Patents by Inventor Jung Chen

Jung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240119473
    Abstract: A rate adjustment method includes a rate estimation model generating a plurality of estimated rates according to a plurality of training data, a revenue estimation model generating an estimated revenue according to the plurality of estimated rates, updating the rate estimation model according to the estimated revenue to generate an updated rate estimation model, and inputting a plurality of current data into the updated rate estimation model to update the plurality of estimated rates.
    Type: Application
    Filed: December 27, 2022
    Publication date: April 11, 2024
    Applicant: DUN-QIAN Intelligent Technology Co., Ltd.
    Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
  • Publication number: 20240120672
    Abstract: A type of electrical connector that replaces the use of a conductive wire with a circuit board for transmitting signals to allow the conductive component of the electrical connector to transmit signals without relying on the conductive wire, addressing the known issue of difficulties in securely positioning the conductive component relative to the conductive wire during the electrical connector manufacturing. This innovation enables automated production of the electrical connector, consequently reducing production costs of the electrical connector.
    Type: Application
    Filed: October 5, 2023
    Publication date: April 11, 2024
    Inventors: YING-CHUNG CHEN, MU-JUNG HUANG
  • Publication number: 20240121896
    Abstract: The present disclosure provides a circuit board including a first circuit layer, a dielectric layer on the first circuit layer, and a seed layer on the dielectric layer and directly contacting the first circuit layer, in which a top surface of the seed layer includes a levelled portion. The circuit board also includes a second circuit layer on the levelled portion of the seed layer, in which a grain boundary density of the second circuit layer is lower than that of a portion of the seed layer directly contacting the first circuit layer.
    Type: Application
    Filed: December 13, 2022
    Publication date: April 11, 2024
    Inventors: Chien Jung CHEN, Jia Hao LIANG, Ching Ku LIN
  • Patent number: 11956730
    Abstract: A system and method for determining a Physical Uplink Control Channel (PUCCH) power control parameter h(nCQI,nHARQ) for two Carrier Aggregated (CA) PUCCH formats—PUCCH format 3 and channel selection. The value of h(nCQI,nHARQ) may be based on only a linear function of nHARQ for both of the CA PUCCH formats. Based on the CA PUCCH format configured for the User Equipment (UE), the e-Node B (eNB) may instruct the UE to select or apply a specific linear function of nHARQ as a value for the power control parameter h(nCQI,nHARQ), so as to enable the UE to more accurately establish transmit power of its PUCCH signal. Values for another PUCCH power control parameter—?F_PUCCH(F)—are also provided for use with PUCCH format 3. A new offset parameter may be signaled for each PUCCH format that has transmit diversity configured.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: April 9, 2024
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Robert Baldemair, Jung-Fu Cheng, Dirk Gerstenberger, Daniel Chen Larsson
  • Patent number: 11955484
    Abstract: A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin and at least one second semiconductor fin. A width of a middle portion of the first semiconductor fin is equal to widths of end portions of the first semiconductor fin. A width of a middle portion of the second semiconductor fin is smaller than widths of end portions of the second semiconductor fin. The insulators are disposed on the semiconductor substrate. The first and second semiconductor fins are sandwiched by the insulators. The gate stacks are over a portion of the first semiconductor fin and a portion of the second semiconductor fin. The first and second S/Ds respectively covers another portion of the first semiconductor fin and another portion of the second semiconductor fin.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Jung Chen, I-Chih Chen, Chih-Mu Huang, Kai-Di Wu, Ming-Feng Lee, Ting-Chun Kuan
  • Patent number: 11953738
    Abstract: The present invention discloses a display including a display panel and a light redirecting film disposed on the viewing side of the display panel. The light redirecting film comprises a light redistribution layer, and a light guide layer disposed on the light redistribution layer. The light redistribution layer includes a plurality of strip-shaped micro prisms extending along a first direction and arranged at intervals and a plurality of diffraction gratings arranged at the bottom of the intervals between the adjacent strip-shaped micro prisms, wherein each of the strip-shaped micro prisms has at least one inclined light-guide surface, and the bottom of each interval has at least one set of diffraction gratings, and the light guide layer is in contact with the strip-shaped micro prisms and the diffraction gratings.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: April 9, 2024
    Assignee: BenQ Materials Corporation
    Inventors: Cyun-Tai Hong, Yu-Da Chen, Hsu-Cheng Cheng, Meng-Chieh Wu, Chuen-Nan Shen, Kuo-Jung Huang, Wei-Jyun Chen, Yu-Jyuan Dai
  • Publication number: 20240114622
    Abstract: An electronic device includes a substrate including a core layer; a cavity formed in the core layer, wherein the cavity includes sidewalls plated with a conductive material; a prefabricated passive electronic component disposed in the cavity; and a cavity sidewall connection providing electrical continuity from the plated cavity sidewalls to a first surface of the substrate and to a second surface of the substrate.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: Kristof Darmawikarta, Srinivas Venkata Ramanuja Pietambaram, Tarek A. Ibrahim, Cary Kuliasha, Siddharth K. Alur, Jung Kyu Han, Beomseok Choi, Russell K. Mortensen, Andrew Collins, Haobo Chen, Brandon C. Marin
  • Patent number: 11949270
    Abstract: A battery module for monitoring and suppressing battery swelling and interacting with a charging device includes a battery cell disposed in a nonconductive housing, a conductive label affixed to the nonconductive housing, a switch, and a controller. The battery cell is charged via a supply voltage from a charging device. The switch is coupled between the battery cell and the conductive label. The controller detects a resistance variation value ?R of the conductive label as result of swelling of the nonconductive housing, and generates a corresponding control voltage. As the resistance of the conductive label increases, the supply voltage may be adjusted downward according to the control voltage. If the resistance variation value ?R conductive label is greater than or equal to a predetermined threshold, the controller closes the switch, and the battery cell may then fully discharge through the conductive label.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: April 2, 2024
    Assignee: ACER INCORPORATED
    Inventors: Shuo-Jung Chou, Chuan-Jung Wang, Chih-Chiang Chen
  • Publication number: 20240102207
    Abstract: A temperature-sensing and humidity-controlling fiber includes a hydrophilic material and a temperature-sensing material. The temperature-sensing material has a lower critical solution temperature (LCST) between 31.2° C. and 32.5° C. when a light transmittance thereof is in a range from 3% to 80%, in which a wavelength of the light is between 450 nm and 550 nm.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Inventors: Wen-Jung CHEN, Wei-Hsiang LIN, Chao-Huei LIU
  • Publication number: 20240103378
    Abstract: The present disclosure provides an extreme ultraviolet (EUV) lithography system including a radiation source and an EUV control system integrated with the radiation source. The EUV control system includes a 3-dimensional diagnostic module (3DDM) designed to collect a laser beam profile of a laser beam from the radiation source in a 3-dimensional (3D) mode, an analysis module designed to analyze the laser beam profile, a database designed to store the laser beam profile, and an EUV control module designed to adjust the radiation source. The analysis module is coupled with the database and the EUV control module. The database is coupled with the 3DDM and the analysis module. The EUV control module is coupled with the analysis module and the radiation source.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 28, 2024
    Inventors: Tai-Yu CHEN, Tzu-Jung PAN, Kuan-Hung CHEN, Sheng-Kang YU, Shang-Chieh CHIEN, Li-Jui CHEN, Heng-Hsin LIU
  • Publication number: 20240105644
    Abstract: A semiconductor die package includes a high dielectric constant (high-k) dielectric layer over a device region of a first semiconductor die that is bonded with a second semiconductor die in a wafer on wafer (WoW) configuration. A through silicon via (TSV) structure may be formed through the device region. The high-k dielectric layer has an intrinsic negative charge polarity that provides a coupling voltage to modify the electric potential in the device region. In particular, the electron carriers in high-k dielectric layer attracts hole charge carriers in device region, which suppresses trap-assist tunnels that result from surface defects formed during etching of the recess for the TSV structure. Accordingly, the high-k dielectric layer described herein reduces the likelihood of (and/or the magnitude of) current leakage in semiconductor devices that are included in the device region of the first semiconductor die.
    Type: Application
    Filed: January 6, 2023
    Publication date: March 28, 2024
    Inventors: Tsung-Hao YEH, Chien Hung LIU, Hsien Jung CHEN, Hsin Heng WANG, Kuo-Ching HUANG
  • Publication number: 20240105239
    Abstract: A memory device having a switching device for a page buffer is provided, and includes a plurality of switching units coupled between a memory cell array and a sense amplification circuit of the page buffer. Each of the plurality of switching units further comprising: a high voltage element and a low voltage element that are connected in series to each other. A first end of the high voltage element is coupled to the sense amplification circuit, and a first end of the low voltage element is coupled to a common source line of the memory cell array. A second end of the high voltage element and a second end of the low voltage element are connected to each other and coupled to a corresponding bit line of the memory cell array. The common source line coupled to each of the plurality of switching units shares a common active region.
    Type: Application
    Filed: September 26, 2022
    Publication date: March 28, 2024
    Applicant: MACRONIX International Co., Ltd.
    Inventors: Jung-Chuan Ting, I-Chen Yang
  • Publication number: 20240104032
    Abstract: The address conversion system includes a storage device, a memory bus, and a processor. The processor is configured to execute the following steps: generating a real buffer on the storage device; generating a fake buffer in a fake capacity of the storage device by a fake buffer algorithm; establishing a coupling relationship between the real buffer and the fake buffer through a coupling algorithm by the coupler of the memory bus; receiving a compressed data from a first device by the real buffer; when a second device wants to read the fake buffer, the coupler guides the second device to the real buffer through the coupling relationship for reading; transmitting the compressed data of the real buffer to the coupler by the memory bus; decompressing the compressed data into a decompressed data by the coupler; and transmitting the decompressed data to the second device by the memory bus.
    Type: Application
    Filed: May 18, 2023
    Publication date: March 28, 2024
    Inventors: Kuo-Jung WU, Yi-Cheng CHEN
  • Patent number: 11944017
    Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes an insulation layer. A bottom electrode via is disposed in the insulation layer. The bottom electrode via includes a conductive portion and a capping layer over the conductive portion. A barrier layer surrounds the bottom electrode via. A magnetic tunneling junction (MTJ) is disposed over the bottom electrode via.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Tai-Yen Peng, Yu-Shu Chen, Chien Chung Huang, Sin-Yi Yang, Chen-Jung Wang, Han-Ting Lin, Jyu-Horng Shieh, Qiang Fu
  • Patent number: 11937932
    Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: March 26, 2024
    Assignees: TAICHUNG VETERANS GENERAL HOSPITAL, TUNGHAI UNIVERSITY
    Inventors: Chieh-Liang Wu, Chun-Te Huang, Cheng-Hsu Chen, Tsai-Jung Wang, Kai-Chih Pai, Chun-Ming Lai, Min-Shian Wang, Ruey-Kai Sheu, Lun-Chi Chen, Yan-Nan Lin, Chien-Lun Liao, Ta-Chun Hung, Chien-Chung Huang, Chia-Tien Hsu, Shang-Feng Tsai
  • Publication number: 20240099150
    Abstract: A method includes forming Magnetic Tunnel Junction (MTJ) stack layers, which includes depositing a bottom electrode layer; depositing a bottom magnetic electrode layer over the bottom electrode layer; depositing a tunnel barrier layer over the bottom magnetic electrode layer; depositing a top magnetic electrode layer over the tunnel barrier layer; and depositing a top electrode layer over the top magnetic electrode layer. The method further includes patterning the MTJ stack layers to form a MTJ; and performing a passivation process on a sidewall of the MTJ to form a protection layer. The passivation process includes reacting sidewall surface portions of the MTJ with a process gas comprising elements selected from the group consisting of oxygen, nitrogen, carbon, and combinations thereof.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Tai-Yen Peng, Yu-Shu Chen, Sin-Yi Yang, Chen-Jung Wang, Chien Chung Huang, Han-Ting Lin, Jyu-Horng Shieh, Qiang Fu
  • Publication number: 20240098896
    Abstract: An electronic device includes a first substrate, a second substrate, plural conductive pads, plural hole structures, plural connection pads and plural conductive structures. Hole structures penetrate through the first and second substrates, and are arranged corresponding to the conductive pads. Second ends of hole structures are located at the second substrate, and the corresponding conductive pad is exposed by one of the second ends. Connection pads enclose first ends of hole structures. Conductive structures are arranged in the hole structures and electrically connected to corresponding conductive pads and connection pads. The second diameter portion of each conductive structure penetrates through first substrate and conductive pad and is electrically connected to corresponding connection pad and conductive pad, and first diameter portion thereof penetrates through second substrate and is electrically connected to corresponding conductive pad.
    Type: Application
    Filed: September 8, 2023
    Publication date: March 21, 2024
    Inventors: Chin-Tang LI, Chao-Jung CHEN
  • Publication number: 20240093024
    Abstract: A polymer is formed by capping a copolymer-graft-polylactone with an alcohol, wherein the copolymer is copolymerized from an anhydride monomer with a double bond, a monomer with a double bond, and an initiator. The polymer can be mixed with an organic solvent and pigment powder to form a dispersion. The dispersion can be mixed with a binder to form a paint.
    Type: Application
    Filed: November 23, 2022
    Publication date: March 21, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cha-Wen CHANG, Jen-Yu CHEN, Wan-Jung TENG, Wen-Pin CHUANG, Ruo-Han YU
  • Publication number: 20240097662
    Abstract: An integrated circuit includes an upper threshold circuit configured to set a logic level of a first enabling signal, a lower threshold circuit configured to set a logic level of a second enabling signal, and a control circuit configured to change an output voltage signal in response to a condition that the logic level of the first enabling signal and the logic level of the second enabling signal are changed consecutively. In the control circuit, a first switch is electrically connected to a second switch at a buffer output node. The control circuit includes a regenerative circuit configured to maintain the output voltage signal at the buffer output node while each of the first switch and the second switch is at a disconnected state.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Yu-Kai TSAI, Chia-Hui CHEN, Chia-Jung CHANG
  • Publication number: 20240098890
    Abstract: An electronic device and an electronic apparatus with a mating structure. The electronic device comprises a first substrate with a first face and a second face opposite to each other, a plural of tiles on the first face and with a second substrate and a patterned layer, a trace layer between the tiles and the first substrates and electrically connected to the patterned layer, and a connection component disposed at a second surface of the first substrate and electrically connected to the trace layer.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 21, 2024
    Inventors: Chao-Jung CHEN, Chin-Tang LI