohue, John Thomas Feutrill, Thao Lien Thi Nguyen, Andrew Frederick Wilks, Jun Zeng
  • Patent number: 11135775
    Abstract: According to an example, an apparatus may include a printhead to deliver a printing liquid from firing chambers through a plurality of bores arranged along a surface of the printhead. The apparatus may also include a cleaning system to apply a pressurized cleaning fluid onto the surface of the printhead while preventing application of the pressurized cleaning fluid into the firing chambers through the plurality of bores.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: October 5, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ning Ge, Steven J. Simske, Jun Zeng
  • Publication number: 20210291456
    Abstract: A control and feedback technique to determine the proper location of powder control temperature regions includes detecting solid parts having specified shape and thermal characteristics. The solid parts are generated by a 3D printer. The solid parts include powder material fused on a layer by layer basis. A powder control temperature region is selected in each layer of powder material, wherein the region is located in unfused powder material adjacent to the solid parts, and wherein the region is selected based on characteristics of the shape of a build area and thermal imaging associated with any of a structural formation of the solid parts adjacent to the region, and an amount of thermal energy radiated by the solid parts adjacent to the region. The amount of thermal energy to cause fusing of the powder material on each subsequent layer is modified based on location of the powder control temperature region.
    Type: Application
    Filed: April 19, 2017
    Publication date: September 23, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Sunil Kothari, Tod Heiles, Juan Carlos Salazar, Goffril Obegi, Jun Zeng, Gary J. Dispoto
  • Publication number: 20210283850
    Abstract: In an example of a method for parts packing, at least one part to be printed is identified. A placement and an orientation of the at least one identified part in a build volume of a three-dimensional (3D) printer is determined that optimizes a thermal uniformity inside the build volume.
    Type: Application
    Filed: December 15, 2017
    Publication date: September 16, 2021
    Inventors: Jun Zeng, David James Tucker
  • Publication number: 20210276270
    Abstract: Examples of methods for monitoring additive manufacturing by an electronic device are described herein. In some examples, a predicted thermal image is calculated for a layer. In some examples, a captured thermal image is obtained for the layer. In some examples, a risk score is calculated for the layer based on the predicted thermal image and the captured thermal image. In some examples, a mitigation operation is performed in response to determining that the risk score is outside of a threshold range.
    Type: Application
    Filed: October 29, 2018
    Publication date: September 9, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Jun Zeng
  • Patent number: 11091466
    Abstract: This application relates to chemical compounds which may act as inhibitors of, or which may otherwise modulate the activity of, PCSK9, or a pharmaceutically acceptable salt, solvate, prodrug or polymorph thereof, and to compositions and formulations comprising such compounds, and methods of using and making such compounds. Compounds include comprising of Formula (I): (I) wherein A, D and Q are described herein.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: August 17, 2021
    Assignee: CARDIO THERAPEUTICS PTY LTD
    Inventors: Herbert Treutlein, Jun Zeng, Ian Dixon, Ian James, James T. Palmer
  • Publication number: 20210247735
    Abstract: Examples of methods for thermal mapping by an electronic device are described herein. In some examples, a map is obtained. In some examples, a first thermal image at a first resolution is obtained. In some examples, a neural network is used to determine a second thermal image at a second resolution based on the map and the first thermal image. The second resolution is greater than the first resolution in some examples.
    Type: Application
    Filed: October 29, 2018
    Publication date: August 12, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Jun Zeng
  • Patent number: 11059229
    Abstract: In some examples, a request to print a first three-dimensional (3D) part is received. In response to determining that the first 3D part is not similar to any 3D part referred to by an information base, a representation of the first 3D part is extracted, an indication to conduct an operation to produce a design rule for the first 3D part is sent. In response to determining that the first 3D part is similar to a matching 3D part referred to by the information base, a design rule for the matching 3D part is retrieved to print the first 3D part, where the design rule for the matching 3D part specifies a dependency of a property of the matching 3D part on an aspect associated with printing the matching 3D part.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: July 13, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sunil Kothari, Jun Zeng, Kristopher Li, Goffril Obegi, Lihua Zhao, Gary J. Dispoto, Viseth Sean, Tod Heiles
  • Publication number: 20210200187
    Abstract: Examples of a thermal behavior prediction method are described herein. In some examples of the thermal behavior prediction method, a predicted heat map of a layer corresponding to a three-dimensional (3D) model is computed using at least one neural network. The predicted heat map is computed based on a contone map corresponding to the 3D model.
    Type: Application
    Filed: December 13, 2017
    Publication date: July 1, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, He Luan
  • Publication number: 20210197489
    Abstract: According to examples, a three-dimensional (3D) fabrication system may include fabrication components and a controller. The controller may control the fabrication components to fabricate parts of a 3D object in a build envelope, the parts to be assembled together to form the object, and in which the parts are fabricated at locations corresponding to relative positions of the parts with respect to each other in the assembled object. The controller may also control the fabrication components to fabricate a cage around the parts in the build envelope.
    Type: Application
    Filed: October 31, 2017
    Publication date: July 1, 2021
    Applicants: Hewlett-Packard Development Company, L.P., Instituto AtlÄntico
    Inventors: Marcelo Aita Riss, Alyne Gomes Soares Cantal, Thiago Barbosa Lima De Moura, Ana Patricia Del Angel, Jun Zeng, Scott White, Sebastia Cortes I Herms
  • Publication number: 20210197479
    Abstract: In an example, a method includes receiving, at a processor, object model data representing at least a portion of an object to be generated by an additive manufacturing apparatus by fusing build material. Using a processor and from the object model data, a property diffusion model for the object in object generation may be determined. Using a processor and based on the property diffusion model, a manufacturing boundary object shell around the object and encompassing an external volume may be determined. The shell may have a variable thickness determined so as to include build material for which, in generation of the object, the property modelled in the property diffusion model has a value which is predicted to conform to a predetermined parameter.
    Type: Application
    Filed: March 29, 2017
    Publication date: July 1, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Pol FORNOS, Luis GARCIA, Jun ZENG
  • Patent number: 11050655
    Abstract: A provider edge device and a cloud controller are provided. The provider edge device receives route information associated with a virtual private cloud, and sends the route information to the cloud controller. In response to receiving the route information from the provider edge device, the cloud controller distributes the route information to one or more other provider edge devices of the cloud network of the service provider that includes the provider edge device.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: June 29, 2021
    Assignee: Alibaba Group Holding Limited
    Inventors: Jun Zeng, Li Han, Gang Cheng
  • Patent number: 11043042
    Abstract: According to an example, a processing device may slice a 3D model along a first direction to generate a plurality of layers in parallel planes defined across a second direction and a third direction, in which each of the plurality of layers is composed of respective polygons representing portions of the 3D model. The plurality of layers may be partitioned into a plurality of stacked boxes containing the respective polygons and for each stacked box of the plurality of stacked boxes, the polygons in the stacked box may be assembled into a superset polygon and the superset polygon may be partitioned into bounding shapes. A shape profile of the 3D object may be generated using the bounding shapes.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: June 22, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ana Patricia Del Angel, Jun Zeng, Sebastia Cortes i Herms, Scott White