Abstract: A vehicle operating apparatus is provided. The vehicle operating apparatus includes a memory configured to store data generated in association with an operation of a vehicle, and a processor configured to perform communication connection to a first external device, determine a first authorization level of the first external device, determine a second authorization level corresponding to a task according to characteristics of the task for performing the operation of the vehicle, and assign the task to a second external device corresponding to the second authorization level.

Abstract: An image blending apparatus and method thereof are provided. The image blending apparatus includes an image providing module providing a first image with a first overlap region and a second image with a second overlap region, and an image blending module generating a first gradient image of the first image and a second gradient image of the second image, calculating first distance weights of first pixels in the first overlap region of the first gradient image and second distance weights of second pixels in the second overlap region of the second gradient image, blending the first gradient image and the second gradient image into a blended gradient image according to the first distance weights of the first pixels and the second distance weights of the second pixels at respective corresponding positions, and restoring a blended image from the blended gradient image.

Abstract: A composite material of an electrode unit includes: a porous electrode material being 50˜95 wt % of the composite material; an electret material being greater than 0 wt % and less than 15 wt % of the composite material; a dispersant material being 0˜15 wt % of the composite material; an adhesive material being 0˜15 wt % of the composite material; an electric conduction auxiliary agent being greater than 0 wt % and less than 30 wt % of the composite material. The porous electrode material includes porous particles and the electret material is distributed among the porous particles.

Abstract: Provided are an artificial intelligence system for simulating functions and so forth of human brains by using a mechanical learning algorithm. A method, performed by a device, of providing a notification message about a call request may include one or more of receiving the call request from another device, obtaining context information about a situation of a user if a user input accepting the call request is not received within a preset time, determining a reason for a non-response of the user by analyzing the context information, obtaining information about a relationship between the user and another user of the other device, generating a notification message describing the reason for the non-response based on the context information, determining whether to transmit the notification message to the other device based on the reason for the non-response and the information about the relationship, and transmitting the notification message to the other device based on the determination.

Abstract: An example method of providing information of a product includes receiving a user message for purchase of the product via a first chat window, creating a query indicating purchase conditions for purchase of the product by interpreting a meaning of the user message, providing the created query to at least one server, receiving information of the product registered with the at least one server from the at least one server, editing at least a portion of the information, based on the purchase conditions, and providing the edited information via the first chat window.

Abstract: A method includes forming a passivation layer over a portion of a metal pad, forming a polymer layer over the passivation layer, and exposing the polymer layer using a photolithography mask. The photolithography mask has an opaque portion, a transparent portion, and a partial transparent portion. The exposed polymer layer is developed to form an opening, wherein the metal pad is exposed through the opening. A Post-Passivation Interconnect (PPI) is formed over the polymer layer, wherein the PPI includes a portion extending into the opening to connect to the metal pad.

Abstract: An apparatus for identifying a location of a terminal includes a communication unit comprising communication circuitry configured to receive, from the terminal, information corresponding to a signal transmitted from a signal generation module that is activated based on a door opening/closing of a vehicle; and a processor configured to identify the location of the terminal in the vehicle using the received information.

Abstract: A forward osmosis process is provided, which includes separating a feed part and a draw solution part by a semi-permeable film. An ionic liquid is introduced into the draw solution part, and brine is introduced into the feed part. The brine has an osmotic pressure lower than that of the ionic liquid, so that pure water of the brine permeates through the semi-permeable film, enters the draw solution part, and mixes with the ionic liquid to form a draw solution. The draw solution was obtained out of the draw solution part to be left to stand at room temperature, so that the draw solution separated into a water layer and an ionic liquid layer.

Abstract: A container case with locking device which allows tool-free unlocking and access includes a top cover having a latching protrusion, a base with sliding top cover, and a handle assembly fixed on the base. The handle assembly includes a resilient catch plate and a handle portion having an operating portion and an elastic arm. When the operating portion is forced by a thumb or finger, the latching protrusion is released from the elastic arm and the handle portion, and the top cover can slide free. When top cover is replaced, the latching protrusion slides and forces back the catch plate until the latching protrusion is again latched by the catch plate and the handle portion. The handle assembly is on the side plate of the base, operators need to use only one thumb or finger to open the top cover.

Abstract: An integrated circuit includes a bottom substrate, a metal layer disposed over the bottom substrate and a hollow metal pillar disposed on the metal layer. The metal layer and the hollow metal pillar are electrically connected.

Abstract: A method of manufacturing a semiconductor structure include: providing a die including a die pad disposed over the die; disposing a conductive member over the die pad of the die; forming a molding surrounding the die and the conductive member; disposing a dielectric layer over the molding, the die and the conductive member; and forming an interconnect structure including a land portion and a plurality of via portions. The land portion is disposed over the dielectric layer, the plurality of via portions are disposed over the conductive member and protruded from the land portion to the conductive member through the dielectric layer, and each of the plurality of via portions at least partially contacts with the conductive member.

Abstract: An organic light-emitting display device protects a first electrode and reduces any effect due to light leakage from the top or the peripheral side of a bank, thereby increasing lifespan. The organic light-emitting display device includes a first electrode protective pattern.

Abstract: Methods and apparatus are disclosed for manufacturing metal contacts under ground-up contact pads within a device. A device may comprise a bottom metal layer with a bottom metal contact, a top metal layer with a top metal contact, and a plurality of middle metal layers. Any given metal layer of the plurality of middle metal layers comprises a metal contact, the metal contact is substantially vertically below the top metal contact, substantially vertically above the bottom metal contact, and substantially vertically above a metal contact in any metal layer that is below the given metal layer. The metal contacts may be of various and different shapes. All the metal contacts in the plurality of middle metal layers and the bottom metal contact may be smaller than the top metal contact, therefore occupying less area and saving more area for other functions such as device routing.

Abstract: A display device and a method for fabricating the display device are provided. The display device includes a transparent circuit substrate for use as a touch screen, the transparent circuit substrate includes a transparent substrate, a Polymer Dispersed Liquid Crystal (PDLC) coating layer formed on the transparent substrate, an electrode layer provided on the PDLC coating layer, for applying current to the PDLC coating layer, and an insulation layer provided on the electrode layer.

Abstract: A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.

Abstract: Apparatus and techniques for controlling measurement of an electrical parameter of an energy source can be used to obtain information for use in enhancing a power transfer efficiency between the energy source and a load. For example, during a first measurement cycle, information indicative of the electrical parameter of the energy source can be obtained using a measurement circuit during a first sampling duration in which the load is decoupled from the energy source. The information indicative of the obtained electrical parameter can be compared to a threshold. In response to the comparing, a different second sampling duration can be determined for use in obtaining information indicative of the electrical parameter during a subsequent measurement cycle. The information indicative of the electrical parameter of the energy source includes information for use in enhancing the power transfer efficiency between the energy source and the load.

Abstract: An integrated circuit includes a bottom substrate, a metal layer disposed over the bottom substrate and a hollow metal pillar disposed on the metal layer. The metal layer and the hollow metal pillar are electrically connected.

Abstract: A semiconductor structure includes a die including a die pad disposed over the die; a conductive member disposed over and electrically connected with the die pad; a molding surrounding the die and the conductive member; and a redistribution layer (RDL) disposed over the molding, the conductive member and the die, and including a dielectric layer and an interconnect structure, wherein the interconnect structure includes a land portion and a plurality of via portions, the land portion is disposed over the dielectric layer, the plurality of via portions are protruded from the land portion to the conductive member through the dielectric layer, and each of the plurality of via portions at least partially contacts with the conductive member.

Abstract: Methods and apparatus are disclosed for manufacturing metal contacts under ground-up contact pads within a device. A device may comprise a bottom metal layer with a bottom metal contact, a top metal layer with a top metal contact, and a plurality of middle metal layers. Any given metal layer of the plurality of middle metal layers comprises a metal contact, the metal contact is substantially vertically below the top metal contact, substantially vertically above the bottom metal contact, and substantially vertically above a metal contact in any metal layer that is below the given metal layer. The metal contacts may be of various and different shapes. All the metal contacts in the plurality of middle metal layers and the bottom metal contact may be smaller than the top metal contact, therefore occupying less area and saving more area for other functions such as device routing.

Abstract: An integrated circuit includes a bottom substrate, a metal layer disposed over the bottom substrate and a hollow metal pillar disposed on the metal layer. The metal layer and the hollow metal pillar are electrically connected.